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Book Chapter
Corrosion and Related Phenomena in Portable Electronic Assemblies
Available to PurchaseSeries: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Abstract This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related...
Abstract
This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.
Book Chapter
Corrosion of Electronic Equipment in Military Environments
Available to PurchaseSeries: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... Abstract This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates...
Abstract
This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects of contaminants on the electronic black box.
Book Chapter
Thermal Spray Coatings for Electrical and Electronic Applications
Available to PurchaseBook: Thermal Spray Technology
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... Abstract Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics...
Abstract
Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.
Book Chapter
Fatigue of Solders and Electronic Materials
Available to PurchaseBook: Fatigue and Fracture
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... reliability solders AN UNDERSTANDING of the mechanical and fatigue properties of solders used in electronic packaging is a requirement for better design of solder joints and the development of accelerated tests and improved solders. Fatigue failures of a solder joint in an electronic device result from...
Abstract
This article focuses on the isothermal fatigue of solder materials. It discusses the effect of strain range, frequency, hold time, temperature, and environment on isothermal fatigue life. The article provides information on various isothermal fatigue testing methods used to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test.
Book Chapter
Electronic Materials: Atlas of Fractographs
Available to PurchaseBook: Fractography
Series: ASM Handbook Archive
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0000631
EISBN: 978-1-62708-181-8
... Abstract This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic...
Abstract
This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials.
Book Chapter
Electrical/Electronic Applications for Advanced Ceramics
Available to PurchaseSeries: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... Abstract Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power...
Abstract
Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.
Book Chapter
Electronic Structure Methods Based on Density Functional Theory
Available to PurchaseSeries: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005429
EISBN: 978-1-62708-196-2
... Abstract Electronic structure methods based on the density functional theory (DFT) are used as a powerful tool for assessing the mechanical thermodynamic and defect properties of metal alloys. This article presents the origins of the electronic structure methods and their strengths...
Abstract
Electronic structure methods based on the density functional theory (DFT) are used as a powerful tool for assessing the mechanical thermodynamic and defect properties of metal alloys. This article presents the origins of the electronic structure methods and their strengths and limitations. It describes the basic procedures for calculating essential structural properties in metal alloys. The article reviews the approximations and computational details of the pseudopotential plane wave methods used in metal systems. It provides information on the applications of DFT methods in metal alloy systems. The article discusses the calculations of a variety of structural, thermodynamic, and defect properties, with particular emphasis on structural metal alloys and their derivatives.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article...
Abstract
Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... Abstract Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical...
Abstract
Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical, and physical. It also presents information on the simulation and testing carried out to evaluate the design behavior.
Book Chapter
Properties Needed for Electronic and Magnetic Applications
Available to PurchaseSeries: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... Abstract This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic...
Abstract
This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.
Book Chapter
Thermal Management and Electronic Packaging Applications
Available to PurchaseBook: Composites
Series: ASM Handbook Archive
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... and electronic packaging. carbon-matrix composites ceramic-matrix composites electronic packaging metal-matrix composites polymer matrix composites thermal properties A VARIETY of new advanced composite materials that provide great advantages over conventional materials for thermal management...
Abstract
This article presents an overview of advanced composites, namely, polymer matrix composites, metal-matrix composites, ceramic-matrix composites, and carbon-matrix composites. It also provides information on the properties and applications of the composites in thermal management and electronic packaging.
Image
Possible recovery options for the treatment of electronic scrap containing ...
Available to Purchase
in Recycling of Nonferrous Alloys
> Properties and Selection: Nonferrous Alloys and Special-Purpose Materials
Published: 01 January 1990
Fig. 20 Possible recovery options for the treatment of electronic scrap containing precious metals
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Image
Electronic packages made from SiC d /Al (60 vol% SiC) MMCs. Courtesy of Lan...
Available to Purchase
in Metal-Matrix Composites
> Properties and Selection: Nonferrous Alloys and Special-Purpose Materials
Published: 01 January 1990
Fig. 12 Electronic packages made from SiC d /Al (60 vol% SiC) MMCs. Courtesy of Lanxide Corporation
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Image
Comparison of a magnesium alloy electronic mounting base as manufactured by...
Available to Purchase
in Selection and Application of Magnesium and Magnesium Alloys
> Properties and Selection: Nonferrous Alloys and Special-Purpose Materials
Published: 01 January 1990
Fig. 17 Comparison of a magnesium alloy electronic mounting base as manufactured by welding and by casting. Weight of part, 1.25 kg (2.75 lb)
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Image
Aluminum-SiC composites as heat-spreader plates of an electronic cooling de...
Available to PurchasePublished: 01 December 2008
Fig. 20 Aluminum-SiC composites as heat-spreader plates of an electronic cooling device for the world's first hybrid vehicle, the Prius
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Image
Schematic showing an electrolyte bridging two circuits on an electronic boa...
Available to Purchase
in Corrosion of Electronic Equipment in Military Environments
> Corrosion: Environments and Industries
Published: 01 January 2006
Fig. 2 Schematic showing an electrolyte bridging two circuits on an electronic board. (a) Transverse view of the board. (b) Top-down view of the circuits on the board. Source: Ref 22
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Image
Electronic black box that ceased to function in the tank in which it was mo...
Available to Purchase
in Corrosion of Electronic Equipment in Military Environments
> Corrosion: Environments and Industries
Published: 01 January 2006
Fig. 9 Electronic black box that ceased to function in the tank in which it was mounted. The design of the box (see related text) violated the rules for building a reliable piece of equipment.
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Image
Electrical and electronic applications for formed copper alloy parts. (a) C...
Available to PurchasePublished: 01 January 2006
Fig. 1 Electrical and electronic applications for formed copper alloy parts. (a) Connectors used in home appliances and automotive electrical systems. (b) Copper alloy leadframe for a semiconductor device
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Image
Degradation of an electronic circuit due to silver diffusion and whisker fo...
Available to PurchasePublished: 01 December 2004
Fig. 18 Degradation of an electronic circuit due to silver diffusion and whisker formation during storage for 3000 h at 270 °C (520 °F). (a) Secondary electron image showing a general view of the transistor with gold-coated silver pads and gold wires. 20×. (b) X-ray dot map (silver
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Image
Principle of tandem plants. (a) Mechanical switching. (b) Electronic power ...
Available to PurchasePublished: 09 June 2014
Fig. 20 Principle of tandem plants. (a) Mechanical switching. (b) Electronic power distribution. Source: Ref 11
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