This article is a compilation of binary alloy phase diagrams for which gallium (Ga) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

This article focuses on the use of noble and precious metals for biomedical applications. The noble metals include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of the noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. Modern stents were developed as a result of balloon catheterization research. The article describes gold coatings and iridium oxide coatings for stents.

Tantalum is one of the most versatile corrosion-resistant metals known. The outstanding corrosion resistance and inertness of tantalum are attributed to a very thin, impervious, protective oxide film that forms on exposure of the metal to slightly anodic or oxidizing conditions. This article provides a discussion on the mechanism of corrosion resistance and on the behavior of tantalum in different corrosive environments, namely, acids; salts; organic compounds; reagents, foods, and pharmaceuticals; body fluids and tissues; and gases. It contains several tables that summarize the effects of acids, salts, and miscellaneous corrosive reagents on tantalum and applications for tantalum equipment in chemical, pharmaceutical, and other industries. Finally, the article presents a discussion on hydrogen embrittlement, the galvanic effects, and cathodic protection of tantalum and describes the corrosion resistance of different types of tantalum-base alloys.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article is a compilation of binary alloy phase diagrams for which molybdenum (Mo) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.

This article provides crystallographic and engineering data for single oxide ceramics, zirconia, silicates, mullite, spinels, perovskites, borides, carbides, silicon carbide, boron carbide, tungsten carbide, silicon-nitride ceramics, diamond, and graphite. It includes data on crystal structure, density, mechanical properties, physical properties, electrical properties, thermal properties, and magnetic properties.

This article is a compilation of binary alloy phase diagrams for which manganese (Mn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article discusses the basic principles of and chemical effects in Auger electron spectroscopy (AES), covering various factors affecting the quantitative analyses of AES. The discussion covers instrumentation and sophisticated electronics typically used in AES for data acquisition and manipulation and various limitations of AES. Various examples highlighting the capabilities of the technique are also included.

This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.

This article discusses the basic principles of inductively coupled plasma mass spectrometry (ICP-MS), covering different instruments used for performing ICP-MS analysis. The instruments covered include the sample-introduction system, ICP ion source, mass analyzer, and ion detector. Emphasis is placed on ICP-MS applications in the semiconductor, photovoltaic, materials science, and other electronics and high-technology areas.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

This article discusses the five basic matrix structures in cast irons: ferrite, pearlite, bainite, martensite, and austenite. The alloying elements, used to enhance the corrosion resistance of cast irons, including silicon, nickel, chromium, copper, molybdenum, vanadium, and titanium, are reviewed. The article provides information on classes of the cast irons based on corrosion resistance. It describes the various forms of corrosion in cast irons, including graphitic corrosion, fretting corrosion, pitting and crevice corrosion, intergranular attack, erosion-corrosion, microbiologically induced corrosion, and stress-corrosion cracking. The cast irons suitable for the common corrosive environments are also discussed. The article reviews the coatings used on cast irons to enhance corrosion resistance, such as metallic, organic, conversion, and enamel coatings. It explains the basic parameters to be considered before selecting the cast irons for corrosion services.

This article introduces the mechanism of diffusion and the common types of heat treatments such as annealing and precipitation hardening, which are applicable to most ferrous and nonferrous systems. Three distinct processes occur during annealing: recovery, recrystallization, and grain growth. The article also describes the various types of solid-state transformations such as isothermal transformation and athermal transformation, resulting from the heat treatment of nonferrous alloys. It provides information on the homogenization of chemical composition within a cast structure.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.