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Image
Published: 01 December 2009
Fig. 4 Comparison of the activation energy for self-diffusion versus the creep activation energy for a variety of metals. Source: Ref 8
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Book Chapter
Series: ASM Handbook
Volume: 14A
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v14a.a0004018
EISBN: 978-1-62708-185-6
... Abstract Plastic deformation can occur in metals from various mechanisms, such as slip, twinning, diffusion creep, grain-boundary sliding, grain rotation, and deformation-induced phase transformations. This article emphasizes on the mechanism of slip and twinning under cold working conditions...
Abstract
Plastic deformation can occur in metals from various mechanisms, such as slip, twinning, diffusion creep, grain-boundary sliding, grain rotation, and deformation-induced phase transformations. This article emphasizes on the mechanism of slip and twinning under cold working conditions. It discusses the factors on which the structures developed during plastic deformation depend. These factors include crystal structure, amount of deformation, composition, deformation mode, and deformation temperature and rate. The article illustrates the microstructural features that appear after substantial deformation when revealed through metallographic investigation.
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005512
EISBN: 978-1-62708-197-9
... on the properties (yield stress, creep behavior, diffusion constants) of the materials being joined and on the condition of the two faying surfaces. Typically, the two surfaces to be bonded are far from smooth on the atomic scale, and the initial contact area between the two surfaces constitutes a very small...
Abstract
The goals of modeling diffusion bonding can be regarded as twofold: to optimize the selection of the process variables for a given material and to provide an understanding of the mechanisms by which bonding is achieved. This article describes the existing models of diffusion bonding with an assumption that the surfaces to be joined are free of contaminants and oxide, that bonding occurs between similar materials, and that the materials are single-phase metals. It discusses the mechanisms considered for diffusion bonding and limitations of existing models.
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003287
EISBN: 978-1-62708-176-4
..., by characterizing the stress and temperature dependence of the creep rate, it is often possible to identify the rate-controlling mechanism for a particular material. Commonly, it is observed that the activation energy for creep is the same as that for diffusion; hence, the term exp − Q c / kT is replaced...
Abstract
Creep deformation is normally studied by applying either a constant load or a constant true stress to a material at a sufficiently high homologous temperature so that a measurable amount of creep strain occurs in a reasonable time. This article provides the phenomenological descriptions of creep and explains the testing and mechanism of creep in crystalline solids. It also presents information on the creep response of crystalline and amorphous solids.
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005404
EISBN: 978-1-62708-196-2
... to be controlled by lattice diffusion. The problem of diffusional creep was first addressed by Nabarro and Herring ( Ref 16 ). Creep deformation occurs as a result of coordinated atom movement between different interfaces that results in a macroscopic shape change. Intrinsically, this is an extremely slow...
Abstract
This article, to develop an understanding of the underlying mechanisms governing deformation at elevated temperatures, discusses the phenomenological effects resulting from temperature-induced thermodynamic and kinetic changes. It describes the deformation behavior of engineering materials using expressions known as constitutive equations that relate the dependence of stress, temperature, and microstructure on deformation. The article reviews the characteristics of creep deformation and mechanisms of creep, such as power-law creep, low temperature creep, power-law breakdown, diffusional creep, twinning during creep deformation, and deformation mechanism maps. It discusses the creep-strengthening mechanisms for most structural engineering components. The article provides a description of the microstructural modeling of creep in engineering alloys.
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005411
EISBN: 978-1-62708-196-2
... coalesce to advance the crack. Such crack growth is dominantly intergranular. The kinetics of cavity growth have been modeled as either diffusive growth or as growth constrained by the deformation of the surrounding grains. These have led to models for rationalizing the correlation between creep crack...
Abstract
The overarching goal of life-prediction research is to develop models for the various types of time dependencies in the crack-tip damage accumulation that occur in materials subjected to elevated temperatures. This article focuses on describing the models based on creep, oxidation kinetics, evolution of crack-tip stress fields due to creep, oxygen ingress, and change in the microstructure. It also provides a summary of creep-fatigue modeling approaches.
