This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

This article focuses on the analyzing and modeling of stress-strain behavior of polycrystals of pure face-centered cubic (fcc) metals in the range of temperatures and strain rates where diffusion is not important. It presents a phenomenological description of stress-strain behavior and provides information on the physical background, alternative interpretations, and directions of research. The quantitative description of strain hardening of fcc polycrystals is provided. The article also discusses the modeling of stress-strain behavior in body-centered cubic metals, hexagonal metals, stage IV work hardening, and the various classes of single-phase alloys.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article provides crystallographic and engineering data for single oxide ceramics, zirconia, silicates, mullite, spinels, perovskites, borides, carbides, silicon carbide, boron carbide, tungsten carbide, silicon-nitride ceramics, diamond, and graphite. It includes data on crystal structure, density, mechanical properties, physical properties, electrical properties, thermal properties, and magnetic properties.

A thermosetting resin, or thermoset, is a synthetic organic polymer that cures to a solid, infusible mass by forming a three-dimensional network of covalent chemical bonds. Significant applications include construction and thermoset engineering plastics. This article discusses the general and family characteristics of thermosetting resin families, including allyls, aminos (urea formaldehyde and melamine formaldehyde), cyanates, epoxies, polybenzimidazoles, unsaturated polyesters, thermoset polyimides, phenolics, and vinyl esters. It also explains processing methods, including curing and curing agents. The article provides descriptions of commercial product forms and the wide array of applications of thermosetting resins. It also tabulates the performance properties (mechanical, thermal, electrical and chemical resistance) of some families of unfilled or unreinforced thermosetting resins and reinforced or filled grades.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

Titanium alloys are often used in highly corrosive environments because they are better suited than most other materials. The excellent corrosion resistance is the result of naturally occurring surface oxide films that are stable, uniform, and adherent. This article offers explanations and insights on the most common forms of corrosion observed with titanium alloys, including general corrosion, crevice corrosion, anodic pitting, hydrogen damage, stress-corrosion cracking, galvanic corrosion, corrosion fatigue, and erosion-corrosion. It also provides practical strategies for expanding the useful application range for titanium and includes a comprehensive overview of available corrosion data.

Nanotechnology and smart-coating technologies have been reported to show great promise for improved performance in critical areas such as corrosion resistance, durability, and conductivity. This article exemplifies nanofilms and nanomaterials used in coatings applications, including carbon nanotubes, silica, metals/metal oxides, ceramics, clays, buckyballs, graphene, polymers, titanium dioxide, and waxes. These can be produced by a variety of methods, including chemical vapor deposition, plasma arcing, electrodeposition, sol-gel synthesis, and ball milling. The application of nanotechnology and the development of smart coatings have been dependent largely on the availability of analytical and imaging techniques such as Raman spectroscopy, scanning and transmission electron microscopy, atomic force microscopy, and scanning tunneling microscopy.

Advanced thermoplastics are stiff, moldable plastics that compete with traditional engineering thermoplastics and thermosets owing to their good tensile, compressive, impact, and shear strength, electrical properties, and corrosion resistance. This article discusses commercial forms, family characteristics, properties and applications of the following advanced thermoplastics: homopolymer and copolymer acetals, fluoropolymers, ionomers, polyamides, polyamide-imides, polyarylates, polyketones, polyaryl sulfones, polybutylene terephthalates, polycarbonates, polyether-imides, polyether sulfones, polyethylene terephthalates, thermoplastic polyimides, liquid crystal polymers, polyphenylene ether blends, polyphenylene sulfides, and polysulfones.

This article discusses the basic principles of and chemical effects in Auger electron spectroscopy (AES), covering various factors affecting the quantitative analyses of AES. The discussion covers instrumentation and sophisticated electronics typically used in AES for data acquisition and manipulation and various limitations of AES. Various examples highlighting the capabilities of the technique are also included.

This article reviews the applications of traditional glasses in architecture, transportation, construction, houseware, containers, and fibers. It also describes uses of specialty glasses for aerospace and military applications, biomedical and dental applications, chemical-resistant applications, lighting, information display, electronic processing and electronic devices, optical and ophthalmic products, and communications equipment.

This article describes testing and characterization methods of ceramics for chemical analysis, phase analysis, microstructural analysis, macroscopic property characterization, strength and proof testing, thermophysical property testing, and nondestructive evaluation techniques. Chemical analysis is carried out by X-ray fluorescence spectrometry, atomic absorption spectrophotometry, and plasma-emission spectrophotometry. Phase analysis is done by X-ray diffraction, spectroscopic methods, thermal analysis, and quantitative analysis. Techniques used for microstructural analysis include reflected light microscopy using polarized light, scanning electron microscopy, transmission electron microscopy, energy dispersive analysis of X-rays, and wavelength dispersive analysis of X-rays. Macroscopic property characterization involves measurement of porosity, density, and surface area. The article describes testing methods such as room and high-temperature strength test methods, proof testing, fracture toughness measurement, and hardness and wear testing. It also explains methods for determining thermal expansion, thermal conductivity, heat capacity, and emissivity of ceramics and glass and measurement of these properties as a function of temperature.