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desk
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Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.9781627081993
EISBN: 978-1-62708-199-3
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.9781627082006
EISBN: 978-1-62708-200-6
Book Chapter
Book: Alloy Phase Diagrams
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006247
EISBN: 978-1-62708-163-4
... as revised diagrams produced for Desk Handbook: Phase Diagrams for Binary Alloys (2000) and Desk Handbook: Phase Diagrams for Binary Alloys (2nd Ed.) (2010)—two collections of binary phase diagrams published by ASM International since 1992. The source, or in some cases more than one source...
Image
Published: 01 June 2016
Fig. 17 Binary copper-beryllium phase diagram plotted versus atomic percent beryllium. Source: Desk Handbook of Binary Phase Diagram , 2 nd Edition, page 132. This section of the beryllium-copper phase diagram was presented by the author at the 1991 TMS fall meeting in Cincinnati, OH.
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Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001397
EISBN: 978-1-62708-173-3
... Handbook Desk Edition , American Society for Metals , 1985 , p 30–8 to 30–9 ...
Abstract
Resistance soldering (RS) can be applied to electrically conductive materials that allow the passage of electric current. The process can be used for selective spot soldering of small components, for the soldering of closely placed parts on an assembly, or for heat restriction when necessary. This article explains that the RS process can be used in all soldering operations and with all solderable metals. It provides information on the applications, preassembly practices, the equipment used and the training required for soldering personnel.
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... International , Nov 1994 , p 181 – 187 5. Axtell S. , Failure Analysis of Thick-Film Resistors in Sulfur-Containing Environments , Microelectronic Failure Analysis Desk Reference, 2002 Supplement , Kane T. , Ed., Electronic Device Failure Analysis Society, affiliate of ASM...
Abstract
This article focuses on the various types of corrosion-related failure mechanisms and their effects on passive electrical components. The types include halide-induced corrosion, organic-acid-induced corrosion, electrochemical metal migration, silver tarnish, fretting, and metal whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware.
Image
in Electrical/Electronic Applications for Advanced Ceramics
> Engineered Materials Handbook Desk Edition
Published: 01 November 1995
Fig. 14 Piezoelectric transformer
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Image
in Electrical/Electronic Applications for Advanced Ceramics
> Engineered Materials Handbook Desk Edition
Published: 01 November 1995
Fig. 15 Piezoelectric buzzer
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