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Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... Abstract This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... Abstract This article provides a historical review of corrosion problems in military electronic equipment. It describes the importance of design for corrosion control of an electronic black box used to contain electrical equipment that provides various functions. The article illustrates...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... Abstract Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... reliability solders AN UNDERSTANDING of the mechanical and fatigue properties of solders used in electronic packaging is a requirement for better design of solder joints and the development of accelerated tests and improved solders. Fatigue failures of a solder joint in an electronic device result from...
Book Chapter

Series: ASM Handbook Archive
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0000631
EISBN: 978-1-62708-181-8
... Abstract This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... Abstract Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power...
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005429
EISBN: 978-1-62708-196-2
... Abstract Electronic structure methods based on the density functional theory (DFT) are used as a powerful tool for assessing the mechanical thermodynamic and defect properties of metal alloys. This article presents the origins of the electronic structure methods and their strengths...
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... Abstract Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article...
Book Chapter

By Shaun S. Devlin
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002445
EISBN: 978-1-62708-194-8
... Abstract Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... Abstract This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic...
Series: ASM Handbook Archive
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... and electronic packaging. carbon-matrix composites ceramic-matrix composites electronic packaging metal-matrix composites polymer matrix composites thermal properties A VARIETY of new advanced composite materials that provide great advantages over conventional materials for thermal management...
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Published: 01 January 1990
Fig. 20 Possible recovery options for the treatment of electronic scrap containing precious metals More
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Published: 01 January 1990
Fig. 12 Electronic packages made from SiC d /Al (60 vol% SiC) MMCs. Courtesy of Lanxide Corporation More
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Published: 01 January 1990
Fig. 17 Comparison of a magnesium alloy electronic mounting base as manufactured by welding and by casting. Weight of part, 1.25 kg (2.75 lb) More
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Published: 01 December 2008
Fig. 20 Aluminum-SiC composites as heat-spreader plates of an electronic cooling device for the world's first hybrid vehicle, the Prius More
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Published: 01 January 2006
Fig. 2 Schematic showing an electrolyte bridging two circuits on an electronic board. (a) Transverse view of the board. (b) Top-down view of the circuits on the board. Source: Ref 22 More
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Published: 01 January 2006
Fig. 9 Electronic black box that ceased to function in the tank in which it was mounted. The design of the box (see related text) violated the rules for building a reliable piece of equipment. More
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Published: 01 January 2006
Fig. 1 Electrical and electronic applications for formed copper alloy parts. (a) Connectors used in home appliances and automotive electrical systems. (b) Copper alloy leadframe for a semiconductor device More
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Published: 01 December 2004
Fig. 18 Degradation of an electronic circuit due to silver diffusion and whisker formation during storage for 3000 h at 270 °C (520 °F). (a) Secondary electron image showing a general view of the transistor with gold-coated silver pads and gold wires. 20×. (b) X-ray dot map (silver More
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Published: 09 June 2014
Fig. 20 Principle of tandem plants. (a) Mechanical switching. (b) Electronic power distribution. Source: Ref 11 More