In terms of their electrical properties, plastics can be divided into thermosetting and thermoplastic materials, some of which are conductive or semiconductive. This article provides detailed information on factors that affect the property of plastics. It discusses the major test methods used to determine the following dielectric properties of plastics: dielectric breakdown voltage, dielectric strength, dielectric constant, dissipation factor, arc tracking resistance, insulation resistance, volume, and surface resistivity or conductivity. The test specifications and conditions, recommended by several U.S. and foreign testing organizations for characterizing the electrical properties of plastic materials are listed. The article describes the influence of these properties on selection of plastics for insulation application. An outline of the electromagnetic shielding and testing methods of electromagnetic interference are also provided. Designations, electrical properties, and applications of elastomers are tabulated.

This article is a collection of tables that present information on the physical properties of periodic table elements, and maximum service temperatures, dielectric constants and typical dielectric properties of selected nonmetallic materials.

Electromagnetic signals at microwave and millimeter-wave frequencies are well suited for inspecting dielectric materials and composite structures in many critical applications. This article presents a partial list of reported nondestructive testing (NDT) application areas for microwaves. It discusses the advantages and limitations of inspection with microwaves. The article discusses the physical principles, including reflection and refraction, absorption and dispersion, scattering, and standing waves. It provides a discussion on terahertz (THz) imaging for nondestructive evaluation (NDE). The article concludes with information on ground-penetration radar (GPR) that uses electromagnetic radiation and detects the reflected signals from subsurface structures.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

This article discusses the types, oxide composition, as well as mechanical and physical properties of general-purpose and special-purpose glass fibers. It describes the glass melting and fiber forming processes and provides information on important commercial products such as continuous roving, woven roving, fiberglass mat, chopped strand, and textile yarns.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.

This article discusses the attempts made by the industry to create sensing approaches for modeling a process, part, and chemistry and kinetics. It reviews microwave curing of thick-section composites and the resin cure sensors that are used for resin cure monitoring. These include dielectric cure sensors, fiberoptics-based resin cure sensors, ultrasonics-based resin cure sensors, and dosimetry-based resin cure sensors. The article provides information on the resin cure control flow sensing, flow modeling, flow mapping, and resin flow. It addresses some practical issues in sensing resin cure and flow.

This article provides an overview of the various types of unsaturated polyester resins and low-profile additives. The resins include general-purpose resins, isophthalic resins, bisphenol A fumarate resins, chlorendic resins, and vinyl ester resin. The article describes the mechanical and electrical properties, thermal and oxidative stability, and chemical and ultraviolet (UV) resistance of polyester resins. It concludes with a discussion on the flame-retardant polyester resins.

The design and analysis of aerospace and industrial composite components and assemblies requires a detailed knowledge of materials properties, which, in turn, depend on the manufacturing, machining, and assembly methods used. This article, through several tables and graphs, provides the mechanical properties, physical properties, and service characteristics of representative composite fiber-resin combinations, including thermoplastic matrix composites such as thermoplastic polyester resins, thermoplastic polyamide resins, and thermoplastic polysulfone resins, and thermoset matrix composites such as thermoset polyester resins, thermoset phenolic resins, thermoset epoxy resins, thermoset polyimide resins, and thermoset bismaleimide resins.

This article discusses the materials and properties of polymer-matrix composites to characterize each generic material according to its composition and method of manufacture. It contains a table that lists the key physical, mechanical, thermal, and electrical properties, and in-service conditions of concern for resin-matrix composites. Axes definitions, symbols, and special property calculations for composite material property tests are reviewed. The article provides an overview of the performance capabilities of selected polymer-matrix composite materials such as thermoplastic-matrix composites and thermoset-matrix composites. The thermoplastic-matrix composites include thermoplastic polyester resins and fiber resin composites; thermoplastic polyamide resins and fiber-resin composites; and thermoplastic polysulfone resins and fiber-resin composites.

Cyanate ester resins are a family of high-temperature thermosetting resins that bridge the gap in thermal performance between engineering epoxy and high-temperature polyimides. This article discusses the chemistry, properties and characteristics of the cyanate ester resins. It describes the processing procedures for the cyanate ester resins and provides information on properties for selected applications, such as space applications, radomes, and printed circuit boards.

