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electron beam powder bed fusion
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Published: 15 June 2020
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Published: 15 June 2020
Fig. 37 Pure copper inductors produced by (a) electron beam powder-bed fusion (courtesy of GH Inductor Group) and (b) laser powder-bed fusion using frequency-doubled neodymium: yttrium-aluminum-garnet lasers at the ~515 nm wavelength (courtesy of Trumpf)
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Published: 15 June 2020
Fig. 54 Partial pressures of water vapor during electron beam powder-bed fusion (EB-PBF) melting for hydrogen-heat-treated and untreated copper powders shown in Fig. 53 . The baseline layerwise H 2 O cycle is evident in both cases due to adsorbed water vapor on powder but is 2 orders
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in Additive Manufacturing of Titanium and Titanium Alloy Biomedical Devices
> Additive Manufacturing in Biomedical Applications
Published: 12 September 2022
Fig. 3 Schematic of electron beam powder-bed fusion, also commonly known as selective electron beam melting. Reprinted from Ref 11 with permission from Wiley
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Published: 12 September 2022
Fig. 5 (a) Schematic of an electron beam powder-bed fusion (EB-PBF)-fabricated Ti-6V-4Al product in which unmelted powder remains; photograph shows the residual powder after heat treatment. (b) Stress-strain curves of products with and without heat treatment that caused necked powders
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Published: 12 September 2022
Fig. 6 Porous products fabricated by electron beam powder-bed fusion with various-sized unidirectional pores
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Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006579
EISBN: 978-1-62708-290-7
... processes include binder jetting, ultrasonic additive manufacturing, directed-energy deposition, laser powder-bed fusion, and electron beam powder-bed fusion. The article presents a review of the literature and state of the art for copper alloy AM and features data on AM processes and industrial practices...
Abstract
This article is a detailed account of additive manufacturing (AM) processes for copper and copper alloys such as copper-chromium alloys, GRCop, oxide-dispersion-strengthened copper, copper-nickel alloys, copper-tin alloys, copper-zinc alloys, and copper-base shape memory alloys. The AM processes include binder jetting, ultrasonic additive manufacturing, directed-energy deposition, laser powder-bed fusion, and electron beam powder-bed fusion. The article presents a review of the literature and state of the art for copper alloy AM and features data on AM processes and industrial practices, copper alloys used, selected applications, material properties, and where applicable, compares these data and properties to traditionally processed materials. The data presented and the surrounding discussion focus on bulk metallurgical processing of copper components. The discussion covers the composition and performance criteria for copper alloys that have been reported for AM and discusses key differences in process-structure-property relationships compared to conventionally processed material. The article also provides information on feedstock considerations for copper powder handling.
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in Additive Manufacturing of Stainless Steel Biomedical Devices
> Additive Manufacturing in Biomedical Applications
Published: 12 September 2022
Fig. 7 Diagrams representing two different additive manufacturing processes. (a) Laser powder-bed fusion. (b) Electron-beam powder-bed fusion
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Published: 15 June 2020
Fig. 57 Reported room-temperature and high-temperature fatigue properties of GRCop-84 for electron beam powder-bed fusion (EB-PBF) and laser powder-bed fusion (LPBF) compared to standard hot isostatic pressing (HIP) and extruded material
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in Metal Additive Manufacturing Supply Chain, Powder Production, and Materials Life-Cycle Management
> Additive Manufacturing Design and Applications
Published: 30 June 2023
Fig. 7 Particle size distribution from typical vacuum inert gas atomized production, showing the relative ranges typically used in different additive manufacturing modalities: binder jet, laser powder-bed fusion (L-PBF), electron beam powder-bed fusion (EB-PBF), and directed-energy deposition
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Published: 15 June 2020
Fig. 4 Representative microstructures of copper produced with various additive manufacturing processes. Note that scale bars vary. (a) Laser powder-bed fusion, 98.7% relative density, 800 ppm oxygen. Source: Ref 26 . (b) Electron beam powder-bed fusion, 99.95% relative density, 50 ppm oxygen
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Published: 15 June 2020
Fig. 43 Oxygen content of copper powder atomized from oxygen-free electronic copper bar, screened in air and argon to a 15 to 53 μm distribution. The data show the pickup of oxygen from the powder manufacturer to the first and tenth runs using electron beam powder-bed fusion. The oxygen
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Published: 15 June 2020
Fig. 34 (a) Oxygen-free electronic copper klystron cavity. (b) Cross section of an x-band-coupled-cavity traveling wave tube fabricated with electron beam powder-bed fusion
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Published: 15 June 2020
Fig. 6 Microstructures of GR-Cop84. (a) Conventionally processed and prior to heat treatment. (b) Fabricated with electron beam powder-bed fusion. Source: Ref 97
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Published: 15 June 2020
Fig. 5 Defect elimination by hot isostatic pressing (HIP) for Ti-6Al-4V produced by using electron beam powder-bed fusion. Source: Ref 9
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Published: 15 June 2020
Fig. 59 Comparison of ultimate tensile strength from electron beam powder-bed fusion (EB-PBF) to extruded and hot isostatic pressed (HIP) GRCop-84
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Published: 15 June 2020
Fig. 6 Fatigue data for Ti-6Al-4V produced by using electron beam powder-bed fusion in different variants. HIP, hot isostatic pressed. Source: Ref 12
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Published: 12 September 2022
Fig. 13 Introduction of uniaxially aligned grooves on the surface by electron beam powder-bed fusion and the uniaxial alignment of osteoblasts, which was confirmed by actin, an element of the cytoskeleton, and vinculin in focal adhesions
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Published: 15 June 2020
Fig. 36 Copper accelerating cavity with internal cooling channels fabricated with electron beam powder-bed fusion. Courtesy of Radiabeam Technologies, Santa Monica, CA, and University of Texas at El Paso
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Published: 15 June 2020
Fig. 40 Scanning electron microscopy images of copper with (a) 600 ppm and (b) 50 ppm oxygen produced by using electron beam powder-bed fusion additive manufacturing and subjected to a hydrogen brazing cycle at 970 °C (1780 °F) for 1 h and 101 kPa (1 atm) of pure hydrogen. The image
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