Gallium-base components can be found in a variety of products ranging from compact disk players to advanced military electronic warfare systems, owing to the factor that it can emit light, has a greater resistance to radiation and operates at faster speeds and higher temperatures. This article discusses the uses of gallium in optoelectronic devices and integrated circuits and applications of gallium. The article discusses the properties and grades of gallium arsenide and also provides information on resources of gallium. The article talks about the recovery techniques, including recovery from bauxite, zinc ore and secondary recovery process and purification. The article briefly describes the fabrication process of gallium arsenide crystals. Furthermore, the article gives a short note on world supply and demand of gallium and concludes with research and development on gallium arsenide integrated circuits.

Metal contamination of the environment reflects both natural sources and industrial activity, affecting human health. This article begins with a discussion on the level of metal exposure resulting in toxicological effects, the factors influencing toxicity of metals, and carcinogenicity of metal compounds. It discusses some commonly used chelating agents for treating metal intoxication, and clinical effectiveness in treating poisoning by different metals. The metals discussed are grouped into four categories: (1) major toxic metals with multiple effects, including arsenic, beryllium, cadmium, chromium, lead, mercury, and nickel; (2) essential metals with potential for toxicity, including cobalt, copper, iron, manganese, molybdenum, selenium, and zinc; (3) metals with toxicity related to medical therapy, including aluminum, bismuth, gallium, gold, lithium, and platinum; and (4) minor toxic metals, including antimony, barium, indium, magnesium, silver, tellurium, thallium, tin, titanium, uranium, and vanadium. The main factors included in the discussion are their disposition, toxicity, biological factors and treatment.

This article is a compilation of binary alloy phase diagrams for which gallium (Ga) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article is a compilation of binary alloy phase diagrams for which molybdenum (Mo) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article reviews the phase diagrams, alloy with third element additions, layer growth, critical current density, and matrix materials of A15 superconductors. It describes the production methods of tape conductors (chloride deposition, and surface diffusion) and multifilamentary wires (rod process, modified jelly roll process, niobium tube process, in-situ process, powder metallurgy process, and jelly roll method). The article focuses on reaction heat treatment, which is required at the end of wire processing to convert the ductile components to the desired, but brittle, superconductor. Finally, it discusses the applications of A15 superconductors in commercial magnets, power generation, power transmission, high-energy physics, and fusion.

Germanium is a semiconducting metalloid element found in Group IV A. Germanium is used in the field of electronics, infrared optics, and in the fields of gamma ray spectroscopy, catalysis, and fiber optics. This article discusses the sources, manufacturing, and processing of germanium, and focuses on the chemical properties of various germanium compounds, including germanium halides, germanates, germanides, germanes, inorganic, and organogermanium compounds. It also tabulates the physical, thermal, electronic, and optical properties of germanium, and explains the economical aspects and specifications of germanium. The article describes the analytical and test methods of germanium, including gravimetric method, titrimetric method, and spectral method. It provides a short note on toxicology, and concludes with the uses of germanium in different fields.

The electronic microcircuit industry has placed severe demands on metal suppliers to provide metals of the highest reproducible purity attainable as a result of the constant quest for the true values of physical and chemical properties of metals. This article describes the commonly used methods for ultrapurification of metals produced by electrolytic processes, including fractional crystallization, zone refining, vacuum melting, distillation, chemical vapor deposition, and solid state refining techniques. In addition, it describes the trace element analysis and resistance-ratio test methods used to characterize purity. Tables list the values for resistance ratios of zone-refined metals and their corresponding chemical compositions, and provide an example of the detection of impurities to concentrations in the parts per billion range, utilizing a combination of the glow discharge mass spectroscopy method and Leco combustion methods.

Liquid metal induced embrittlement (LMIE) is the reduction of the fracture resistance of a solid material during exposure to a liquid metal. This article discusses the mechanisms and occurrence condition of LMIE and describes the effects of metallurgical factors, such as grain size, temperature and strain rate, stress, inert carriers, and fatigue, on LMIE. It provides a detailed discussion on LMIE in ferrous and nonferrous metals and their alloys. In addition, the article highlights the ways of preventing embrittlement in metals and alloys.