This article describes the classification of organic solvents, namely, aprotic and protic solvents and one-component and multi-component systems. It discusses the corrosion behavior in aprotic and protic solvents. The article contains a table that presents the relationship among solution conductivity, acidity, and the corrosion rates of type 304 stainless steel in protic and aprotic solvents. The article reviews important environmental variables that influence corrosion testing in organic liquids.

This article discusses the most fundamental building-block level, atomic level, molecular considerations, intermolecular structures, and supermolecular issues. It contains a table that shows the structures and lists the properties of selected commodity and engineering plastics. The article describes the effects of structure on thermal and mechanical properties. It reviews the chemical, optical, and electrical properties of engineering plastics and commodity plastics. An explanation of important physical properties, many of which are unique to polymers, is also included. The factors that must be considered when processing engineering thermoplastics are discussed. These include melt viscosity and melt strength; crystallization; orientation, die swell, shrinkage, and molded-in stress; polymer degradation; and polymer blends.

This article provides a background of the complex relationship between titanium and its alloys with aqueous environments, which is dictated by the presence of a passivating oxide film. It describes the corrosion vulnerability of titanium and titanium oxides by the classification of oxide failure mechanisms. The mechanisms are spatially localized oxide film breakdown by the ingress of aggressive anions; spatially local or homogenous chemical dissolution of the oxide in a strong reducing-acid environment; and mechanical disruptions or depassivation such as scratching, abrading, or fretting. Titanium alloys can be classified into three primary groups such as titanium alloys with hexagonal close-packed crystallographic structure; beta titanium alloys with body-centered cubic crystallographic structures; and alpha + beta titanium alloys including near-alpha and near-beta titanium alloys. The article also illustrates the effects of alloying on active anodic corrosion of titanium and repassivation behavior of titanium and titanium-base alloys.

This article provides a summary of the concepts discussed in the articles under the Section “Constituent Materials” in ASM Handbook, Volume 21: Composites. The Section describes the major matrix resins and reinforcing fibers used in composite materials, as well as some of the intermediate material forms available for composite fabrication.

The thermal spray community serves the printing industry with a variety of protective coatings applied on behalf of original equipment makers and end users. This article describes the applications of thermal spray coating for printing equipment such as engraver rolls, plate and blanket cylinders, corona rolls, and draw rolls.

This article discusses the application of amorphous and crystalline films through plasma-enhanced chemical vapor deposition (PECVD) from the view point of microelectronic device fabrication. It describes the various types of PECVD reactors and deposition techniques. Plasma enhancement of the CVD process is discussed briefly. The article also describes the properties of amorphous and crystalline films deposited by the PECVD process for integrated circuit fabrication.

Advanced thermoplastics are stiff, moldable plastics that compete with traditional engineering thermoplastics and thermosets owing to their good tensile, compressive, impact, and shear strength, electrical properties, and corrosion resistance. This article discusses commercial forms, family characteristics, properties and applications of the following advanced thermoplastics: homopolymer and copolymer acetals, fluoropolymers, ionomers, polyamides, polyamide-imides, polyarylates, polyketones, polyaryl sulfones, polybutylene terephthalates, polycarbonates, polyether-imides, polyether sulfones, polyethylene terephthalates, thermoplastic polyimides, liquid crystal polymers, polyphenylene ether blends, polyphenylene sulfides, and polysulfones.

A thermosetting resin, or thermoset, is a synthetic organic polymer that cures to a solid, infusible mass by forming a three-dimensional network of covalent chemical bonds. Significant applications include construction and thermoset engineering plastics. This article discusses the general and family characteristics of thermosetting resin families, including allyls, aminos (urea formaldehyde and melamine formaldehyde), cyanates, epoxies, polybenzimidazoles, unsaturated polyesters, thermoset polyimides, phenolics, and vinyl esters. It also explains processing methods, including curing and curing agents. The article provides descriptions of commercial product forms and the wide array of applications of thermosetting resins. It also tabulates the performance properties (mechanical, thermal, electrical and chemical resistance) of some families of unfilled or unreinforced thermosetting resins and reinforced or filled grades.