This article is a compilation of binary alloy phase diagrams for which gold (Au) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article is a compilation of ternary alloy phase diagrams for which gold (Au) is the first-named element in the ternary system. The diagrams are presented with element compositions in weight percent. The article includes five phase diagrams: Au-Cu-Ni boundaries of solid-state miscibility gap; Au-Cu-Ni liquidus projection; Au-Cu-Ni miscibility gap at 400 degrees centigrade; Au-Cu-Ni miscibility gap at 700 degrees centigrade; and Au-Sn-Te liquidus projection.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.