Electron beam hardening (EBH), with some special characteristics in comparison to other heat treatment technologies, allows beam deflection frequencies of up to 100 kHz. This article illustrates the principles of different thermal electron beam technologies, including beam-deflection, continuous EB interaction, EB flash, as well as multifield EB-deflection and multiprocess techniques. It characterizes the technical and technological possibilities for EBH in comparison to other surface-layer hardening processes. The article also discusses the technical design of electron beam facilities and the applications of EBH.

Surface hardening improves the wear resistance of steel parts. This article focuses exclusively on the methods that involve surface and subsurface modification without any intentional buildup or increase in part dimensions. These include diffusion methods, such as carburizing, nitriding, carbonitriding, and austenitic and ferritic nitrocarburizing, as well as selective-hardening methods, such as laser transformation hardening, electron beam hardening, ion implantation, selective carburizing, and surface hardening with arc lamps. The article also discusses the factors affecting the choice of these surface-hardening methods.

This article reviews cleaning and finishing operations that have proven to be effective on titanium, its alloys, and semi-fabricated titanium products. It explains how to remove scale, tarnish films, grease, and other soils and how to achieve required finishes and/or improve wear and oxidation resistance through the use of polishing, buffing, and wire brushing operations. The article also covers a wide range of surface modification and coating processes, including ion implantation, diffusion, chemical and physical vapor deposition, plating, anodizing, and chemical conversion coatings as well as sprayed and sol-gel coatings and laser and electron-beam treatments.

Surface modification is the alteration of the surface composition or structure using energy or particle beams. This article discusses two different surface modification methods. The first, ion implantation, is the introduction of ionized species into the substrate using kilovolt to megavolt ion accelerating potentials. The second method, laser processing, is high-power laser melting with or without mixing of materials precoated on the substrate, followed by rapid melt quenching. The article also describes the advantages and disadvantages of the surface modification approach to promote corrosion resistance.

Microjoining with high energy density beams is a new subject in the sense that the progress of miniaturization in industry has made the desire to make microjoints rapidly and reliably a current and exciting topic. This article summarizes the current state of microjoining with both electron and laser beams. It considers the elementary physical processes such as heat and fluid flow to introduce the reader to the phenomena that affect melting, coalescence, and solidification needed for a successful microweld. The various forces driving (and resisting) fluid flow are analyzed. The article discusses the equipment suitable for microjoining and the metallurgical consequences and postweld metrology of the process. It also provides examples of developmental welds employing laser and electron beam microwelding techniques.

High-velocity gas motion occurs in and around the arc during welding. This article describes the phenomena of gas flow in gas tungsten arc welding (GTAW) and gas metal arc welding (GMAW). The effect of trace element impurities on GTA weld penetration of selected alloys is presented in a table. The article concludes with a discussion on submerged arc welding (SAW).

This article covers the three most popular techniques used to characterize the very outermost layers of solid surfaces: Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). Some of the more important attributes are listed for preliminary insight into the strengths and limitations of these techniques for chemical characterization of surfaces. The article describes the basic theory behind each of the different techniques, the types of data produced from each, and some typical applications. Also discussed are the different types of samples that can be analyzed and the special sample-handling procedures that must be implemented when preparing to do failure analysis using these surface-sensitive techniques. Data obtained from different material defects are presented for each of the techniques. The examples presented highlight the typical data sets and strengths of each technique.

This article focuses on the use of electron beam (EB) for near-net shape processing based on the wire feed material-delivery method. EB deposition processes start with a 3-D model designed in a computer-aided design (CAD) environment, where the deposition path and process parameters are generated. The article provides a description of the electron beam direct manufacturing (EBDM) system used for manufacturing of target parts with the aid of a case study. The control of the essential variables of dynamic beam deflection is also reviewed. The article also includes information on the applications of high-frequency multibeam processes, namely, selective surface treatment, multiple-pool welding, and pre- and post-heat treating.

Welding as an assembly process has become increasingly more attractive to designers of space structures because of its sufficient strength, endurance, reliability during their service lives, and ease of repair. This article reviews a variety of applications for welding in space and low-gravity environments and describes the unique aspects of the space environment. It compares the applicable welding processes, namely, electron-beam welding, laser-beam welding, and gas-tungsten arc welding and examines the metallurgy of low-gravity welds. Steps taken to ensure the continued development of welding technology in space are also discussed.

The primary goal of quality control in electron beam (EB) welding is to consistently produce defect-free and structurally sound welds. This article discusses the common procedures for controlling the EB welding process, the control of the essential machine parameters, and the introduction of closed-loop controls and diagnostic feedback systems in the EB welding systems. It reviews the beam diagnostic tools that interrogate the beam to produce a reconstruction of the power density distribution and provide additional information on the size and shape of the EB. Knowledge of these beam parameters can be used to improve process understanding and control. The article also describes the application areas of beam diagnostics: machine characterization, weld parameter transfer, and weld quality control.