This article is a compilation of binary alloy phase diagrams for which manganese (Mn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

This article focuses on the use of noble and precious metals for biomedical applications. These include gold, platinum, palladium, ruthenium, rhodium, iridium, and osmium. The physical and mechanical properties of noble and precious metals are presented in tables. A brief discussion on the ancient history of noble and precious metal use in dentistry is provided. The article discusses the use of direct gold dental filling materials, direct silver dental filling materials, traditional amalgam alloys, high-copper amalgam alloys, and gallium alloys in biomedical applications. It also provides information on gold coatings and iridium oxide coatings for stents.

This article provides an introduction to the molecular fluorescence spectroscopy, and discusses the theory of fluorescence and its application to chemical analysis. It provides information on fluorescence that occurs in organic compounds and inorganic atoms and molecules. The article describes the instruments used in the spectroscopy, namely, radiation sources, sample holders, wavelength selectors, detectors, computers, and ratiometric instruments. The practical considerations include solvent effects, corrected spectra, wavelength calibration, temperature, and scattered light. The article also discusses the uses of some special techniques used in molecular fluorescence spectroscopy.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article provides information on basic chemical equilibria, wet analytical chemistry, and the appropriateness of classical wet methods. It focuses on nonoxidizing acids and oxidizing acids. The article includes information on the qualitative methods used to identify materials by wet chemical reaction. Gravimetry, in which a chemical species is weighed; titrimetry, which involves volume measurement of a liquid reactant; and a host of separation techniques, which require diverse forms of laboratory manipulation, are discussed. The article briefly describes the partitioning of oxidation states as well as those applications in surface studies and rapid material identification in which chemical techniques have proved useful.

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

This article characterizes the corrosion resistance of precious metals, namely, ruthenium, rhodium, palladium, silver, osmium, iridium, platinum, and gold. It provides a discussion on the general fabricability; atomic, structural, physical, and mechanical properties; oxidation and corrosion resistance; and corrosion applications of these precious metals. The article also tabulates the corrosion rates of these precious metals in corrosive environment, namely, acids, salts, and halogens.

Rare earth metals belong to Group IIIA of the periodic table that includes scandium, yttrium, and the lanthanide elements which are lanthanum, cerium, praseodymium, neodymium, promethium, samarium, europium, gadolinium, terbium, dysprosium, holmium, erbium, thulium, ytterbium, and lutetium. This article classifies the rare earth metals based on their purity level, which are designated as research grades (>99.8% pure) and commercial grades (95% - 98% pure), and describes the preparation and purification, including solid-state electrolysis. It further discusses physical, mechanical, and chemical properties; electronic configurations; crystal structures, and explains the alloy forming characteristics of rare earth elements. The article concludes by describing the various applications of commercial-grade rare earth elements and commercial alloys, which incorporates rare earth elements as additives.

This article provides a detailed account of the principles, instrumentation,and applications of x-ray photoelectron spectroscopy (XPS), a technique used for elemental and compositional analysis of surfaces and thin films. It reviews the nomenclature of energy states and sensitivity of electrons at the surface that are capable of producing peaks in XPS. Additionally, it presents information on the instrumentation and the preparation and mounting of samples for XPS analysis. The article explains qualitative analysis, namely, measuring of shifts in the binding energy of core electrons, multiplet splitting, and the Auger parameter; and quantitative analysis such as depth analysis carried out using XPS. It also discusses the applications of XPS with examples.

This article focuses on the use of indium and bismuth in low-melting-temperature solders and fusible alloys. It describes how the two elements typically occur in nature and how they are recovered and processed for commercial use. It also provides information on designations, classification, composition, properties (including temperatures ranges), and some of the other ways in which indium and bismuth alloys are used.