Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.

Mechanically assisted degradation of metals is defined as any type of degradation that involves a corrosion mechanism and a wear or fatigue mechanism. This article provides a discussion on the mechanisms of five forms of degradation: erosion, fretting corrosion, fretting fatigue, cavitation and water drop impingement, and corrosion fatigue. It describes the factors affecting the severity of fretting corrosion. The article also illustrates the relationship between corrosion fatigue and stress-corrosion cracking.

Low-energy ion-scattering spectroscopy (LEISS) is used extensively to analyze solid surfaces. The LEISS process relies on binary elastic collisions between an incident ion beam and the atoms in a sample to obtain information on the surface atoms. The velocity of the scattered ions is used to determine the mass of the atoms that are struck. This article introduces LEISS and its principles. It describes the use of LEISS spectra in qualitative and quantitative analyses, and reviews the instrumentation and applications of LEISS.

Precious metals include gold, silver, and six platinum-group metals, namely, platinum, palladium, ruthenium, rhodium, osmium, and iridium. This article focuses on the consumption, trade practices, properties, product forms, and applications of these metals and their alloys.

This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials.

Precious metals are of inestimable value to modern civilization. This article discusses the resources and consumption, trade practices, and special properties of precious metals and its alloys, including ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold, and tabulates the industrial applications of precious metals. It provides information on the commercial forms (wire, rod, sheet, strip, ribbon, and foil) and uses of precious metals, including semifinished products, precious metal powders, industrial uses, coatings, and jewelry.

Copper alloys are widely used as electroplated coatings. They can also be used with practically any substrate material that is suitable for electroplating. This article focuses on the solution composition and operating conditions for brass and bronze plating solutions. It describes the decorative and engineering applications of brass and bronze plating. The article also provides information on the treatment of waste water from brass and bronze plating operations.

The selection of surface treatments for copper and copper alloys is generally based on application requirements for appearance and corrosion resistance. This article describes cleaning, finishing, and coating processes for copper and copper alloys. These processes include pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings.

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

Chemical analysis is a critical part of any failure investigation. With the right planning and proper analytical equipment, a myriad of information can be obtained from a sample. This article presents a high-level introduction to techniques often used for chemical analysis during failure analysis. It describes the general considerations for bulk and microscale chemical analysis in failure analysis, the most effective techniques to use for organic or inorganic materials, and examples of using these techniques. The article discusses the processes involved in the chemical analysis of nonmetallics. Advances in chemical analysis methods for failure analysis are also covered.

Aluminum components are often plated with other metals to mitigate the effects of corrosion and wear, improve application performance, and extend service life. This article discusses some of the more common aluminum plating processes, including electroplating, immersion plating, and electroless plating, and describes various plating materials and the types of applications in which they are used. It provides critical processing details such as temperatures, ratios, ranges, times, and rates. The article explains how to prepare aluminum components for electroplating, discussing surface roughening, anodizing, and immersion procedures along with expected results.

Electrical contacts are metal devices that make and break electrical circuits. This article describes the property requirements such as electrical conductivity, mechanical properties, chemical properties, fabrication properties, and thermal properties of make-break arcing contacts. The article also focuses on brush contact materials and their interdependence factors for sliding contacts. In addition, the article discusses the properties, manufacturing methods, and applications of electrical contact materials, including wrought materials such as copper metals, silver metals, gold metals, precious metal overlays, tungsten, molybdenum, and aluminum, and composite materials. It concludes by discussing the composite manufacturing methods such as infiltration, press-sinter, press-sinter-repress process, press-sinter-extrude process, internal oxidation, and preoxidized-press-sinter-extrude process, and coprecipitation.