Search Results for deposit thickness

This article describes the steps, bath composition and characteristics, equipment, plating rate, deposit thickness, and applications for different types of nonelectrolytic deposition processes, including electroless nickel plating, electroless copper plating and mechanical plating.

This article discusses the corrosion of chromium electrodeposits and the ways for optimizing corrosion resistance. It describes the processing steps and conditions for hard chromium plating. These steps include pretreatment, electroplating, and posttreatment. The article also provides information on duplex coatings and the applications of chromium electrodeposits.

Selective plating, also known as brush plating, differs from traditional tank or bath plating in that the workpiece is not immersed in a plating solution (electrolyte). Instead, the electrolyte is brought to the part and applied by a handheld anode or stylus, which incorporates an absorbent wrapping for applying the solution to the workpiece (cathode). This article focuses on the selective plating systems that include a power pack, plating tools, anode covers, specially formulated plating solutions, and any auxiliary equipment required for the particular application. It provides a detailed account of the applications of selective plating, with examples. The article describes the advantages, limitations, key process elements, and health and safety considerations of selective plating. It also includes the most important industrial, government, and military specifications.

This article describes the factors to be considered while performing electroforming process. The factors include the shape and size of the mold, expected durability of the mold, required delivery time, and manufacture and cost of the necessary mandrel. The article discusses mandrel fabrication by either the use of fiberglass/resins or by the machining of the mandrel directly from computer-aided design data. It provides a comparison of nickel and other tooling materials in terms of coefficients of thermal expansion, thermal cycles for compression molding, and thermal cycles for metal autoclave molds.

This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants.

In the friction surfacing process, a rotating consumable is brought into contact with a moving substrate, which results in a deposited layer on the substrate. This article describes the process as well as the equipment used. It also provides information on the applications of the friction surface process.

The friction surfacing process enables deposition of a wide variety of high-specification materials with an ideal metallurgical bond onto a range of metal substrates. This article provides a process description and discusses the equipment used for, and the applications of, friction surfacing.

Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative and industrial applications of gold plating. The article reviews factors affecting the dragout of gold solution.