This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

This article reviews the types of passivity and presents tactics that employ passivity to control corrosion. Thermodynamics provides a guide to the conditions under which passivation becomes possible. A valuable guide to thermodynamics is the potential-pH diagram and the Pourbaix diagram. The article presents a potential-pH diagram for the iron-water system and an illustration of an idealized anodic polarization curve for a metal surface, which serves as a basis for describing the kinetics of passivation. It discusses five properties of passive films: thickness, composition, structure, electronic properties, and mechanical properties. The article outlines three possible processes that can form passive films: direct film formation, dissolution precipitation, and anodic oxidation of metal ions in solution. It describes the breakdown of the passive film using various models and highlighting the effect of alloy composition and structure.

The influence of friction and wear on the function and structure of tribological systems is determined by various types of tribological tests. This article introduces the general categories of tribological testing and describes the basic objectives of testing. It reviews the results of tribological tests, where the system-dependent characteristics of friction and wear data can be expressed in different forms, such as tribographs, transition diagrams, and tribomaps. A summary of various methods of surface analysis is presented in a table. The article discusses the relationship between wear and reliability in terms of exponential distribution, Weibull distribution, and gamma distribution. It concludes with information on the effects of interaction on failure probability.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

This article examines material property data and the information needs at various points in the design, manufacture, and use cycle. It contains a table that lists the various sources of materials data. The article describes locating media for sources of data such as suppliers of databases and internet. It discusses the types of sources of data, including computer readable media, data centers, and print media. The article also reviews the methods for evaluation and interpretation of data and examines the processes of obtaining and reporting test data.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

Additive manufacturing (AM) has been growing as a significant research interest in academic and industry research communities. This article presents flexible and biocompatible energy-harvesting devices using AM technology. First, it discusses material selection for achieving piezoelectricity and triboelectricity. Then, the article highlights the structures of energy harvesters and describes their working mechanisms. Next, it covers the additively manufactured implantable piezoelectric and triboelectric energy harvesters. Further, the article describes the 3D-printed wearable energy harvesters as well as their applications. An overview of additively manufactured self-powered sensors is highlighted. Finally, the article discusses the issues for 3D-printed energy harvesters and their roadmap.

This article provides readers with a brief review of the applications of thermography in additive manufacturing (AM), which still is largely a research and development (R&D) effort. There is a particular focus on metals-based laser powder-bed fusion (L-PBF), although applications in directed-energy deposition (DED) and electron beam PBF (E-PBF) also are mentioned. The metrological basis of thermography is discussed in the article. Background information on radiation thermometry is provided, including how the various equations are applied. Finally, specific examples and lessons learned from various AM thermographic studies at the National Institute of Standards and Technology (NIST) are provided.

Electronic structure methods based on the density functional theory (DFT) are used as a powerful tool for assessing the mechanical thermodynamic and defect properties of metal alloys. This article presents the origins of the electronic structure methods and their strengths and limitations. It describes the basic procedures for calculating essential structural properties in metal alloys. The article reviews the approximations and computational details of the pseudopotential plane wave methods used in metal systems. It provides information on the applications of DFT methods in metal alloy systems. The article discusses the calculations of a variety of structural, thermodynamic, and defect properties, with particular emphasis on structural metal alloys and their derivatives.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

This article is a compilation of definitions for terms related to engineering materials, including plastics, elastomers, polymer-matrix composites, adhesives and sealants, ceramics, ceramic-matrix composites, glasses, and carbon-carbon composites.

This article focuses on the analyzing and modeling of stress-strain behavior of polycrystals of pure face-centered cubic (fcc) metals in the range of temperatures and strain rates where diffusion is not important. It presents a phenomenological description of stress-strain behavior and provides information on the physical background, alternative interpretations, and directions of research. The quantitative description of strain hardening of fcc polycrystals is provided. The article also discusses the modeling of stress-strain behavior in body-centered cubic metals, hexagonal metals, stage IV work hardening, and the various classes of single-phase alloys.

Additive manufacturing (AM) has been adopted as one of the most versatile and rapid design-to-manufacturing approaches for printing a wide range of two- and three-dimensional parts, devices, and complex geometries layer by layer. This article provides insights into the current progress, challenges, and future needs of AM of electronics from the space, defense, biomedical, energy, and industry perspectives.

This article presents the following characteristics of pure metals : structure, chemical composition, mass characteristics, thermal properties, electrical properties, chemical properties, magnetic properties, optical properties, fabrication characteristics, nuclear properties, and mechanical properties.

This article provides crystallographic and engineering data for single oxide ceramics, zirconia, silicates, mullite, spinels, perovskites, borides, carbides, silicon carbide, boron carbide, tungsten carbide, silicon-nitride ceramics, diamond, and graphite. It includes data on crystal structure, density, mechanical properties, physical properties, electrical properties, thermal properties, and magnetic properties.