Search Results for electron fractography

This article presumes the reader has a basic understanding of the operation and principles of scanning electron microscopy (SEM). The emphasis of this article is specifically on the application of SEM to the study of metallic and nonmetallic fracture surfaces, where the typical objectives of SEM examination of a fracture surface may include the following: identification of characteristic fracture features to aid in identifying fracture mechanism(s); characterization of material anomalies that may have influenced the fracture; qualitative or semiquantitative chemical analysis of component material(s); and qualitative or semiquantitative analysis of deposits or corrosion products on or near fracture surfaces.

This article reviews the historical development of fractography, from the early studies of fracture appearance dating back to the sixteenth century, and including the development of microfractography in the middle of the 20th century, to the current state-of-the-art work in electron fractography and quantitative fractography.

The purpose of fractography is to analyze fracture features and attempt to relate the topography of the fracture surface to the causes and/or basic mechanisms of fracture. This article reviews the historical development of fractography, from the early studies of fracture appearance dating back to the sixteenth century to the state-of-the-art work in electron fractography and quantitative fractography. It also describes the applications and limitations of scanning electron microscope and transmission electron microscope.

Scanning electron microscopy (SEM) has unique capabilities for analyzing fracture surfaces. This article discusses the basic principles and practice of SEM, with an emphasis on its applications in fractography. The topics include an introduction to SEM instrumentation, imaging and analytical capabilities, specimen preparation, and the interpretation of fracture features. SEM can be subdivided into four systems, namely, illuminating/imaging, information, display, and vacuum systems. The article also describes the major criteria and techniques of SEM specimen preparation, and the general features of ductile and brittle fracture modes.

Fracture surfaces are fragile and subject to mechanical and environmental damage that can destroy microstructural features. This article discusses the importance of care and handling of fractures and the factors that need to be considered during the preliminary visual examination. It describes the procedures for sectioning a fracture and opening secondary cracks as well as the effect of nondestructive inspection on subsequent evaluation. The article provides information on the most common techniques for cleaning fracture surfaces. These techniques are dry air blast cleaning, replica stripping, organic-solvent cleaning, water-base detergent cleaning, cathodic cleaning, and chemical-etch cleaning.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

The quantitative characterization of fracture surface geometry, that is, quantitative fractography, can provide useful information regarding the microstructural features and failure mechanisms that govern material fracture. This article is devoted to the fractographic techniques that are based on fracture profilometry. This is followed by a section describing the methods based on scanning electron microscope fractography. The article also addresses procedures for three-dimensional fracture surface reconstruction. In each case, sufficient methodological details, governing equations, and practical examples are provided.

Identification of the fracture mechanism is one of the principal responsibilities of a failure analyst and is an important component of any root-cause analysis. This article explores the varied mechanisms responsible for metal fracture, particularly regarding fractography. The behavior of engineering materials at fracture is based on a large number of interrelated characteristics from the atomic level to the component level. These characteristics range from ductile to brittle at the microscale and macroscale levels. Fundamental relative ductility results from the type of electronic bonding, the crystal structure, and the broader long-range degree of order. It provides detailed discussion on ductile fracture, brittle fracture, mixed fracture, embrittlement, stress-corrosion cracking.

The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.

This article provides an overview of the origin of metallography. It presents information on how to select a section from a specimen and prepare it for macroscopic analysis. The article describes the macroscopic analysis of steel fracture surfaces with emphasis on ductile, brittle, and fatigue fracture with illustrations. It discusses microanalysis with a focus on the method of light microscopy and includes information of scanning electron microscope in fractography. The article also explains the characteristics of solidification, transformation, deformation structures, and discontinuities that are present in a microstructure. It concludes with information on image analysis.

Fractography is the systematic study of fractures and fracture surfaces. It is a useful tool in failure analysis and provides a means for correlating the influence of microstructure on the fracture mode of a given material. This article discusses the preservation, preparation, and photography of fractured parts and surfaces, and describes some of the more common fractographic features revealed by light microscopy, including tensile-fracture surface marks in unnotched specimens, fatigue marks, and structural discontinuities within the metal. The article also explains how to interpret fracture information contained in optical and scanning-electron microscope fractographs.

The development of quantitative fractography (QF) parameters basically requires topological data of a fracture surface that can be derived from the stereological analysis of multiple projected scanning electron microscope (SEM) images; the profilometry-based techniques that measure the fracture surface profile along x-y sections of a fracture surface from metallographic sections or nondestructive techniques; and the three-dimensional reconstruction of the fracture surface topology using imaging methods such as stereo SEM imaging and confocal scanning laser microscopy. These three general methods of assessing fracture surface topology are reviewed in this article.

This article provides an overview of polymer fractography, with examples of various fracture surfaces created under diverse loading conditions. The focus is on the interpretation of polymer fracture-surface features in light of the unique viscoelastic nature of polymers. The article presents fractographic examples of three time-dependent cracking mechanisms: fatigue fracture, creep rupture, and environmental stress cracking. It details characteristic fractographic features that can be observed in optical microscopy (OM) and scanning electron microscopy (SEM).

Solder cracking is one of the dominant failure modes of the electronic assembly system. Experience shows that solder joints can fail due to processing defects during solder joint formation or due to excessive loading in various applications. This article introduces major fractography techniques to demonstrate typical solder joint failure and background failure mechanisms. These techniques may be helpful to readers in recognizing failure modes and in preventing further failures during product development and process implementation.

Fractography is the means and methods for characterizing a fractured specimen or component. This includes the examination of fracture-exposed surfaces and the interpretation of the fracture markings, and the examination and interpretation of crack patterns. This article deals primarily with the first of these two parts of fractography. Techniques of fractography are presented, fracture markings are explained using glass and ceramic examples, fracture modes in ceramics are discussed, and examples of fracture origins are given.

This article presents abbreviations and symbols related to fractography.

This article presents a basic overview of technology-driven advances in the imaging of primarily metallic fracture surfaces. It describes various types of microscopes, including scanning electron, dual-beam, ion source, and transmission electron microscopes, and their capabilities. It also covers other useful hardware, such as computer-aided tomography (CAT) and micro-computer-aided tomography (micro-CAT) instruments. The article introduces some of the fracture image postprocessing methods and software, including image registration or alignment, focus stacking, Z-stacking, focal plane merging, and image stitching.

Many metal failures involve fracture, and fractography is an essential activity in many, if not most, failure analysis (FA) investigations. This article introduces and illustrates the role of fractography in an FA investigation. Basic guidelines are briefly presented for investigating a failure and how fractography helps the FA investigator determine evidence. Examples are given throughout this article on how the examination of fracture surfaces discerns various sources of crack initiation and mechanisms of crack growth. The procedures for analyzing fractures also include several steps and techniques that involve photographic documentation, proper specimen handling, and visual or microscopic examination. The article also briefly describes the use of metallography in fracture analysis along with case studies as illustrative examples of various fracture mechanisms and modes.

Fatigue failure of engineering components and structures results from progressive fracture caused by cyclic or fluctuating loads. Fatigue is an important potential cause of mechanical failure, because most engineering components or structures are or can be subjected to cyclic loads during their lifetime. This article focuses on fractography of fatigue. It provides an abbreviated summary of fatigue processes and mechanisms: fatigue crack initiation, fatigue crack propagation, and final fracture,. Characteristic fatigue fracture features that can be discerned visually or under low magnification are then described. Typical microscopic features observed on structural metals are presented subsequently, followed by a brief discussion on fatigue in polymers and polymer-matrix composites.