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Book Chapter

Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005612
EISBN: 978-1-62708-174-0
... Abstract This article describes the solid-phase and liquid-phase processes involved in diffusion bonding of metals. It provides a detailed discussion on the diffusion bonding of steels and their alloys, nonferrous alloys, and dissimilar metals. Ceramic-ceramic diffusion welding and a variation...
Book Chapter

Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005606
EISBN: 978-1-62708-174-0
... of bonding, the voids are very small and very likely have no impact on interface strength. Again, diffusional processes cause the shrinkage and elimination of voids, but the only possible diffusion path is now through the volume of the grains themselves. Stage I—Microasperity Deformation The nature...
Book Chapter

By C.C. Bampton
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005512
EISBN: 978-1-62708-197-9
... Abstract The goals of modeling diffusion bonding can be regarded as twofold: to optimize the selection of the process variables for a given material and to provide an understanding of the mechanisms by which bonding is achieved. This article describes the existing models of diffusion bonding...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001350
EISBN: 978-1-62708-173-3
... this third stage of bonding, the voids are very small and very likely have no impact on interface strength. Again, diffusional processes cause the shrinkage and elimination of voids, but the only possible diffusion path is now through the volume of the grains themselves. Stage I: Microasperity Deformation...
Image
Published: 01 January 2006
Fig. 12 Typical lightweight panels produced with diffusion bonding and superplastic forming More
Image
Published: 01 January 2006
Fig. 18 Example of a four-sheet superplastic forming/diffusion bonding process in which the outer sheets are formed first and the center sheets are then formed and bonded to the outer two sheets More
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Published: 31 October 2011
Fig. 1 Superplastic forming/diffusion bonding (SPF/DB) of titanium sheet. (a) Sequence of operations required to join three sheets of superplastic titanium alloy using the SPF/DB process. (b) Typical three-sheet titanium alloy component superplastically formed following diffusion bonding More
Image
Published: 31 October 2011
Fig. 2 Sequence of metallurgical stages in diffusion bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain-boundary diffusion of atoms to the voids and grain More
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Published: 01 December 1998
Fig. 53 Cross section of the SPF process combined with diffusion bonding (SPF/DB). The process shown utilizes pre-placed details to which the superplastic sheet is bonded. More
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Published: 01 November 2010
Fig. 1 Sequence of diffusion bonding in Ti-6Al-4V under a pressure gradient. Source: Ref 5 More
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Published: 01 December 2009
Fig. 18 Diffusion-bonding concentration profiles predicted by the error function Eq 115 . For n = 1, the thin-film solution and the error function solution are nearly the same. For n = 0.25, the profiles appear to overlap. More
Image
Published: 01 January 1993
Fig. 1 Superplastic forming/diffusion bonding (SPF/DB) of titanium sheet. (a) Sequence of operations required to join three sheets of superplastic titanium alloy using SPF/DB process. (b) Typical three-sheet titanium alloy component superplastically formed following diffusion bonding. More
Image
Published: 01 January 1993
Fig. 2 Sequence of metallurgical stages in diffusion bonding process. (a) Initial contact: limited to a few asperities (room temperature). (b) First stage: deformation of surface asperities by plastic flow and creep. (c) Second stage: grain boundary diffusion of atoms to the voids and grain More
Image
Published: 01 January 1997
Fig. 9 Processing sequence during diffusion bonding of a titanium part using stainless steel tooling. Source: Ref 13 More
Image
Published: 01 December 2004
Fig. 45 Ti-6Al-4V plate diffusion-bonded joint (bonded at 925 °C, or 1700 °F) illustrating bond-line contamination. The white horizontal band is an area of O 2 and/or N 2 enrichment. An alpha case is also observable on the exterior surface. Etchant: 50 mL H 2 O, 50 mL 10% oxalic acid, 1 mL More
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Published: 30 September 2015
Fig. 17 Scanning electron micrograph of diffusion-bonded elements on steel powder. Source: Ref 16 ; used with permission More
Image
Published: 01 December 2004
Fig. 28 Polished section of a diffusion-bonded joint between a coarse-grained and a fine-grained alumina ceramic (99.7% Al 2 O 3 ) thermally etched in air at 1400 °C (2550 °F) for 1 h. 500× More
Image
Published: 01 January 2005
Fig. 4 Diffusion roll bonding process More
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003056
EISBN: 978-1-62708-200-6
..., and the more advanced joining of nonoxide ceramics. It also discusses metallizing, brazing, diffusion bonding, and chemical bonding. brazing ceramic-ceramic joining ceramic-metal joining chemical bonding diffusion bonding glass-metal sealing metallizing nonoxide ceramics MANY APPLICATIONS...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003209
EISBN: 978-1-62708-199-3
... are engulfed within grains where they are no longer in contact with a grain boundary. During this third stage of bonding, the voids are very small and very likely have no impact on interface strength. Again, diffusional processes cause the shrinkage and elimination of voids, but the only possible diffusion...