Image
Published: 31 October 2011
Fig. 1 Mechanism of diffusion welding. (a) Initial “point” contact and oxide contaminant layer. (b) After some “point” yielding and creep, a thinner oxide layer with large voids results. (c) After final yielding and creep, some voids remain with very thin oxide layer. (d) Continued vacancy
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Image
in Procedure Development and Practice Considerations for Diffusion Welding[1]
> Welding, Brazing, and Soldering
Published: 01 January 1993
Fig. 1 Mechanism of diffusion welding. (a) Initial “point” contact and oxide contaminant layer. (b) After some “point” yielding and creep, a thinner oxide layer with large voids results. (c) After final yielding and creep, some voids remain with very thin oxide layer. (d) Continued vacancy
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Image
Published: 01 January 2000
Fig. 4 Creep data for several fcc metals plotted as a function of normalized shear stress (σ s / G ) compared with a power-law stress exponent of n = 4. Because the activation for creep ( Q in Eq 2 ) is the same as that for diffusion, the term exp (− Q / RT ) in Eq 2 is replaced here
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Series: ASM Handbook
Volume: 14A
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v14a.a0004020
EISBN: 978-1-62708-185-6
... behavior, concurrent grain growth, and high stress behavior. ambient temperature creep mechanisms diffusion creep diffusional flow dislocation creep Nabarro-Herring creep strain hardening CONSTITUTIVE RELATIONS for metalworking include elements of behavior at ambient temperature as well...
Abstract
The constitutive relations for metalworking include elements of behavior at ambient temperature as well as high-temperature response. This article presents equations for strain hardening and strain-rate-sensitive flow, with alternate sections on empirically determined properties, followed by the models of constitutive behavior. It provides a discussion on creep mechanisms involving dislocation and diffusional flow, such as the Nabarro-Herring creep and the Coble creep. The equations for the several creep rates are also presented. Research on the mechanism of the superplastic flow in fine-grain metals has encompassed many ideas, such as the diffusional creep, dislocation creep with diffusional accommodation at grain boundaries, and concepts of grain-mantle deformation. The article concludes with information on the kinetics of superplastic deformation processes, including low stress behavior, concurrent grain growth, and high stress behavior.
Series: ASM Handbook
Volume: 22A
Publisher: ASM International
Published: 01 December 2009
DOI: 10.31399/asm.hb.v22a.a0005433
EISBN: 978-1-62708-196-2
... 22. Coble R.L. , A Model for Boundary Diffusion Controlled Creep in Polycrystalline Materials , J. Appl. Phys. , Vol 34 , 1963 , p 1679 – 1682 23. Raj R. and Ashby M.F. , On Grain Boundary Sliding and Diffusional Creep , Metall. Trans. , Vol 2 , 1971 , p 1113...
Abstract
This article presents a mechanical description of superplasticity and discusses constitutive equations that are essential for simulating superplastic forming processes, applicable to structural superplasticity. It presents the phenomenological constitutive equations of superplasticity and classical physical constitutive equations. The article also reviews the accommodation mechanisms that are divided into two major groups, namely, diffusional accommodation and accommodation by dislocations.
Book Chapter
Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003288
EISBN: 978-1-62708-176-4
... ). Fortunately, all these mechanisms can be fitted into two basic categories: diffusional creep and dislocation creep. In diffusional creep, diffusion of single atoms or ions either by bulk transport (Nabarro-Herring creep) or by grain-boundary transport (Coble creep) leads to a Newtonian viscous type...
Abstract
This article reviews the basic equipment and methods for creep and creep rupture testing. It begins with a discussion on the creep properties, including stress and temperature dependence, as well as of the extrapolation techniques that permit estimation of the long-term creep and rupture strengths of materials. The article describes the different types of equipment for determination of creep characteristics, including test stands, furnaces, and extensometers. It also discusses the different testing methods for creep rupture: constant-load testing and constant-stress testing. The article presents other testing considerations and concludes with information on stress relaxation testing.
