This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article reviews the types of passivity and presents tactics that employ passivity to control corrosion. Thermodynamics provides a guide to the conditions under which passivation becomes possible. A valuable guide to thermodynamics is the potential-pH diagram and the Pourbaix diagram. The article presents a potential-pH diagram for the iron-water system and an illustration of an idealized anodic polarization curve for a metal surface, which serves as a basis for describing the kinetics of passivation. It discusses five properties of passive films: thickness, composition, structure, electronic properties, and mechanical properties. The article outlines three possible processes that can form passive films: direct film formation, dissolution precipitation, and anodic oxidation of metal ions in solution. It describes the breakdown of the passive film using various models and highlighting the effect of alloy composition and structure.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Germanium is a semiconducting metalloid element found in Group IV A. Germanium is used in the field of electronics, infrared optics, and in the fields of gamma ray spectroscopy, catalysis, and fiber optics. This article discusses the sources, manufacturing, and processing of germanium, and focuses on the chemical properties of various germanium compounds, including germanium halides, germanates, germanides, germanes, inorganic, and organogermanium compounds. It also tabulates the physical, thermal, electronic, and optical properties of germanium, and explains the economical aspects and specifications of germanium. The article describes the analytical and test methods of germanium, including gravimetric method, titrimetric method, and spectral method. It provides a short note on toxicology, and concludes with the uses of germanium in different fields.

This article focuses on the analyzing and modeling of stress-strain behavior of polycrystals of pure face-centered cubic (fcc) metals in the range of temperatures and strain rates where diffusion is not important. It presents a phenomenological description of stress-strain behavior and provides information on the physical background, alternative interpretations, and directions of research. The quantitative description of strain hardening of fcc polycrystals is provided. The article also discusses the modeling of stress-strain behavior in body-centered cubic metals, hexagonal metals, stage IV work hardening, and the various classes of single-phase alloys.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.

This article focuses on two streams of the research on part consolidation (PC): PC in the conventional manufacturing context, and PC in the additive manufacturing (AM) context. It reviews the challenges of applying AM-PC potentials. The article includes research literature on the selection of part candidates for consolidation and summarizes the conversion of assembly design to consolidated design. Then, a holistic approach for supporting PC design is introduced with integrated modules of part filtering and fusion of parts. Details of the key techniques of the two modules are later introduced with a gas pedal example. Finally, emerging trends in PC research are discussed.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.

This article is a compilation of definitions for terms related to engineering materials, including plastics, elastomers, polymer-matrix composites, adhesives and sealants, ceramics, ceramic-matrix composites, glasses, and carbon-carbon composites.

Electronic structure methods based on the density functional theory (DFT) are used as a powerful tool for assessing the mechanical thermodynamic and defect properties of metal alloys. This article presents the origins of the electronic structure methods and their strengths and limitations. It describes the basic procedures for calculating essential structural properties in metal alloys. The article reviews the approximations and computational details of the pseudopotential plane wave methods used in metal systems. It provides information on the applications of DFT methods in metal alloy systems. The article discusses the calculations of a variety of structural, thermodynamic, and defect properties, with particular emphasis on structural metal alloys and their derivatives.

The earliest commercial use of carbon fibers is often attributed to Thomas Edison's carbonization of cotton and bamboo fibers for incandescent lamp filaments. This article describes the manufacture of PAN-based carbon fibers and pitch-based carbon fibers. It discusses the properties and characteristics of carbon fibers in terms of axial structure, transverse structure, and interfacial bonding. The article discusses the typical applications of carbon fibers, including aerospace and sporting goods. It concludes with a discussion on anticipated developments in carbon fibers.

The influence of friction and wear on the function and structure of tribological systems is determined by various types of tribological tests. This article introduces the general categories of tribological testing and describes the basic objectives of testing. It reviews the results of tribological tests, where the system-dependent characteristics of friction and wear data can be expressed in different forms, such as tribographs, transition diagrams, and tribomaps. A summary of various methods of surface analysis is presented in a table. The article discusses the relationship between wear and reliability in terms of exponential distribution, Weibull distribution, and gamma distribution. It concludes with information on the effects of interaction on failure probability.

This article presents the following characteristics of pure metals : structure, chemical composition, mass characteristics, thermal properties, electrical properties, chemical properties, magnetic properties, optical properties, fabrication characteristics, nuclear properties, and mechanical properties.

Solid lubricants consist of materials placed at the interface between moving bodies to mitigate friction and wear. This article begins with a historical overview of solid lubricants and discuses the characteristics and fundamental aspects of solid lubricants. It describes the material categories of solid lubricant coatings, including graphite, graphite fluoride, transition metal dichalcogenides, diamond-like-carbon, polymeric materials, and metallic films. The article presents a description of deposition methods from the simplest processes involving burnishing and impingement in open air to modern vacuum-based methods for solid lubricants. It concludes with a discussion on metrics that can be used to qualify solid lubricants in high-consequence applications.

Additive manufacturing (AM) has been adopted as one of the most versatile and rapid design-to-manufacturing approaches for printing a wide range of two- and three-dimensional parts, devices, and complex geometries layer by layer. This article provides insights into the current progress, challenges, and future needs of AM of electronics from the space, defense, biomedical, energy, and industry perspectives.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

Hybrid laser arc welding (HLAW) is a metal joining process that combines laser beam welding (LBW) and arc welding in the same weld pool. This article provides a discussion on the major process variables for two modes of operation of HLAW, namely, stabilization mode and penetration mode. The major process variables for either mode of operation include three sets of welding parameters: the variables for the independent LBW and gas metal arc welding processes and welding variables that are specific to the HLAW process. The article discusses the advantages, limitations, and applications of the HLAW and describes the major components and consumables used for HLAW. The components include the laser source, gas metal arc welding source, hybrid welding head, and motion system. The article also describes the typical sources of defects and safety concerns of HLAW.