Aluminum, a commonly used base material for brazing, can be easily fabricated by most manufacturing methods, such as machining, forming, and stamping. This article outlines non-heat-treatable wrought alloys typically used as base metals for the brazing process. It highlights chloride-active and fluoride-active types of fluxes that are used for torch, furnace, or dip brazing processes. The article explains the steps to be performed, including the designing of joints, preblaze cleaning, assembling, brazing techniques (dip brazing, furnace and torch brazing, fluxless vacuum brazing), flux removal techniques, and postbraze heat treatment processes. It concludes with information on the safety precautions to be followed during the brazing process.

This article focuses on the various techniques for removing contaminants in the surface preparation of steel for hot-dip coatings: wet cleaning methods, including alkaline cleaning, electrolytic cleaning, chemical pickling, and electrolytic pickling; flame cleaning and furnace-atmosphere techniques, such as Sendzimir oxidation/reduction method; other specialized methods, namely, fluxes, mechanical cleaning, and ultrasonic methods; or a combination of these.

Aluminum fluxing is a step in obtaining clean molten metal by preventing excessive oxide formation, removing nonmetallic inclusions from the melt, and preventing and/or removing oxide buildup on furnace walls. This article discusses the solid fluxes and gas fluxes used in foundries. It reviews the classification of solid fluxes depending on their use and function at the foundry operation. These include cover fluxes, drossing fluxes, cleaning fluxes, and furnace wall cleaner fluxes. The article also examines the operational practices and applications of the flux injection in the foundries. It describes the applications of the aluminum fluxing such as crucible furnaces, transfer ladles, reverberatory furnaces, and holding/casting furnaces.

Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered joints and their causes. It describes the role of proper brazing procedures in controlling corrosion. The article concludes with information on the corrosion resistance of various brazing alloy systems.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article focuses on the techniques used in recycling of aluminum metal matrix composites (MMCs) such as discontinuous SiC reinforced aluminum MMCs and continuous reinforced aluminum MMCs. It provides a discussion on the properties of recycled aluminum MMCs and disposal of aluminum MMCs.

This article reviews the melt processing and casting of non-ferrous alloys, such as nickel alloys, titanium alloys, and lead alloys. It describes the lead refining steps, namely, copper drossing, softening, desilvering, zinc removal, bismuth removal, and final refining.

Gas porosity is a major factor in the quality and reliability of castings. The major cause of gas porosity in castings is the evolution of dissolved gases from melting and dross or slag containing gas porosity. Degassing is the process of removing these gases. This article describes the methods of degassing aluminum, magnesium, and copper alloys. It provides information on the sources of hydrogen in aluminum and gases in copper.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.