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electrolytic copper plating

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001242
EISBN: 978-1-62708-170-2
... as a function of cycle efficiency and current density during plating with periodic current reversal. Source: Ref 9 Fig. 5 Copper required for covering an area with a specific thickness Fig. 1 Buffer curve for adjusting the pH of Rochelle electrolytes. Source: Ref 7 Fig. 2...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
... Abstract Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths, and operating...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
...Abstract Abstract Copper can be electrodeposited from numerous electrolytes. Cyanide and pyrophosphate alkalines, along with sulfate and fluoborate acid baths, are the primary electrolytes used in copper plating. This article provides information on the chemical composition, plating baths...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003216
EISBN: 978-1-62708-199-3
... by electrolytic deposition, unique tanks and auxiliary equipment are required to ensure trouble-free operation and quality coatings. Components in an electroless copper plating solution include: MECHANICAL PLATING is a method for coating ferrous metals, copper alloys, lead, stainless steel, and certain...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003216
EISBN: 978-1-62708-199-3
... also reduces the possibility of deposit nucleation. Electroless Copper Plating ELECTROLESS COPPER plates much more slowly, and is a much more expensive process, than electrolytic copper plating. However, electroless copper plating offers advantages over electrolytic plating that make...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... strike follows, and then a thicker (12 to 25 μm) electrolytic bright acid copper deposit. Finishing coats of electrolytic nickel and/or chromium plating are then applied. Substrate materials ( Ref 28 ) for decorative plating-on plastic include acrylonitrile-butadiene-styrene (ABS), ABS/polycarbonate...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
... conditions for copper, brass, and silver strikes on zincated aluminum surfaces Preplating strike Applicable plating after striking ( Table 5 ) Minimum deposit Plating time, min Bath temperature Current density Type of electrolyte μm mils °C °F A/dm 2 A/ft 2 Copper strike...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001260
EISBN: 978-1-62708-170-2
... of bath chemistries and deposition conditions have been found for plating Ni/Cu multiple-layer alloys, where copper is more noble than nickel by nearly 600 mV. For the case of Ni/Cu alloy plating, one often starts with a nickel-sulfate-based electrolyte (Watts nickel bath) or a nickel sulfamate bath...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001263
EISBN: 978-1-62708-170-2
... Copper electroforming solutions and selected properties of deposits Table 3 Copper electroforming solutions and selected properties of deposits Parameter Copper sulfate Copper fluoborate Electrolyte composition, g/L (oz/gal) CuSO 4 ·5H 2 O—210–240 (28–32) Cu(BF 4 ) 2 —225–450 (30–60...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001261
EISBN: 978-1-62708-170-2
...Abstract Abstract Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002160
EISBN: 978-1-62708-188-7
... silicon when this electrolyte is used. Sodium nitrate, another salt, is used singly or in combination with sodium chloride in some applications ( Table 2 ). Sodium nitrate gives smoother finishes on aluminum or copper alloys and is less corrosive than sodium chloride, but it is more expensive...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
...-plated beryllium-copper connector. Electrolyte was retained as a result of the board being in the horizontal position. Another materials problem in electronic design that is unfamiliar to many electrical engineers is solid-solution phenomena or the formation of intermetallic compounds when certain...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001308
EISBN: 978-1-62708-170-2
..., and coating of aluminum. These include abrasive blast cleaning, barrel finishing, polishing, buffing, satin finishing, chemical cleaning, chemical brightening, electrolytic brightening, chemical etching, alkaline etching, acid etching, chemical conversion coating, electroplating, immersion plating...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003221
EISBN: 978-1-62708-199-3
... Processes Electroplating Electrodeposits of chromium, nickel, cadmium, copper, tin, zinc, gold, or silver are used for various decorative and functional applications. For example, automotive aluminum bumpers get a zincate treatment, copper strike, and a plating of copper, nickel, and chromium...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001250
EISBN: 978-1-62708-170-2
...Abstract Abstract A tin deposit provides sacrificial protection to copper, nickel, and many other nonferrous metals and alloys. Tin also provides good protection to steel. Tin can be deposited from either alkaline or acid electrolytes. This article explains the compositions and operating...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003221
EISBN: 978-1-62708-199-3
...-plated surfaces are required, it is necessary both to buff and to color buff the polished copper alloy surfaces before plating. Chromium reproduces all imperfections in the underlying plating or base metal and, because chromium is hard and has a high melting point, it is more resistant to flow...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... that sometimes cause corrosion in electronic components. The inside of a good aluminum electrolytic capacitor is shown in Fig. 15 . A roll, comprising two specially treated aluminum-foil plates and two interleaved electrolyte-saturated paper separators, is housed in a drawn-aluminum can that has a plastic...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003599
EISBN: 978-1-62708-182-5
...%. From Table 1 , it can be seen that in the gold, silver, copper, and lead refining processes, the impurities more noble than the refined metals remain undissolved in the anode slimes. Consequently, these impurities cannot plate and contaminate the cathodes. In nickel refining, on the other hand, some...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001309
EISBN: 978-1-62708-170-2
... Solutions Air-Drying and Thermosetting Lacquers Chromium Cadmium Gold Nickel Rhodium Silver Tin Tin-Copper Alloys Tin-Lead Alloys Chemical or Electrolytic Polishing Cleaning and Finishing Plating and Coating Aluminum Bronzes Alloys Containing Silicon Alloys...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001256
EISBN: 978-1-62708-170-2
... and zirconium copper alloys require special, proprietary preparations for plating. The deposit usually has a smooth matte finish. Some newly developed solutions give a semibright finish with dense deposits and excellent solderability. Local exhaust is required for fumes from the electrolyte...