This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

This article discusses the basic operating principles, industrial applications, and advantages as well as the parameters influencing the process of laser-induced forward transfer (LIFT) of solid materials, liquid materials, laser-absorbing layers, intact structures, and metallic 3D microstructures in additive manufacturing.

This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.

Nondestructive testing (NDT), also known as nondestructive evaluation (NDE), includes various techniques to characterize materials without damage. This article focuses on the typical NDE techniques that may be considered when conducting a failure investigation. The article begins with discussion about the concept of the probability of detection (POD), on which the statistical reliability of crack detection is based. The coverage includes the various methods of surface inspection, including visual-examination tools, scanning technology in dimensional metrology, and the common methods of detecting surface discontinuities by magnetic-particle inspection, liquid penetrant inspection, and eddy-current testing. The major NDE methods for internal (volumetric) inspection in failure analysis also are described.

Laser-ultrasonics is a particular implementation of ultrasonic nondestructive inspection in which ultrasound is generated and detected by lasers. This article discusses the various mechanisms that ensure ultrasound generation and explains the possibility to get the equivalent of phase-array by numerical processing of an array of previously acquired laser-ultrasonic signals. The article describes the ultrasound generation by thermoelastic mechanism and ablation or vaporization. It illustrates the principle of optical detection of ultrasound with confocal Fabry-Perot interferometer and photorefractive two-wave mixing interferometer. The article concludes with information on the industrial applications of laser-ultrasonics, including thickness measurement, flaw detection, and material characterization.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.

The large majority of the commercially important glasses are processed from a carefully calculated batch of raw materials that is then melted in special furnaces. Providing an introduction to melting practices of glass production, this article focuses on various finishing methods of glass products, including forming, grinding and polishing, and explores the advantages, disadvantages and steps involved in sol-gel process. It also discusses the types, processes and properties of annealed, laminated, and tempered glass, and presents the steps involved in glass decoration. The article gives a detailed account of production, properties and application of fiberglass, optical fibers, glass spheres and ceramic glasses, and describes the forms, classification, compositions and properties of glass/metal and glass-ceramic/metal seals.