Search Results for electronics

Additive manufacturing (AM) has been adopted as one of the most versatile and rapid design-to-manufacturing approaches for printing a wide range of two- and three-dimensional parts, devices, and complex geometries layer by layer. This article provides insights into the current progress, challenges, and future needs of AM of electronics from the space, defense, biomedical, energy, and industry perspectives.

The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

Electron spin resonance (ESR), or electron paramagnetic resonance (EPR), is an analytical technique that can extract a great deal of information from any material containing unpaired electrons. This article explains how ESR works and where it applies in materials characterization. It describes a typical ESR spectrometer and explains how to tune it to optimize critical electromagnetic interactions in the test sample. It also identifies compounds and elements most suited for ESR analysis and explains how to extract supplementary information from test samples based on the time it takes electrons to return to equilibrium from their resonant state. Two of the most common methods for measuring this relaxation time are presented as are several application examples.

This article describes the principles and applications of Auger electron spectroscopy (AES). It provides information on the instrumentation typically used in the AES, including an electron gun, an electron spectrometer, a secondary electron detector, and an ion gun. The article also describes experimental methods and limitations of the AES, including elemental detection sensitivity, electron beam artifacts, sample charging, spectral peak overlap, high vapor pressure samples, and sputtering artifacts.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.

The application of transmission electron microscope to the study of fracture surfaces and related phenomena has made it possible to obtain magnifications and depths of field much greater than those possible with light (optical) microscopes. This article reviews the methods for preparing single-stage, double-stage, and extraction replicas of fracture surfaces. It discusses the types of artifacts and their effects on these replicas, and provides information on shadowing of replicas. The article concludes with a comparison of the transmission electron and scanning electron fractographs with illustrations.

The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.

Electron beam melting includes melting, refining, and conversion processes for metals and alloys. This article describes the electron beam melting process, as well as the principles, equipment, and process considerations of drip melting and cold hearth melting process.

This article introduces the operating principles and modes of operation for high-vacuum (EBW-HV), Medium-vacuum (EBW-MV), and nonvacuum (EBW-NV) electron beam welding. Equipment, process sequence, part preparation, process control, and weld geometry are described for electron beam welding. Advantages are described in terms of welding near heat sensitive components or materials and producing deep penetration or shallow welds with the same equipment.

This article outlines the beam/sample interactions and the basic instrumental design of a scanning electron microscopy (SEM), which include the electron gun, probeforming column (consisting of magnetic electron lenses, apertures, and scanning coils), electron detectors, and vacuum system. It discusses the contrasts mechanisms used for imaging and analyzing materials in the SEM. These include the topographic contrast, compositional contrast, and electron channeling pattern and orientation contrast. Special instrumentation and accessory equipment used at elevated pressures and during the X-ray microanalysis are reviewed. The article also provides information on the sample preparation procedure and the materials applications of the SEM.

This article introduces the concepts of electron and light microscopy with some general features of imaging systems and the ideas of magnification, resolution, depth of field, depth of focus, and lens aberrations as they apply to simple and familiar light-optical systems. In addition, it describes the differences between electron and light in the context of their respective microscopy techniques.

Electron beam machining (EBM) uses a focused beam of high-velocity electrons to remove material. This article provides a description of equipment used for EBM and discusses the process characteristics, applications, advantages, and disadvantages of electron beam drilling.