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Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001237
EISBN: 978-1-62708-170-2
... Abstract Quantitative image analysis has expanded the capabilities of surface analysis significantly with the use of computer technology. This article provides an overview of the quantitative image analysis and optical microscopy. It describes the various steps involved in surface preparation...
Abstract
Quantitative image analysis has expanded the capabilities of surface analysis significantly with the use of computer technology. This article provides an overview of the quantitative image analysis and optical microscopy. It describes the various steps involved in surface preparation of samples prone to abrasion damage and artifacts for quantitative image analysis.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006453
EISBN: 978-1-62708-190-0
... and selective excitation configuration of the signal-generation mechanisms in thermal nondestructive evaluation methods. The three widely used approaches to TNDE are surface-excited thermography, vibrothermography, and thermoelastic stress analysis. The article provides information on the common...
Abstract
Thermal nondestructive evaluation (TNDE) is an indirect process, so that regardless of the form of energy used to excite the sample, interaction with the internal structure of a part occurs through the process of heat conduction. This article discusses the steady-state configuration and selective excitation configuration of the signal-generation mechanisms in thermal nondestructive evaluation methods. The three widely used approaches to TNDE are surface-excited thermography, vibrothermography, and thermoelastic stress analysis. The article provides information on the common features, characteristics, and limitations of these approaches.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006439
EISBN: 978-1-62708-190-0
... Abstract Machine vision, also referred to as computer vision or intelligent vision, is a means of simulating the image recognition and analysis capabilities of the human eye and brain system with digital techniques. The machine vision functionality is extremely useful in inspection, supervision...
Abstract
Machine vision, also referred to as computer vision or intelligent vision, is a means of simulating the image recognition and analysis capabilities of the human eye and brain system with digital techniques. The machine vision functionality is extremely useful in inspection, supervision, and quality control applications. This article presents a variety of machine vision functions for different purposes and provides a comparison of machine and human vision capabilities in a table. It discusses the processes of a machine vision system: image acquisition, image preprocessing, image analysis, and image interpretation. The article provides information on the uses of machine vision systems in three categories of manufacturing applications: visual inspection, identification of parts, and guidance and control applications.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006464
EISBN: 978-1-62708-190-0
... area to generate an image, because they do not require contact with the test piece and can be performed with only single-side access on flat or curved surfaces. In general, SET methods are limited to detection of features where the diameter of the flaw is greater than its depth and the material...
Abstract
For most nondestructive evaluation (NDE) applications, the term thermography actually refers to surface-excited thermography (SET) that involves thermal mapping of surface temperature as heat flows from, to, or through a test object in response to excitation applied to the sample surface. This article discusses the strategies for implementing thermography for NDE, including the steady-state/whole-body approach and transient heat conduction. It describes the most common signal-processing methods, such as thermographic signal reconstruction, lock-in thermography, and pulsed-phase thermography. The article concludes with a discussion on the use of thermal methods for thermal diffusivity measurement and characterization of multilayer structures.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006763
EISBN: 978-1-62708-295-2
... features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews...
Abstract
Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006769
EISBN: 978-1-62708-295-2
... microscopes have been found particularly useful in failure analysis investigations. This is true for a number of reasons, the most prominent being the ability of the SEM to image large, nonflat samples from low to high magnifications (approximately 10× to greater than 100,000×). The ability to obtain in-focus...
Abstract
The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003252
EISBN: 978-1-62708-199-3
.... The scanning electron microscope provides a valuable combination of high resolution imaging, elemental analysis, and recently, crystallographic analysis: Imaging of features as small as ∼10 nm or less, roughly 100 times smaller than can be seen with light microscopes Imaging of rough surfaces...
Abstract
Microstructural analysis is the combined characterization of the morphology, elemental composition, and crystallography of microstructural features through the use of a microscope. This article reviews three types of the most commonly used electron microscopies in metallurgical studies, namely scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy. It briefly describes the operating principles, instrumentation which includes energy dispersive X-ray detectors, spatial resolution, typical use of the techniques, elemental analysis detection threshold and precision, limitations, sample requirements, and the capabilities of related techniques.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006456
EISBN: 978-1-62708-190-0
... also provides information on digital radiography, image processing and analysis, dual-energy imaging, and partial angle imaging, of a CT system. computed tomography digital radiography dual-energy imaging film radiography partial angle imaging real-time radiography X-ray computed tomography...
