1-20 of 180 Search Results for

dielectric films

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001285
EISBN: 978-1-62708-170-2
... Systems Hybrid PECVD Systems Silicon Nitride Films Silicon Oxide Films Silicon Oxynitride Films Amorphous Silicon Films Polycrystalline Silicon Films Epitaxial Films Conductive Films Process Description Types of PECVD Systems PECVD of Dielectric Films PECVD of Amorphous...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001295
EISBN: 978-1-62708-170-2
... technique. For non-dielectric films, the Del / Psi trajectory does not close on itself. An example is shown in Fig. 7 . Conceptually, with no film present, the Del / Psi point represents the substrate. When there is a thick film of an opaque material present, the Del / Psi point will represent...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001294
EISBN: 978-1-62708-170-2
... needs to be versatile to switch between the superconductor and the insulating material. The first generation of passive microwave electronics based on HTS thin films were fabricated from patterned superconducting thin films deposited onto one side of low-dielectric substrates. MgO and LaAlO 3...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003026
EISBN: 978-1-62708-200-6
... losses and very high electrical resistivity; useful to over 260 °C (500 °F) and to below −185 °C (−300 °F); excellent high-frequency dielectric; among the best combinations of mechanical and electrical properties Compression moldings, stock shapes, film Polyvinylidine fluoride Good electrically...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
... materials. The most notable examples of these applications are sputtering targets (source material) and etch-resistant dielectric coatings used in thin-film processing tools. Furthermore, a new variation of vacuum plasma spraying (the so-called low-pressure plasma spray/thin film or plasma spray/physical...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
.... Rymaszewski E.J. , High-Dielectric Constant Thin Films for High-Performance Applications , Proc. DARPA Physical Electronic Packaging Program Review , Washington, DC , March 1993 8. Liu W.-T. , Cochrane S. , Beckage P. , Knorr D.B. , Lu T.-M. , Borrego J.M...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... with an expansion coefficient relatively close to that of silicon and, in consequence, is being rapidly developed for substrate use. Thin-film insulators (including SiO 2 and other oxides, glasses, and Si 3 N 4 ) have been developed as interlayer dielectric and as thin-film passivation for integrated circuit...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003435
EISBN: 978-1-62708-195-5
... changes in the film layer. See text for more. Nuclear magnetic resonance (NMR) Boeing Rising in importance for fiber placement Fig. 3 Dielectric loss versus frequency for a typical epoxy resin Fig. 4 Dielectric loss versus cure time for typical epoxy resins Fig. 5...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003049
EISBN: 978-1-62708-200-6
... and electronic insulators. The dielectric materials can be of either bulk, thick film, or thin film form. Piezoelectrics are materials that deform upon the application of an electric field, or conversely, that develop an electric potential when strained. To be effective, these ceramics require poling, a process...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002464
EISBN: 978-1-62708-194-8
... PET 0.60 PBT 0.60 Nylon 6 0.70 Nylon 6/6 0.75 Source: Ref 28 Electrical properties of selected plastics Table 10 Electrical properties of selected plastics Plastic Surface resistivity, Ω Volume resistivity, Ω · cm Dielectric strength, kV/mm Dielectric constant...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001233
EISBN: 978-1-62708-170-2
... ( Ref 6 ). Dissolution at or above the limiting current therefore yields smooth surfaces (0.12 to 0.2 μm R a ). Pulsed dissolution is considered most suitable for electrochemical micromachining of thin films and foils when low dissolution rates are desirable for better control over the machining...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003677
EISBN: 978-1-62708-182-5
..., the potential gradient across the metal/passive film/double layer/solution interface is defined by Eq 4 , which is dependent on the oxide thickness, the Helmholtz double-layer thickness, as well as the dielectric constants of the oxide and the double layer. It can be assumed that the dielectric constant...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001469
EISBN: 978-1-62708-173-3
... are the: Dielectric welding is a fast, efficient joining method for sealing thin polymer films and sheet materials. The equipment can be readily automated. However, the process can only be used on materials that have a high dielectric loss factor, such as rigid or flexible PVC, ABS, and thermoplastic polyurethane...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003600
EISBN: 978-1-62708-182-5
.... Fig. 2 Atomic force micrographs of the surface of an integrated circuit wafer after (a) tungsten polishing and (b) tungsten plasma etchback. ILD, interlayer dielectric Fig. 3 Damascene structure of 0.13 μm copper interconnects after copper chemical-mechanical planarization. (a) View from...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003465
EISBN: 978-1-62708-195-5
..., and dielectric analysis. The article also provides an overview of the composite failure modes affected by matrix resin and testing approach. References References 1. Prime R.B. , Thermal Characterization of Polymeric Materials , 2nd ed. , Vol 2 , Turi E.A. , Ed., Academic Press , 1997...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006547
EISBN: 978-1-62708-290-7
... Ring oscillators 1 36 Authentication (RGB circles) 1 32 Sensors 4 37 – 40 Solar cells 5 20 , 25 – 28 Technology demonstrations 7 16 , 41 – 46 Thin-film transistors 10 19 , 47 – 55 RGB, red, green, and blue Performance indicator comparison Table 2...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003194
EISBN: 978-1-62708-199-3
... Table 1 Process summary chart for ECM and EDM Electrochemical machining (ECM) Electrical discharge machining (EDM) Principle Controlled metal removal by anodic dissolution. Direct current (dc) current passes through flowing film of conductive solution that separates workpiece from...
Book: Machining
Series: ASM Handbook
Volume: 16
Publisher: ASM International
Published: 01 January 1989
DOI: 10.31399/asm.hb.v16.a0002162
EISBN: 978-1-62708-188-7
... the workpiece surface, but differs from EDG in using a highly conductive electrolyte instead of a dielectric fluid and in using low-voltage, pulsating direct current. Like ECG, electrochemical discharge grinding is most useful for grinding carbide tools, hardened tool steel, nickel-base alloys, and parts...
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006048
EISBN: 978-1-62708-172-6
... other coatings, such as pastes, dips, and hot-applied wax flood coatings, wax-impregnated fabrics (which are sometimes laminated to a barrier plastic film) provide an effective mechanical, moisture, and dielectric barrier. Types of fabrics that are impregnated can include spun-bonded polyester...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003009
EISBN: 978-1-62708-200-6
... thermoplastics at room temperature. They do, however, retain high strength, corrosion resistance, and dielectric integrity over a wider range of environmental variables. Advanced thermoplastics include acetals, polysulfones, fluoropolymers, polyamides (nylons), polyamide-imides, polyarylates, polyketones...