Quantitative image analysis has expanded the capabilities of surface analysis significantly with the use of computer technology. This article provides an overview of the quantitative image analysis and optical microscopy. It describes the various steps involved in surface preparation of samples prone to abrasion damage and artifacts for quantitative image analysis.

Thermal nondestructive evaluation (TNDE) is an indirect process, so that regardless of the form of energy used to excite the sample, interaction with the internal structure of a part occurs through the process of heat conduction. This article discusses the steady-state configuration and selective excitation configuration of the signal-generation mechanisms in thermal nondestructive evaluation methods. The three widely used approaches to TNDE are surface-excited thermography, vibrothermography, and thermoelastic stress analysis. The article provides information on the common features, characteristics, and limitations of these approaches.

Machine vision, also referred to as computer vision or intelligent vision, is a means of simulating the image recognition and analysis capabilities of the human eye and brain system with digital techniques. The machine vision functionality is extremely useful in inspection, supervision, and quality control applications. This article presents a variety of machine vision functions for different purposes and provides a comparison of machine and human vision capabilities in a table. It discusses the processes of a machine vision system: image acquisition, image preprocessing, image analysis, and image interpretation. The article provides information on the uses of machine vision systems in three categories of manufacturing applications: visual inspection, identification of parts, and guidance and control applications.

For most nondestructive evaluation (NDE) applications, the term thermography actually refers to surface-excited thermography (SET) that involves thermal mapping of surface temperature as heat flows from, to, or through a test object in response to excitation applied to the sample surface. This article discusses the strategies for implementing thermography for NDE, including the steady-state/whole-body approach and transient heat conduction. It describes the most common signal-processing methods, such as thermographic signal reconstruction, lock-in thermography, and pulsed-phase thermography. The article concludes with a discussion on the use of thermal methods for thermal diffusivity measurement and characterization of multilayer structures.

Failure analysis is an investigative process that uses visual observations of features present on a failed component fracture surface combined with component and environmental conditions to determine the root cause of a failure. The primary means of recording the conditions and features observed during a failure analysis investigation is photography. Failure analysis photographic imaging is a combination of both science and art; experience and proper imaging techniques are required to produce an accurate and meaningful fracture surface photograph. This article reviews photographic principles and techniques as applied to failure analysis, both in the field and in the laboratory. The discussion covers the processes involved in field and laboratory photographic documentations, provides a description of professional digital cameras, and gives information on photographic lighting and microscopic photography. Special techniques can be employed to deal with highly reflective conditions and are also described in this article.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

Microstructural analysis is the combined characterization of the morphology, elemental composition, and crystallography of microstructural features through the use of a microscope. This article reviews three types of the most commonly used electron microscopies in metallurgical studies, namely scanning electron microscopy, electron probe microanalysis, and transmission electron microscopy. It briefly describes the operating principles, instrumentation which includes energy dispersive X-ray detectors, spatial resolution, typical use of the techniques, elemental analysis detection threshold and precision, limitations, sample requirements, and the capabilities of related techniques.

Computed tomography (CT) is an imaging technique that generates a three-dimensional (3-D) volumetric image of a test piece. This article illustrates the basic principles of CT and provides information on the types, applications, and capabilities of CT systems. A comparison of performance characteristics for film radiography, real-time radiography, and X-ray computed tomography is presented in a table. A functional block diagram of a typical computed tomography system is provided. The article discusses CT scanning geometry that is used to acquire the necessary transmission data. It also provides information on digital radiography, image processing and analysis, dual-energy imaging, and partial angle imaging, of a CT system.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.

This article describes the operation and capabilities of surface analysis methods of metals, including scanning electron microscopy, electron probe microanalysis, transmission electron microscopy, secondary ion mass spectroscopy, and X-ray photoelectron spectroscopy. It provides information on the capabilities, typical uses, spatial resolution, elemental analysis detection threshold and precision, limitations, sample requirements, and operating principles of the scanning auger microprobe.

This article provides a general introduction of materials characterization and describes the principles and applications of a limited number of techniques that are most commonly used to characterize the composition and structure of metals used in engineering systems. It briefly describes the classification of materials characterization methods including, bulk elemental characterization, bulk structural characterization, microstructural characterization, and surface characterization. Further, the article reviews the selection of materials characterization methods most commonly used with metals.

Stress-corrosion cracking (SCC) is a form of corrosion and produces wastage in that the stress-corrosion cracks penetrate the cross-sectional thickness of a component over time and deteriorate its mechanical strength. Although there are factors common among the different forms of environmentally induced cracking, this article deals only with SCC of metallic components. It begins by presenting terminology and background of SCC. Then, the general characteristics of SCC and the development of conditions for SCC as well as the stages of SCC are covered. The article provides a brief overview of proposed SCC propagation mechanisms. It discusses the processes involved in diagnosing SCC and the prevention and mitigation of SCC. Several engineering alloys are discussed with respect to their susceptibility to SCC. This includes a description of some of the environmental and metallurgical conditions commonly associated with the development of SCC, although not all, and numerous case studies.

This article discusses the fractal characteristics of fracture surfaces as a means for describing and quantifying irregular, complex curves and surfaces of fractured materials. It describes the important relationship between the profile and surface roughness parameters that yield the surface area of irregular fracture surfaces. The article reviews the experimental procedures required to obtain profiles and measurements that are made. In addition, fractal equations that linearize all the experimental data and provide constant fractal dimensions are presented in the article. Modified fractal dimensions that result from these analyses appear to possess some generality for natural irregular nonplanar surfaces and their profiles.

This article focuses on the analysis of materials and mechanical- (or biomechanical-) based medical device failures. It reviews the failure analysis practices, including evidence receipt, cleaning, nondestructive examination, destructive examination, exemplars analysis, and device redesign. The article examines the common failure modes, such as overload, fatigue, corrosion, hydrogen embrittlement, and fretting, of medical devices. The failure analysis of orthopedic implants, such as permanent prostheses and internal fixation devices, is described. The article reviews the failure mechanisms in some of the more common medical device materials, namely, stainless steels, titanium alloys, cobalt-base alloys, and nitinol. It presents case histories with examples for failure analysis.

Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.

Metallographic examination is one of the most important procedures used by metallurgists in failure analysis. Typically, the light microscope (LM) is used to assess the nature of the material microstructure and its influence on the failure mechanism. Microstructural examination can be performed with the scanning electron microscope (SEM) over the same magnification range as the LM, but examination with the latter is more efficient. This article describes the major operations in the preparation of metallographic specimens, namely sectioning, mounting, grinding, polishing, and etching. The influence of microstructures on the failure of a material is discussed and examples of such work are given to illustrate the value of light microscopy. In addition, information on heat-treatment-related failures, fabrication-/machining-related failures, and service failures is provided, with examples created using light microscopy.

Thermoelastic stress analysis (TSA) an increasingly popular infrared (IR)-based technique for measuring stress on the surface of a part subjected to time-varying loads. This article begins by providing a theoretical and historical background of thermoelastic stress analysis. It then describes infrared detectors, such as quantum detectors and thermal/nonquantum detectors, for thermoelastic stress analysis. The article discusses the theoretical aspects for producing thermoelastic stress analysis data and the applications amenable to thermoelastic stress analysis. It concludes with information on the qualitative applications of thermoelastic stress analysis.

The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.

X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.

This article is an overview of the division Surface Analysis of this volume. The division covers various developed surface-analysis techniques, such as scanning probe and atomic force microscopy. The division focuses on the analysis of surface layers that are less than 100 nm. A quick reference summary of surface-analysis methods is presented in this article.