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dendrites
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Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005521
EISBN: 978-1-62708-197-9
... Abstract This article discusses the three different modeling approaches for grain structures formed during solidification of metallic alloys: direct modeling of dendritic structure, direct modeling of grain structure, and indirect modeling of grain structure. The main construction bases...
Abstract
This article discusses the three different modeling approaches for grain structures formed during solidification of metallic alloys: direct modeling of dendritic structure, direct modeling of grain structure, and indirect modeling of grain structure. The main construction bases, the scale at which it applies, and the mathematical background are presented for each modeling approach. The article concludes with a table that presents a comparison of the main inputs/outputs, approximations, numerical methods, kinetics laws, and applications for the three approaches to modeling of dendritic grain solidification.
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Published: 01 January 1987
Fig. 804 Lower-magnification view of the exposed dendrites in the shrinkage cavity in the cast specimen of 18% Ni, grade 300, maraging steel in Fig. 803 , showing dendrites that formed at different orientations. Had this casting been properly risered, the channels between the dendrite arms
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Published: 01 January 2006
Fig. 20 Back side of failed surface-mounted chip resistor showing silver dendrites. Courtesy of Pat Kader, ENI
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Published: 01 January 2006
Fig. 21 Scanning electron micrograph of lead dendrites on substrate of failed thick-film-hybrid resistor network
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Published: 01 January 2006
Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board
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in Corrosion and Related Phenomena in Portable Electronic Assemblies
> Corrosion: Environments and Industries
Published: 01 January 2006
Fig. 6 Tin electrochemical migration (ECM) involving both formation of dendrites and colloidal form of ECM on a resistor with pure tin termination.
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Published: 01 January 2006
Fig. 2 Tin dendrites growing between two adjacent solder joints on failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume.
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Published: 01 January 2006
Fig. 3 Backside of failed surface-mounted chip resistor showing silver dendrites. Courtesy of Pat Kader, ENI. See the article “Corrosion in Passive Electrical Components” in this Volume.
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Published: 01 December 2008
Fig. 5 Titanium-rich areas in dendrites of Al-0.06%Ti alloy. Source: Ref 8
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Published: 01 December 2008
Fig. 1 Equiaxed dendrites that form from an undercooled liquid
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Published: 01 December 2004
Fig. 7 Dendrites in cyclohexanol, an organic compound that crystallizes like a metal. 45×
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Published: 01 December 2004
Fig. 12 Macrostructure of an Al-12.7Si alloy showing equiaxed grains and dendrites. Etchant: modified Poulton reagent (60% HCl, 30% HNO 3 , 5% HF, 5% H 2 O). Original magnification 5×
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Published: 01 December 2004
Fig. 23 Typical dendrites in an A356 alloy in a computer-processed image. Etchant: modified Poulton reagent (60% HCl, 30% HNO 3 , 5% HF, 5% H 2 O)
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Published: 01 December 2004
Fig. 24 Scanning electron micrography image of aluminum dendrites in the fractured surface of a tensile test bar of an A356.0 alloy
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Published: 01 December 2004
Fig. 29 Secondary electron microscopy image of dendrites and eutectic from an Al-12.7Si cast specimen. Silicon microsegregation between the dendrites of solid solution and eutectic revealed by electron probe microanalysis
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Published: 01 December 2004
Fig. 18 Possible growth morphology consisting of β dendrites and the associated peritectic α p phase. Source: Ref 19
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in Metallography and Microstructures of Precious Metals and Precious Metal Alloys
> Metallography and Microstructures
Published: 01 December 2004
Fig. 34 Microstructure of dendrites on fractured petal of gold jewelry. 50×
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Published: 01 December 2004
Fig. 18 Sn-30Pb alloy (soft solder). Dendrites of tin-rich solid solution (light) in a matrix of tin-lead eutectic. Figure 19 shows the structure of the eutectic. Etchant 2, Table 1 . 150×
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Published: 01 December 2004
Fig. 22 Sn-40Pb alloy (soft solder). Structure consists of small dendrites of lead-rich solid solution (dark) in a fine matrix of globular tin-lead eutectic. Etchant 7, Table 1 . 150×
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Published: 01 December 2004
Fig. 23 Sn-50Pb alloy. Dendrites of lead-rich solid solution (dark) in a matrix of fine lamellar eutectic consisting of lead-rich solid solution (dark) and tin (light). Etchant 7, Table 1 . 150×
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