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gallium compounds
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Book Chapter
Book: Alloy Phase Diagrams
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006163
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of binary alloy phase diagrams for which gallium (Ga) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary...
Abstract
This article is a compilation of binary alloy phase diagrams for which gallium (Ga) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001249
EISBN: 978-1-62708-170-2
... Abstract This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the...
Abstract
This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.
Series: ASM Handbook
Volume: 23
Publisher: ASM International
Published: 01 June 2012
DOI: 10.31399/asm.hb.v23.a0005670
EISBN: 978-1-62708-198-6
... brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical...
Abstract
This article focuses on the use of noble and precious metals for biomedical applications. The noble metals include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of the noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. Modern stents were developed as a result of balloon catheterization research. The article describes gold coatings and iridium oxide coatings for stents.
Book Chapter
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003825
EISBN: 978-1-62708-183-2
... or nitrogen. Table 6 Effects of molten metals on tantalum Metal Remarks Temperature, °C (°F) Code (a) Aluminum Forms Al 3 Ta Molten NR Antimony … to 1000 (1830) NR Bismuth … to 900 (1650) E Cadmium … Molten E Gallium … to 450 (840) E Lead … to 1000...
Abstract
Tantalum is one of the most versatile corrosion-resistant metals known. The outstanding corrosion resistance and inertness of tantalum are attributed to a very thin, impervious, protective oxide film that forms on exposure of the metal to slightly anodic or oxidizing conditions. This article provides a discussion on the mechanism of corrosion resistance and on the behavior of tantalum in different corrosive environments, namely, acids; salts; organic compounds; reagents, foods, and pharmaceuticals; body fluids and tissues; and gases. It contains several tables that summarize the effects of acids, salts, and miscellaneous corrosive reagents on tantalum and applications for tantalum equipment in chemical, pharmaceutical, and other industries. Finally, the article presents a discussion on hydrogen embrittlement, the galvanic effects, and cathodic protection of tantalum and describes the corrosion resistance of different types of tantalum-base alloys.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001284
EISBN: 978-1-62708-170-2
... epitaxy. One is the flexibility of depositing films with distinctly different compositions than the substrates. Even disparate chemistries can be used to deposit epitaxial films, as long as the lattice constant is matched sufficiently to the substrate. An example is the growth of gallium arsenide on...
Abstract
This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.
Book Chapter
Book: Alloy Phase Diagrams
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006178
EISBN: 978-1-62708-163-4
...” “Fe-Mo (Iron - Molybdenum)” in the article “Fe (Iron) Binary Alloy Phase Diagrams” “Ga-Mo (Gallium - Molybdenum)” in the article “Ga (Gallium) Binary Alloy Phase Diagrams” “Ge-Mo (Germanium - Molybdenum)” in the article “Ge (Germanium) Binary Alloy Phase Diagrams” “Hf-Mo (Hafnium...
Abstract
This article is a compilation of binary alloy phase diagrams for which molybdenum (Mo) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006670
EISBN: 978-1-62708-213-6
... most common in application. Compound semiconductors may be binary combinations of rows 3 and 5 of the periodic table (e.g., GaAs), rows 2 and 6 of the periodic table (e.g., CdTe), or more complex compounds arising from three or more elements, such as aluminum gallium arsenide and Cu(In,Ga)Se 2 ( Ref 1...
Abstract
This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003829
EISBN: 978-1-62708-183-2
... possible above 600 °C (1110 °F) Table 5 lists corrosion rate data for silver in nearly 100 organic compound environments. Silver is satisfactory for use in nearly 90% of these environments. Several of the organics for which silver is not recommended did not attack silver; rather, silver affected...
Abstract
This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.9781627082136
EISBN: 978-1-62708-213-6
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003059
EISBN: 978-1-62708-200-6
... presence of iron, indium, or gallium will tend to stabilize the inverse spinel. Compounds exhibiting the inverse spinel structure include MgFe 2 O 4 , TiFe 2 O 4 , Fe 3 O 4 , SnZn 2 O 4 , NiFe 2 O 4 , TiMg 2 O 4 , VMg 2 O 4 , CoFe 2 O 4 , CuFe 2 O 4 , SnCo 2 O 4 , TiZn 2 O 4 , MgGa 2 O 4 , MgIn 2 O 4...
Abstract
This article provides crystallographic and engineering data for single oxide ceramics, zirconia, silicates, mullite, spinels, perovskites, borides, carbides, silicon carbide, boron carbide, tungsten carbide, silicon-nitride ceramics, diamond, and graphite. It includes data on crystal structure, density, mechanical properties, physical properties, electrical properties, thermal properties, and magnetic properties.
Book Chapter
Book: Alloy Phase Diagrams
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006177
EISBN: 978-1-62708-163-4
... the article “Er (Erbium) Binary Alloy Phase Diagrams.” “Fe-Mn (Iron - Manganese)” in the article “Fe (Iron) Binary Alloy Phase Diagrams.” “Ga-Mn (Gallium - Manganese)” in the article “Ga (Gallium) Binary Alloy Phase Diagrams.” “Gd-Mn (Gadolinium - Manganese)” in the article “Gd...
