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electroless gold plating

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
... Abstract This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants...
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Published: 01 January 1994
Fig. 2 Thickness of gold as a function of time for an immersion electroless gold plating bath More
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Published: 01 January 1994
Fig. 3 Thickness of gold as a function of time for an autocatalytic electroless gold plating bath. Theoretical curve at optimum conditions More
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006395
EISBN: 978-1-62708-192-4
... chromium, electroplated nickel, electroless (autocatalytic) nickel, electroless nickel composite coatings, electroplated gold, and platinum group coatings. These are specifically tailored toward plated coatings for friction, lubrication, and wear technology. The article concludes with a discussion...
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Published: 15 January 2021
Fig. 13 Energy-dispersive spectrometer (EDS) line scan on a polished cross at the bond interface of a solder joint for a component on a printed circuit board. A high concentration of phosphorus indicates degradation of the electroless nickel plating during subsequent gold plating More
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Published: 30 September 2015
Fig. 2 Metal injection molding 17-4 PH stainless steel optical transceiver housing designed for ultrahigh-speed transceivers in networking and telecommunications equipment. The MIM part also receives electrolytic copper, electroless nickel, and electrolytic gold plating. Courtesy of MPIF More
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
... immersion and/or electroless gold plating. As additional requirements develop, there will be a continuing introduction of new gold plating formulations to meet these needs. All of the many formulations work, and each one has its own special advantages, but care must be taken to pick the best one...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001267
EISBN: 978-1-62708-170-2
... “Electroless Nickel Plating” in this Volume. Nickel-Boron Another family of nonelectrolytic alloy coatings uses boron-based reducing agents ( Table 3 ). These are classified by boron alloy content. Generally the low-boron coatings are used in electronic applications as a replacement for gold...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006491
EISBN: 978-1-62708-207-5
... or silver coatings of 12.7 to 17.78 μm (0.5 to 0.7 mil) are the base for the gold layer, which is approximately 0.635 μm (0.025 mil). Electroless Deposition Plating Electroless deposition, as immersion plating, does not require an outer electrical circuit. It involves a chemical reduction, in which...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003022
EISBN: 978-1-62708-200-6
... on electroless-plated plastic for decorative or functional purposes. A combination of copper, nickel, and chromium is widely used for decorative applications. Brass, silver, tin, lead, cadmium, zinc, and gold may be used for special purposes. The electroplating process typically begins with the deposition...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001265
EISBN: 978-1-62708-170-2
... Abstract Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003687
EISBN: 978-1-62708-182-5
...-growing importance. Ternary alloys, such as karat gold alloys and Cu-Sn-Zn, are also available. Nickel-phosphorus and nickel-boron are readily plated by the autocatalytic (electroless) process. Nickel-phosphorus can also be electrodeposited. Coatings of many types can be codeposited with occluded...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001264
EISBN: 978-1-62708-170-2
... Abstract Electroless nickel plating is used to deposit nickel without the use of an electric current. This article provides an overview of the solution composition and characteristics of the electroless nickel bath. It focuses on the metallurgical, mechanical and physical properties...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001309
EISBN: 978-1-62708-170-2
... and bright dipping, abrasive blast cleaning, chemical and electrochemical cleaning, mass finishing, polishing and buffing, electroless plating, immersion plating, electroplating, passivation, coloring, and organic coatings. abrasive blast cleaning bright dipping buffing chemical cleaning cleaning...
Book Chapter

By Niels Bay
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005581
EISBN: 978-1-62708-174-0
... of aluminum-aluminum with one-sided, electroless nickel plating, whereas Fig. 11 shows the bond strengths for aluminum-mild steel with one-sided, electroless nickel plating on steel. Fig. 10 Weld strength as a function of surface exposure for scratch-brushed aluminum-aluminum. (a) p /σ 0 = 1.85...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... on the solderable layer. This solderable surface can be either the base material surface itself or a coating deposited by electroplating, electroless plating, evaporation, pretinning (solder dip coating), sputtering, or chemical vapor deposition (CVD). The protective layer is typically an electroplated film...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001448
EISBN: 978-1-62708-173-3
... (that is, gold, silver, platinum, and their alloys) are weldable ultrasonically. Materials plated with such metals are also ultrasonically weldable. Nickel-Base Alloys Many nickel-base alloys and nickel-plated materials are ultrasonically weldable. Figure 6 is a photomicrograph of nickel ultrasonically...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003215
EISBN: 978-1-62708-199-3
... conditions of electrodeposition processes for chromium plating, nickel plating, iron plating, cadmium plating, zinc plating, indium plating, lead plating, tin plating, silver plating, gold plating, brass plating, bronze plating, tin-lead plating, zinc-iron plating, and zinc-nickel plating. The article also...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003150
EISBN: 978-1-62708-199-3
... of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials, the karat gold is bonded to the base metal substrate by soldering, brazing, welding...
Book Chapter

Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001087
EISBN: 978-1-62708-162-7
... regulations to articles in which the weight of the coating is at least 1 20 th of the total. Lower ratios may be stamped rolled gold plate. The quality mark cannot be applied to articles surfaced with an alloy of less than 10 k. In the cases of the gold-filled and rolled gold plate materials...