Abstract
Computed tomography (CT) is an imaging technique that generates a three-dimensional (3-D) volumetric image of a test piece. This article illustrates the basic principles of CT and provides information on the types, applications, and capabilities of CT systems. A comparison of performance characteristics for film radiography, real-time radiography, and X-ray computed tomography is presented in a table. A functional block diagram of a typical computed tomography system is provided. The article discusses CT scanning geometry that is used to acquire the necessary transmission data. It also provides information on digital radiography, image processing and analysis, dual-energy imaging, and partial angle imaging, of a CT system.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
... detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described. eddy-current testing liquid penetrant inspection magnetic-particle inspection...
Abstract
Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003253
EISBN: 978-1-62708-199-3
... microscope in Fig. 2–4 of the article “Microstructural Analysis.” A secondary electron detector provides the capability to image the surface and locate areas of particular interest, as in a scanning electron microscope. However, the primary tool for chemical analysis is the Auger electron detector...
Abstract
This article describes the operation and capabilities of surface analysis methods of metals, including scanning electron microscopy, electron probe microanalysis, transmission electron microscopy, secondary ion mass spectroscopy, and X-ray photoelectron spectroscopy. It provides information on the capabilities, typical uses, spatial resolution, elemental analysis detection threshold and precision, limitations, sample requirements, and operating principles of the scanning auger microprobe.
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003249
EISBN: 978-1-62708-199-3
... Analysis,” respectively. Many microstructural and surface characterization techniques, described in the articles “Microstructural Analysis” and “Surface Analysis,” provide a combination of high resolution imaging of the morphologies of small features plus elemental and/or structural characterization...
Abstract
This article provides a general introduction of materials characterization and describes the principles and applications of a limited number of techniques that are most commonly used to characterize the composition and structure of metals used in engineering systems. It briefly describes the classification of materials characterization methods including, bulk elemental characterization, bulk structural characterization, microstructural characterization, and surface characterization. Further, the article reviews the selection of materials characterization methods most commonly used with metals.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006785
EISBN: 978-1-62708-295-2
... fracture at those locations. Stress-corrosion cracks in high-strength steel alloys and martensitic stainless steels can propagate by hydrogen embrittlement. The methodology employed to investigate an SCC failure is the same as for any failure analysis investigation. The general structure of a...
Abstract
Stress-corrosion cracking (SCC) is a form of corrosion and produces wastage in that the stress-corrosion cracks penetrate the cross-sectional thickness of a component over time and deteriorate its mechanical strength. Although there are factors common among the different forms of environmentally induced cracking, this article deals only with SCC of metallic components. It begins by presenting terminology and background of SCC. Then, the general characteristics of SCC and the development of conditions for SCC as well as the stages of SCC are covered. The article provides a brief overview of proposed SCC propagation mechanisms. It discusses the processes involved in diagnosing SCC and the prevention and mitigation of SCC. Several engineering alloys are discussed with respect to their susceptibility to SCC. This includes a description of some of the environmental and metallurgical conditions commonly associated with the development of SCC, although not all, and numerous case studies.
Book: Fractography
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0001838
EISBN: 978-1-62708-181-8
... characteristics, the fractal properties of profiles have also been investigated ( Ref 8 9 ). (The use of fractals is discussed in the article “Particle Image Analysis” in Powder Metal Technologies and Applications, in Volume 7 of the ASM Handbook . The reported experimental results on the fractal behavior...
Abstract
This article discusses the fractal characteristics of fracture surfaces as a means for describing and quantifying irregular, complex curves and surfaces of fractured materials. It describes the important relationship between the profile and surface roughness parameters that yield the surface area of irregular fracture surfaces. The article reviews the experimental procedures required to obtain profiles and measurements that are made. In addition, fractal equations that linearize all the experimental data and provide constant fractal dimensions are presented in the article. Modified fractal dimensions that result from these analyses appear to possess some generality for natural irregular nonplanar surfaces and their profiles.
