Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.

Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also discusses selective plating, electroforming, and other processes and where they are typically used.

This article discusses the fundamentals of electroplating processes, including pre-electroplating and surface-preparation processes. It illustrates the four layers of a plating system, namely, top or finish coat, undercoat, strike or flash, and base material layers. The article describes various plating methods, such as pulse electroplating, electroless plating, brush plating, and jet plating. It reviews the types of electrodeposited coatings, including hard coatings and soft coatings. The article also details the materials available for electroplating, including electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion on the common issues encountered with electroplating.

This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.

Ultrasonic welding (USW) is effectively used to join both similar and dissimilar metals with lap-joint welds. This article describes procedure considerations for the ultrasonic welding of specific material types. It reviews difficult-to-weld alloys, such as carbon and low-alloy steels, high-strength steels, and stainless steel, and provides information on the applications of weldable alloys such as aluminum alloys and copper alloys. The article concludes with a discussion on welding of dissimilar metal (nonferrous-to-nonferrous) combinations and its applications.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.