Holography is basically a two-step process for creating a whole three dimensional image of a diffusely reflecting object having some arbitrary shape. This article discusses the advantages, disadvantages and applications of using the optical holography method in nondestructive evaluation. It also discusses the types of acoustical holography, including liquid-surface acoustical holography and scanning acoustical holography. The article concludes by comparing liquid-surface and scanning systems.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

Ion implantation involves the bombardment of a solid material with medium-to-high-energy ionized atoms and offers the ability to alloy virtually any elemental species into the near-surface region of any substrate. This article describes the fundamentals of the ion implantation process and discusses the advantages, limitations, and applications of ion implantation. It also reviews a typical medium current semiconductor implanter adapted for implantation of metals with the aid of illustrations.

This article provides information on the chemical characterization of surfaces by Auger electron spectroscopy (AES), X-ray photoelectron spectroscopy (XPS), and time-of-flight secondary ion mass spectrometry (TOF-SIMS). It describes the basic theory behind each of these techniques, the types of data produced from each, and some typical applications. The article explains the strengths of AES, XPS, and TOF-SIMS based on data obtained from the surface of a slightly corroded stainless steel sheet.

Fluid flow is important because it affects weld shape and is related to the formation of a variety of weld defects in gas tungsten arc (GTA) welds. This article describes the surface-tension-driven fluid flow model and its experimental observations. The effects of mass transport on arc plasma and weld pool are discussed. The article reviews the strategies for controlling poor and variable penetration and describes the formation of keyhole and fluid flow in electron beam and laser welds. It also explains the fluid flow in gas metal arc welding and submerged arc welding, presenting its transport equations.

Coatings and other surface modifications are used for a variety of functional, economic, and aesthetic purposes. Two major applications of thermal spray coatings are for wear resistance and corrosion resistance. This article discusses thermal (surface hardening) and thermochemical (carburizing, nitriding, and boriding) surface modifications, electrochemical treatments (electroplating, and anodizing), chemical treatments (electroless plating, phosphating, and hot dip coating), hardfacing, and thermal spray processes. It provides information on chemical and physical vapor deposition techniques such as conventional CVD, laser-assisted CVD, cathodic arc deposition, molecular beam epitaxy, ion plating, and sputtering.

This article is intended to provide the reader with a good understanding of the underlying science, technology, and the most common applications of focused ion beam (FIB) instruments. It begins with a survey of the various types of FIB instruments and their configurations, discusses the essential components, and explains their function only to the extent that it helps the operator obtain the desired results. An explanation of how the components of ion optical column shape and steer the ion beam to the desired target locations is then provided. The article also reviews the many diverse accessories and options that enable the instrument to realize its full potential across all of the varied applications. This is followed by a detailed analysis of the physical processes associated with the ion beam interacting with the sample. Finally, a complete survey of the most prominent FIB applications is presented.

This article begins with a list of the factors that influence the properties of physical vapor deposited films. It describes the steps involved in ion plating, namely, surface preparation, nucleation, interface formation, and film growth. The article discusses the factors influencing the properties of ion-plated films. The sources of potential applied on substrate surface, bombarding species, and depositing species are addressed. The article also provides information on the parameters that influence bombardment. It concludes with a discussion on the advantages, limitations, and applications of ion plating.

This article focuses on the principles and applications of high-sputter-rate dynamic secondary ion mass spectroscopy (SIMS) for depth profiling and bulk impurity analysis. It begins with an overview of various factors pertinent to sputtering. This is followed by a discussion on the effects of ion implantation and electronic excitation on the charge of the sputtered species. The design and operation of the various instrumental components of SIMS is then reviewed. Details on a depth-profiling analysis of SIMS, the quantitative analysis of SIMS data, and the static mode of operation of time-of-flight SIMS are covered. Instrumental features required for secondary ion imaging are presented and the differences between quadrupole and high-resolution magnetic mass filters are described. The article also reviews the optimum method for analysis of nonmetallic samples and high detection sensitivity of SIMS. It ends with a discussion on a variety of examples of SIMS applications.

This article describes the principles and applications of Auger electron spectroscopy (AES). It provides information on the instrumentation typically used in the AES, including an electron gun, an electron spectrometer, a secondary electron detector, and an ion gun. The article also describes experimental methods and limitations of the AES, including elemental detection sensitivity, electron beam artifacts, sample charging, spectral peak overlap, high vapor pressure samples, and sputtering artifacts.