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Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006146
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of binary alloy phase diagrams for which gold (Au) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
... Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
... Abstract This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants...
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006234
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of ternary alloy phase diagrams for which gold (Au) is the first-named element in the ternary system. The diagrams are presented with element compositions in weight percent. The article includes five phase diagrams: Au-Cu-Ni boundaries of solid-state...
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Published: 01 January 1994
Fig. 2 Thickness of gold as a function of time for an immersion electroless gold plating bath More
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Published: 01 January 2003
Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8 More
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Published: 01 January 1986
Fig. 10 NMR Knight shifts in liquid cesium-gold alloys at 600 °C (1110 °F). Source: Ref 16 More
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Published: 01 January 1986
Fig. 21 Rocking curve and topographs of a gold single crystal. (a) Rocking curve with (311)⟨123⟩ orientation strained 5% in tension. (b) Topographs taken at angular positions 1 through 5 More
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Published: 01 January 1986
Fig. 11 Line scan across gold particles on resolution sample often used with SEM. More
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Published: 01 January 1986
Fig. 12 Influence of the sample material on resolution. (a) A gold on carbon resolution sample demonstrating 3-nm (30-Å) resolution. (b) A niobium filament sample examined in the same instrument under the same conditions, but having a resolution of only 7 nm (70 Å) More
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Published: 01 January 1986
Fig. 8 AES peak-to-peak amplitudes as a function of primary beam energy for gold 2024 eV and 69 eV peaks. More
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Published: 01 January 1986
Fig. 21 Auger spectrum from a large surface area of a gold-nickel-copper metallization sample that was heated 4 h in air at 300 °C (570 °F). More
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Published: 01 January 1986
Fig. 22 Depth-composition profile obtained from a nickel-rich area of a gold-nickel-copper metallization surface. More
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Published: 01 January 1986
Fig. 23 Results of a scanning Auger microprobe study performed on a gold-plated stainless steel lead frame. (a) Secondary electron image. (b) Iron Auger image. (c) Oxygen Auger image. (d) Gold Auger image. (e) Nickel Auger image More
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Published: 01 January 1986
Fig. 8 Plot of the copper-gold ratio as determined using LEISS as a function of the bulk copper-gold ratio. Note the linearity of the plot. More
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Published: 01 January 1986
Fig. 10 Angular yield profiles of 1.2-MeV 4 He ions backscattering from gold and copper atoms in single-crystal copper containing 2 at.% Au. Source: Ref 20 More
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Published: 01 January 1987
Fig. 1336 Thermocompression ball bond defect between a gold wire, 25 μm (1 mil) in diameter, and vacuum-deposited aluminum. Note the relatively thick intermetallic layer that formed during power cycling. SEM, 2750× (R.J. Schwinghamer, NASA Marshall Space Flight Center) More
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Published: 01 January 1994
Fig. 1 SEM micrograph of an electroless gold film deposit obtained using a cyanide-base system with potassium borohydride as the reducing agent. Deposit thickness, 1.5 μm. 5000× More
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Published: 01 January 1994
Fig. 3 Thickness of gold as a function of time for an autocatalytic electroless gold plating bath. Theoretical curve at optimum conditions More
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Published: 01 January 1994
Fig. 5 Stress-strain curve for an annealed gold film, obtained by the indentation technique using a spherical-tipped diamond indenter of 20 μm radius. Source: Ref 13 More