Abstract
This article is a compilation of binary alloy phase diagrams for which manganese (Mn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006657
EISBN: 978-1-62708-213-6
... electron image of the cleaved section, with the grouped 50, 20, and 10 nm lattices identified. Figure 27 shows the secondary electron image of the 10 nm structure and a gallium Auger image. The 10 nm GaAs (yellow regions) and the AlAs (red regions) are readily distinguishable, and the spacings are...
Abstract
This article discusses the basic principles of and chemical effects in Auger electron spectroscopy (AES), covering various factors affecting the quantitative analyses of AES. The discussion covers instrumentation and sophisticated electronics typically used in AES for data acquisition and manipulation and various limitations of AES. Various examples highlighting the capabilities of the technique are also included.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006651
EISBN: 978-1-62708-213-6
..., copper, zinc, titanium, gallium, and iron. Direct analysis in real-time mass spectrometry is used to determine the extent of spreading of mold-release formulations consisting of poly(dimethyl siloxane) (PDMS) and solvent. Matrix-assisted laser-desorption ionization mass spectrometry...
Abstract
This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006641
EISBN: 978-1-62708-213-6
... gallium can become a source of contamination, especially during a high-temperature annealing step. The worst case showed that gallium spreading could be as large as 1 cm (0.4 in.) from the center of the refilled material on a wafer. Laser ablation ICP-MS was used to measure vertical and lateral...
Abstract
This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001286
EISBN: 978-1-62708-170-2
... is mutual solid solubility between the film and substrate material and the temperature and time are sufficient to allow diffusion to occur. This type of interfacial system is often found in metallic systems. Some systems, such as silver on iron and indium, or gallium on GaAs, have no solubility and...
Abstract
This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.
Book: Corrosion: Materials
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003810
EISBN: 978-1-62708-183-2
... Limited Poor Gallium 29.8 Unknown Unknown Bismuth-lead-tin 97 Good Unknown Bismuth-lead 125 Unknown Unknown Tin 321.9 Limited Poor Bismuth 271.3 Unknown Unknown Lead 327 Good at 327 °C (621 °F) Unknown Indium 156.4 Unknown Unknown Lithium 186 Unknown...
Abstract
This article discusses the five basic matrix structures in cast irons: ferrite, pearlite, bainite, martensite, and austenite. The alloying elements, used to enhance the corrosion resistance of cast irons, including silicon, nickel, chromium, copper, molybdenum, vanadium, and titanium, are reviewed. The article provides information on classes of the cast irons based on corrosion resistance. It describes the various forms of corrosion in cast irons, including graphitic corrosion, fretting corrosion, pitting and crevice corrosion, intergranular attack, erosion-corrosion, microbiologically induced corrosion, and stress-corrosion cracking. The cast irons suitable for the common corrosive environments are also discussed. The article reviews the coatings used on cast irons to enhance corrosion resistance, such as metallic, organic, conversion, and enamel coatings. It explains the basic parameters to be considered before selecting the cast irons for corrosion services.
Book Chapter
Series: ASM Handbook
Volume: 4E
Publisher: ASM International
Published: 01 June 2016
DOI: 10.31399/asm.hb.v04e.a0006250
EISBN: 978-1-62708-169-6
Abstract
This article introduces the mechanism of diffusion and the common types of heat treatments such as annealing and precipitation hardening, which are applicable to most ferrous and nonferrous systems. Three distinct processes occur during annealing: recovery, recrystallization, and grain growth. The article also describes the various types of solid-state transformations such as isothermal transformation and athermal transformation, resulting from the heat treatment of nonferrous alloys. It provides information on the homogenization of chemical composition within a cast structure.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... Fig. 3 . This reactor was designed and built at the Massachusetts Institute of Technology ( Ref 23 ) for metallo-organic CVD (i.e., CVD where some of the source gases are metallo-organic compounds) of gallium arsenide. The reactor consists of three vertically aligned concentric regions. The group III...
Abstract
This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.
Book Chapter
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003145
EISBN: 978-1-62708-199-3
... zinc, silver, thallium, or gallium. Many of the fusible alloys used in industrial applications are based on eutectic compositions. These alloys find important uses in automatic safety devices such as fire sprinklers, boiler plugs, and furnace controls. Under ambient temperature, these alloys have...
Abstract
Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.
Book: Surface Engineering
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001287
EISBN: 978-1-62708-170-2
... borderline between evaporation and sublimation. Chromium has a vapor pressure of 1.3 Pa (10 −2 torr) at 600 °C (1080 °F) below its melting point, and carbon cannot be melted except under high hydrostatic pressure. Materials such as aluminum, tin, gallium, and lead have very low vapor pressures above the...
Abstract
This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.