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gold plating

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
...Abstract Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
...Abstract Abstract This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
..., and operating conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006395
EISBN: 978-1-62708-192-4
... electroplated chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... described a procedure for reducing the embrittlement of gold-plated solder joint ( Ref 5 ). A gold-tin intermetallic compound was formed during soldering, and the thickness of the gold plating had to be reduced to minimize the amount of gold penetrating/dissolving in the solder that produced the brittle...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Tin Matte Sn or immersion Sn Lead-free alloys Sn-Ag-Cu Silver Immersion Ag with additives Nickel-gold Electroless Ni-immersion Au Component lead terminations Nickel-gold Plated Au Electroless Ni-immersion Au Tin Pure Sn plating Silver-palladium Ag-Pd Nickel-palladium...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001448
EISBN: 978-1-62708-173-3
... (that is, gold, silver, platinum, and their alloys) are weldable ultrasonically. Materials plated with such metals are also ultrasonically weldable. Nickel-Base Alloys Many nickel-base alloys and nickel-plated materials are ultrasonically weldable. Figure 6 is a photomicrograph of nickel ultrasonically...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003631
EISBN: 978-1-62708-182-5
... cost of gold, very thin electroplated gold coatings are used for contacts. Gold plate thicknesses as small as 0.25 μm (0.01 mil) are used. When electric contacts are subjected to vibrations of continual expansion and contraction from periodic thermal excursions, the small relative motion between...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001773
EISBN: 978-1-62708-178-8
... to be extremely high to account for the amount of silver found in the gold. Surface diffusion along holes or cracks in the gold plating was suspected. Scanning electron microscopy (SEM) of the surface confirmed this assumption. The defects in the gold were large and numerous. These connectors have been improved...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003150
EISBN: 978-1-62708-199-3
... of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials, the karat gold is bonded to the base metal substrate by soldering, brazing, welding...
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0000631
EISBN: 978-1-62708-181-8
...-mil) thick Alloy 42 (42Ni-58Fe) leads were nickel electroplated, soldered (Cu-Ag alloy) to tungsten, and then gold plated. Fig. 1330 : A 28-lead electronic flat pack. Cracking was predominantly observed in the smallest L-shaped leads (arrow). 2.5×. Fig. 1331 : Cracks in L-shaped leads were found...
Book Chapter

Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001087
EISBN: 978-1-62708-162-7
... of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials, the karat gold is bonded to the base metal substrate by soldering, brazing, welding...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001255
EISBN: 978-1-62708-170-2
..., these are usually considered as part of gold plating technology. The most frequently electroplated copper alloys are brass (principally alloys of copper and zinc) and bronze (principally alloys of copper and tin). Brass and bronze are both available in a wide variety of useful compositions that range in content...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001309
EISBN: 978-1-62708-170-2
... pickling and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings. abrasive blast cleaning bright dipping buffing chemical cleaning...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
... plating on a par with hexavalent tank chrome. The exceptions are the harder deposits of cobalt and gold ( Table 2 ). Table 3 provides a point-by-point comparison of selective plating with competitive processes, including tank plating. Deposit hardness attainable with selective plating versus bath...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... gold and silver plating on substrates, and the extensive use of dissimilar metals make microelectronic devices and components extremely susceptible to corrosion. In order to minimize manufacturing cost, the design may use alternative processes and materials (e.g., gold interconnect layers replaced...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... is superior to most tin or tin-lead plated surfaces. The nickel solderable coating is protected by a finish of electroplated gold, particularly if the base metal is subject to temperatures that exceed the melting points of tin or tin-lead finishes prior to assembly. The MIL-G-45204C thickness...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006759
EISBN: 978-1-62708-295-2
... precipitation-hardened (PH) steel debris with gold plating that had transferred onto the metal surface during the failure event. In secondary electron imaging, topographical differences in the gold plating such as wrinkling are more evident when imaged at lower accelerating voltage (a) than at higher...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
...+Au 8+0.25 0.3+0.01 Appearance; low cost (a) Chromate coating applied after cadmium plating. (b) Soldering operation follows silver plating. (c) Baked at 200 °C (400 °F) after copper plating and after silver plating. Soldering operation follows gold plating. (d) Brass plated...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003157
EISBN: 978-1-62708-199-3
... is employed on silver contacts to minimize tarnishing. Nickel underlayers (barrier coats) are used to prevent migration of silver through the gold plate. Recent studies indicate that migration of silver along nickel grain boundaries is rapid at high temperatures. Hence, a nickel barrier coat is questionable...