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dicyandiamide

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Published: 30 September 2015
Fig. 29 Dicyandiamide structure More
Image
Published: 01 January 2003
Fig. 18 Structure of dicyandiamide More
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Published: 01 January 2003
Fig. 19 Melamine, formed by the reaction of three molecules of dicyandiamide to form two molecules of melamine More
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006077
EISBN: 978-1-62708-172-6
..., and dicyandiamides. Other curatives include polyester co-polymers, phenolic co-polymers, melamine and urea formaldehyde co-polymer resins, phosphate flame retardants, ultraviolet and electron beam curing of epoxy resins, Mannich bases, Mannich-based adducts, and anhydrides. The article concludes by discussing...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003692
EISBN: 978-1-62708-182-5
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003362
EISBN: 978-1-62708-195-5
... of an accelerator ( Ref 22 ). Miscellaneous Curing Agents Dicyandiamide (generally referred to as “dicy”) is widely used as an epoxy curative in composite applications where room-temperature stability is desired and rapid elevated- temperature cure is attractive. It may be employed as a sole curing agent...
Book Chapter

Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003360
EISBN: 978-1-62708-195-5
... resins are 4,4′-diaminodiphenylsulfone and dicyandiamide. Other curatives are too reactive with the epoxies at low and room temperatures, resulting in an unacceptable reduction of storage and use life. Dicyandiamide appears to decompose at elevated temperatures of 145 to 154 °C (290 to 310 °F) to yield...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003441
EISBN: 978-1-62708-195-5
..., and a curing agent. For example, most applications requiring a service temperature up to 120 °C (250 °F) would combine DGEBA (epoxy A) and/or DGEBA with epoxidized phenol novolac resins (epoxy B) with a dicyandiamide curing agent and tertiary amine salt catalyst. An example of a current state-of-the-art...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003033
EISBN: 978-1-62708-200-6
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006007
EISBN: 978-1-62708-172-6
..., and, conversely, basic-cure coating systems are more resistant to high-pH, caustic environments. The selected curing agent should be latent at room temperature and highly reactive at application temperature. Amine Functional Curing Agents Aromatic amines and dicyandiamide are the amines most used...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003010
EISBN: 978-1-62708-200-6