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Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
...Abstract Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Abstract
Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
...Abstract Abstract This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation...
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
..., and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating...
Abstract
Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006395
EISBN: 978-1-62708-192-4
... electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion...
Abstract
This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... described a procedure for reducing the embrittlement of gold-plated solder joint ( Ref 5 ). A gold-tin intermetallic compound was formed during soldering, and the thickness of the gold plating had to be reduced to minimize the amount of gold penetrating/dissolving in the solder that produced the brittle...
Abstract
This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Tin Matte Sn or immersion Sn Lead-free alloys Sn-Ag-Cu Silver Immersion Ag with additives Nickel-gold Electroless Ni-immersion Au Component lead terminations Nickel-gold Plated Au Electroless Ni-immersion Au Tin Pure Sn plating Silver-palladium Ag-Pd Nickel-palladium...
Abstract
This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001448
EISBN: 978-1-62708-173-3
... (that is, gold, silver, platinum, and their alloys) are weldable ultrasonically. Materials plated with such metals are also ultrasonically weldable. Nickel-Base Alloys Many nickel-base alloys and nickel-plated materials are ultrasonically weldable. Figure 6 is a photomicrograph of nickel ultrasonically...
Abstract
Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003631
EISBN: 978-1-62708-182-5
... cost of gold, very thin electroplated gold coatings are used for contacts. Gold plate thicknesses as small as 0.25 μm (0.01 mil) are used. When electric contacts are subjected to vibrations of continual expansion and contraction from periodic thermal excursions, the small relative motion between...
Abstract
Mechanically assisted degradation of metals is defined as any type of degradation that involves a corrosion mechanism and a wear or fatigue mechanism. This article provides a discussion on the mechanisms of five forms of degradation: erosion, fretting corrosion, fretting fatigue, cavitation and water drop impingement, and corrosion fatigue. It describes the factors affecting the severity of fretting corrosion. The article also illustrates the relationship between corrosion fatigue and stress-corrosion cracking.
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001773
EISBN: 978-1-62708-178-8
... to be extremely high to account for the amount of silver found in the gold. Surface diffusion along holes or cracks in the gold plating was suspected. Scanning electron microscopy (SEM) of the surface confirmed this assumption. The defects in the gold were large and numerous. These connectors have been improved...
Abstract
Low-energy ion-scattering spectroscopy (LEISS) is used extensively to analyze solid surfaces. The LEISS process relies on binary elastic collisions between an incident ion beam and the atoms in a sample to obtain information on the surface atoms. The velocity of the scattered ions is used to determine the mass of the atoms that are struck. This article introduces LEISS and its principles. It describes the use of LEISS spectra in qualitative and quantitative analyses, and reviews the instrumentation and applications of LEISS.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003150
EISBN: 978-1-62708-199-3
... of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials, the karat gold is bonded to the base metal substrate by soldering, brazing, welding...
Book Chapter
Book: Fractography
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0000631
EISBN: 978-1-62708-181-8
...-mil) thick Alloy 42 (42Ni-58Fe) leads were nickel electroplated, soldered (Cu-Ag alloy) to tungsten, and then gold plated. Fig. 1330 : A 28-lead electronic flat pack. Cracking was predominantly observed in the smallest L-shaped leads (arrow). 2.5×. Fig. 1331 : Cracks in L-shaped leads were found...
Abstract
This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials.
Book Chapter
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001087
EISBN: 978-1-62708-162-7
... of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials, the karat gold is bonded to the base metal substrate by soldering, brazing, welding...
Abstract
Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001255
EISBN: 978-1-62708-170-2
..., these are usually considered as part of gold plating technology. The most frequently electroplated copper alloys are brass (principally alloys of copper and zinc) and bronze (principally alloys of copper and tin). Brass and bronze are both available in a wide variety of useful compositions that range in content...
Abstract
Copper alloys are widely used as electroplated coatings. They can also be used with practically any substrate material that is suitable for electroplating. This article focuses on the solution composition and operating conditions for brass and bronze plating solutions. It describes the decorative and engineering applications of brass and bronze plating. The article also provides information on the treatment of waste water from brass and bronze plating operations.
Book Chapter
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001309
EISBN: 978-1-62708-170-2
... pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings. abrasive blast cleaning bright dipping buffing chemical cleaning...
Abstract
The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.
Book Chapter
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
... plating on a par with hexavalent tank chrome. The exceptions are the harder deposits of cobalt and gold ( Table 2 ). Table 3 provides a point-by-point comparison of selective plating with competitive processes, including tank plating. Deposit hardness attainable with selective plating versus bath...
Abstract
Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... gold and silver plating on substrates, and the extensive use of dissimilar metals make microelectronic devices and components extremely susceptible to corrosion. In order to minimize manufacturing cost, the design may use alternative processes and materials (e.g., gold interconnect layers replaced...
Abstract
This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... is superior to most tin or tin-lead plated surfaces. The nickel solderable coating is protected by a finish of electroplated gold, particularly if the base metal is subject to temperatures that exceed the melting points of tin or tin-lead finishes prior to assembly. The MIL-G-45204C thickness...
Abstract
Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006759
EISBN: 978-1-62708-295-2
... precipitation-hardened (PH) steel debris with gold plating that had transferred onto the metal surface during the failure event. In secondary electron imaging, topographical differences in the gold plating such as wrinkling are more evident when imaged at lower accelerating voltage (a) than at higher...
Abstract
Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
...+Au 8+0.25 0.3+0.01 Appearance; low cost (a) Chromate coating applied after cadmium plating. (b) Soldering operation follows silver plating. (c) Baked at 200 °C (400 °F) after copper plating and after silver plating. Soldering operation follows gold plating. (d) Brass plated...
Abstract
Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion plating, and electroless plating, and describes various plating materials and the types of applications in which they are used. It provides critical processing details such as temperatures, ratios, ranges, times, and rates. The article explains how to prepare aluminum components for electroplating, discussing surface roughening, anodizing, and immersion procedures along with expected results.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003157
EISBN: 978-1-62708-199-3
... is employed on silver contacts to minimize tarnishing. Nickel underlayers (barrier coats) are used to prevent migration of silver through the gold plate. Recent studies indicate that migration of silver along nickel grain boundaries is rapid at high temperatures. Hence, a nickel barrier coat is questionable...
Abstract
Electrical contacts are metal devices that make and break electrical circuits. This article describes the property requirements such as electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties of make-break arcing contacts. The article also focuses on brush contact materials and their interdependence factors for sliding contacts. In addition, the article discusses the properties, manufacturing methods, and applications of electrical contact materials, including wrought materials such as copper metals, silver metals, gold metals, precious metal overlays, tungsten, molybdenum, and aluminum, and composite materials. It concludes by discussing the composite manufacturing methods such as infiltration, press-sinter, press-sinter-repress process, press-sinter-extrude process, internal oxidation, and preoxidized-press-sinter-extrude process, and coprecipitation.