Book Chapter
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005606
EISBN: 978-1-62708-174-0
... contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain-boundary diffusion of atoms to the voids and grain-boundary migration. (d) Third stage: volume diffusion of atoms to the voids During...
Abstract
This article provides a qualitative summary of the theory of diffusion bonding, as distinguished from the mechanisms of other solid-state welding processes. Diffusion bonding can be achieved for materials with adherent surface oxides, but the resultant interface strengths of these materials are considerably less than that measured for the parent material. The article describes three stages of diffusion bonding: microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with information on diffusion bonding with interface aids.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001350
EISBN: 978-1-62708-173-3
... bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain boundary diffusion of atoms to the voids and grain boundary migration. (d) Third stage: volume diffusion of atoms...
Abstract
Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding. It discusses factors that affect the relative difficulty of diffusion bonding oxide-bearing surfaces. These include surface roughness prior to welding, mechanical properties of the oxide, relative hardness of the metal and its oxide film, and prestraining or work hardening of the material. The article describes the mechanism of diffusion bonding in terms of microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with a discussion on diffusion bonding with interface aids.
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005556
EISBN: 978-1-62708-174-0
... because these types of welds are, mechanically, quite anisotropic. This includes the case where interlayers may be subjected to residual stresses from fabrication. The loading may be continually increasing, as with a conventional tensile test, or static, as with creep tests. Again, these behaviors...
Abstract
This article discusses the mechanical properties of soft-interlayer solid-state welds and the implications of these behaviors to service stress states and environments. It illustrates the microstructure of as-deposited coatings and solid-state-welded interlayers. The article reviews factors that affect the tensile loading of strength of soft-interlayer welds: the interlayer thickness, the interlayer strain, and the interlayer fabrication method. It also provides information on stress-corrosion cracking of interlayers and stress behavior of these interlayers during shear and multiaxial loading.
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001352
EISBN: 978-1-62708-173-3
.... The loading may be continually increasing, as with a conventional tensile test, or static, as with creep tests. Again, these behaviors are quite different. Additionally, some interlayer/base-metal interfaces have been shown to be susceptible to stress-corrosion cracking when exposed to critical...
Abstract
Soft-interlayer solid-state welds that join stronger base metals have unique mechanical properties that are of fundamental interest and may be of critical importance to designers. This article discusses the mechanical properties of soft-interlayer solid-state welds and the implications of these behaviors to service stress states and environments. It describes the tensile loading of soft-Interlayer welds in terms of the effect of interlayer thickness on stress, interlayer strain, time-dependent failure, effect of base-metal properties, and effect of interlayer fabrication method. The article concludes with a discussion on multiaxial loading.
Image
Published: 31 October 2011
Fig. 2 Sequence of metallurgical stages in diffusion bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain-boundary diffusion of atoms to the voids and grain
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Image
Published: 01 January 1993
Fig. 2 Sequence of metallurgical stages in diffusion bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain boundary diffusion of atoms to the voids and grain
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Series: ASM Handbook
Volume: 14B
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v14b.a0005183
EISBN: 978-1-62708-186-3
... creep mechanisms that are useful for illustrating the strong stress dependence of dislocation and diffusional flow. ambient temperature Isothermal constitutive modeling physical models strain hardening strain-rate-sensitive flow superplastic flow CONSTITUTIVE RELATIONS for metalworking...
Abstract
Constitutive relations for metal-working include elements of behavior at ambient temperature as well as high-temperature response. This article presents the equations for the strain hardening and strain-rate-sensitive flow, with alternate sections on empirically determined properties, followed by models of constitutive behavior. These models include the isothermal constitutive model and the physical model for superplastic flow. A formal description of the superposition of the operative mechanisms for dynamic recovery at hot-working strain rates is also provided. The article describes creep mechanisms that are useful for illustrating the strong stress dependence of dislocation and diffusional flow.
Image
Published: 01 December 1998
Fig. 1 Sequence of metallurgical stages in the DB process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain-boundary diffusion of atoms to the voids and grain-boundary
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