Series: ASM Handbook
Volume: 23
Publisher: ASM International
Published: 01 June 2012
DOI: 10.31399/asm.hb.v23.a0005657
EISBN: 978-1-62708-198-6
... Abstract This article focuses on the analysis of materials and mechanical- (or biomechanical-) based medical device failures. It reviews the failure analysis practices, including evidence receipt, cleaning, nondestructive examination, destructive examination, exemplars analysis, and device...
Abstract
This article focuses on the analysis of materials and mechanical- (or biomechanical-) based medical device failures. It reviews the failure analysis practices, including evidence receipt, cleaning, nondestructive examination, destructive examination, exemplars analysis, and device redesign. The article examines the common failure modes, such as overload, fatigue, corrosion, hydrogen embrittlement, and fretting, of medical devices. The failure analysis of orthopedic implants, such as permanent prostheses and internal fixation devices, is described. The article reviews the failure mechanisms in some of the more common medical device materials, namely, stainless steels, titanium alloys, cobalt-base alloys, and nitinol. It presents case histories with examples for failure analysis.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006759
EISBN: 978-1-62708-295-2
... chemistry at the micro level. Another technique desirable in failure analysis is combining stereomicroscopic images with scanning electron microscopy to perform further chemical analysis. Laser-induced breakdown spectroscopy within optical microscopes allows for chemical fingerprinting directly from a color...
Abstract
Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006765
EISBN: 978-1-62708-295-2
... structural features of different hardness) must be minimized; otherwise, portions of the image are out of focus at high magnifications. Excessive relief invalidates image analysis measurements and is undesirable for wavelength-dispersive chemical analysis. The surface must be flat, particularly at edges...
Abstract
Metallographic examination is one of the most important procedures used by metallurgists in failure analysis. Typically, the light microscope (LM) is used to assess the nature of the material microstructure and its influence on the failure mechanism. Microstructural examination can be performed with the scanning electron microscope (SEM) over the same magnification range as the LM, but examination with the latter is more efficient. This article describes the major operations in the preparation of metallographic specimens, namely sectioning, mounting, grinding, polishing, and etching. The influence of microstructures on the failure of a material is discussed and examples of such work are given to illustrate the value of light microscopy. In addition, information on heat-treatment-related failures, fabrication-/machining-related failures, and service failures is provided, with examples created using light microscopy.
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006451
EISBN: 978-1-62708-190-0
... it can be assumed that the material being analyzed is isotropic so that Eq 15 is applicable. The IR detectors used for TSA analysis are designed to be sensitive enough to measure the small variations in temperature (Δ T ) caused by cyclic loading. Images typically are captured at relatively high...
Abstract
Thermoelastic stress analysis (TSA) an increasingly popular infrared (IR)-based technique for measuring stress on the surface of a part subjected to time-varying loads. This article begins by providing a theoretical and historical background of thermoelastic stress analysis. It then describes infrared detectors, such as quantum detectors and thermal/nonquantum detectors, for thermoelastic stress analysis. The article discusses the theoretical aspects for producing thermoelastic stress analysis data and the applications amenable to thermoelastic stress analysis. It concludes with information on the qualitative applications of thermoelastic stress analysis.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006660
EISBN: 978-1-62708-213-6
... made the SEM a more complete tool for microstructural characterization by providing the linkage between microstructure and crystallography. When EBSD is combined with other microstructural characterization methods, such as imaging and elemental analysis, it provides a more complete material description...
Abstract
The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006770
EISBN: 978-1-62708-295-2
... instruments, a separate EDS spectrum is obtained for each pixel in the image, so qualitative and quantitative data can be retrieved from the map without performing further analysis. The faster data acquisition of SDDs has greatly improved the efficiency of producing elemental maps, such that mapping is much...
Abstract
X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006675
EISBN: 978-1-62708-213-6
... Abstract This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A...
Abstract
This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.