This article focuses on the electrodeposition of indium and its alloys, such as indium-antimony, indium-gallium, and indium-bismuth, in nonaqueous indium plating baths. It also provides information on the stripping of indium plate from plated components and presents an overview of the specifications, standards, and hazards of indium plating.

This article describes the vapor-phase growth techniques applied to the epitaxial deposition of semiconductor films and discusses the fundamental processes involved in metal-organic chemical vapor deposition (MOCVD). It reviews the thermodynamics that determine the driving force behind the overall growth process and the kinetics that define the rates at which the various processes occur. The article provides information on the reactor systems and hardware, MOCVD starting materials, engineering considerations that optimize growth, and the growth parameters for a variety of Group III-V, II-VI, and IV semiconductors.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article begins with the discussion on the background of metal-matrix composites (MMC) and moves into a broad description of the general parameters affecting the corrosion of MMC. It discusses the primary sources of MMC corrosion that include galvanic corrosion between MMC constituents, chemical degradation of interphases and reinforcements, microstructure-influenced corrosion, and processing-induced corrosion. The article elaborates on the corrosion behavior of specific aluminum, magnesium, titanium, copper, stainless steel, lead, depleted uranium, and zinc MMCs systems. It concludes with a description on the corrosion control of MMCs using protective coatings and inhibitors.

Laser-ultrasonics is a particular implementation of ultrasonic nondestructive inspection in which ultrasound is generated and detected by lasers. This article discusses the various mechanisms that ensure ultrasound generation and explains the possibility to get the equivalent of phase-array by numerical processing of an array of previously acquired laser-ultrasonic signals. The article describes the ultrasound generation by thermoelastic mechanism and ablation or vaporization. It illustrates the principle of optical detection of ultrasound with confocal Fabry-Perot interferometer and photorefractive two-wave mixing interferometer. The article concludes with information on the industrial applications of laser-ultrasonics, including thickness measurement, flaw detection, and material characterization.

This article reviews the applications of traditional glasses in architecture, transportation, construction, houseware, containers, and fibers. It also describes uses of specialty glasses for aerospace and military applications, biomedical and dental applications, chemical-resistant applications, lighting, information display, electronic processing and electronic devices, optical and ophthalmic products, and communications equipment.

This article defines crystallographic terms and concepts, including crystal structure, unit cell, structure symbols, lattice, space-group notation, and atom position. It schematically illustrates the atom positions, prototypes, structure symbols, space-group notations, and lattice parameters for some of the simple metallic crystals. A table that lists the crystal structures of various metal elements is presented. The crystal structures are described by the Pearson symbols for crystal system, space lattice, total number of atoms per unit cell, and prototype structure. The article tabulates the assorted structure types of metallurgical interest arranged according to Pearson symbol. It also provides information on crystal defects in all real crystals, explaining some significant ones, such as point defects, line defects, stacking faults, and twins.

This article provides crystallographic and engineering data for single oxide ceramics, zirconia, silicates, mullite, spinels, perovskites, borides, carbides, silicon carbide, boron carbide, tungsten carbide, silicon-nitride ceramics, diamond, and graphite. It includes data on crystal structure, density, mechanical properties, physical properties, electrical properties, thermal properties, and magnetic properties.