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Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... and electronic packaging. carbon-matrix composites ceramic-matrix composites electronic packaging metal-matrix composites polymer matrix composites thermal properties A VARIETY of new advanced composite materials that provide great advantages over conventional materials for thermal management...
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Published: 01 January 1990
Fig. 12 Electronic packages made from SiC d /Al (60 vol% SiC) MMCs. Courtesy of Lanxide Corporation More
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Abstract This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related...
Book: Casting
Series: ASM Handbook
Volume: 15
Publisher: ASM International
Published: 01 December 2008
DOI: 10.31399/asm.hb.v15.a0005339
EISBN: 978-1-62708-187-0
... of solidification processing of composites, namely, stir casting and melt infiltration. It describes the effects of reinforcement present in the liquid alloy on solidification. The article examines the automotive, space, and electronic packaging applications of MMCs. It concludes with information on the development...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
.... It discusses the application of brazed and soldered joints in sophisticated mechanical assemblies, such as aerospace equipment, chemical reactors, electronic packaging, nuclear applications, and heat exchangers. The article also provides a detailed discussion on the joining process characteristics of different...
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Published: 01 January 2001
Fig. 1 Thermal conductivity as a function of coefficient of thermal expansion for materials used in electronic packaging More
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Published: 01 January 2001
Fig. 2 Specific thermal conductivity (thermal conductivity divided by specific gravity) as a function of thermal expansion for materials used in electronic packaging More
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Published: 01 December 2008
Fig. 25 Discontinuously reinforced aluminum metal-matrix composites. (a) Multi-inlet SiC p -Al truss node. (b) Gr p -Al composite components for electronic packaging applications More
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... history is a frequently used term in the electronic packaging industry to describe the product-level thermal exposure experience. The IMC grains can grow under high-temperature conditions, and temperatures exceeding the T g of the epoxy can cause epoxy resin strength degradation ( Ref 39 ). Fatigue...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... reliability solders AN UNDERSTANDING of the mechanical and fatigue properties of solders used in electronic packaging is a requirement for better design of solder joints and the development of accelerated tests and improved solders. Fatigue failures of a solder joint in an electronic device result from...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
.... Microdispensing is not a new technology; it has been used in electronic packaging for many years. However, microdispensing is evolving, offering greater benefits, overcoming challenges, and emerging as a viable option for directly printing circuits. One significant contribution for directly printing circuits...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... to be a potential reliability hazard for long-term field applications. Field failure due to creep corrosion in telecommunication electronics is reported in the literature. The source, process, and possible products of creep corrosion on IC packages are discussed in Ref 2 . Fretting Fretting...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... of Peltier-junction based ( Ref 13 ) thermoelectric coolers. Fig. 3 Temperature versus power density. Source: Ref 5 Most electronic structures, whether integrated circuit (IC) interconnections or packaging, are multilayer structures, with conducting layers alternating with the insulating...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006558
EISBN: 978-1-62708-290-7
...: A Review of Current State-of-the-Art Technologies , 2009 International Conference on Electronic Packaging Technology & High Density Packaging , IEEE , 2009 , p 497 – 503 10.1109/ICEPT.2009.5270702 4. Lopes A. , Navarrete M. , Medina F. , Palmer J. , MacDonald E...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003478
EISBN: 978-1-62708-195-5
... of the chip soldering. The high thermal conductivity allows the thermal plane to keep the electronics from overheating. Testing has shown that a carbon-carbon thermal plane reduces the electronic packaging temperature by 4 to 16 °C (7–29 °F), depending on the input power level, over the conventional aluminum...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003490
EISBN: 978-1-62708-195-5
... to the application of these materials in automotive brakes, drive shafts, and cylinder liners. The recent recognition that additions of ceramic reinforcement enable tailoring of physical as well as mechanical properties of MMCs has led to increasingly widespread use of these materials in electronic- packaging...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... Abstract Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003350
EISBN: 978-1-62708-195-5
.../ electronic packaging industries far exceeded the growth in the aerospace industry. Thus, the insertion of new materials in military and commercial aircraft has actually lagged behind the industrial sector, reversing the trend of earlier years for the insertion of new materials. The MMC market for thermal...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003049
EISBN: 978-1-62708-200-6
... of the nonlinear current-voltage behavior of ZnO, acting as an insulator up to some voltage (threshold or breakdown voltage); above that voltage it behaves as a conductor ( Ref 14 ). Electronic Packaging Electronic packaging consists of the substrate material (Al 2 O 3 , AlN, BeO, BN) and the coatings...