Molten salt, including nitrite/nitrate salts, is the quenching medium most commonly used in austempering and marquenching of ferrous materials. This article describes the use of molten salts in the quenching of ferrous materials. It provides information on the processing and operation of salt quenching including considerations of time, temperature, environment, and safety, as well as critical characteristics such as the composition of the quenchant, agitation, and water additions.

This article provides an overview of common quenching media, the factors involved in the mechanism of quenching, and process variables, namely, surface condition, mass and section size of the workpiece, and flow rate of the quenching liquid. It describes the methods of quenchant characterization using hardening-power and cooling-power tests. The article discusses the fundamentals involved in heat-transfer coefficient and heat flux of quenching processes. This discussion is followed by various actual examples of applications of these methods using simplified equations. Quenchant evaluation, classification, selection, and maintenance are reviewed in detail. The article addresses the various reasons for quench oil variability and complications due to aging and contamination.

Soldering is defined as a joining process by which two substrates are bonded together using a filler metal with a liquidus temperature. This article provides an overview of fundamentals of soldering and presents guidelines for flux selection. Types of fluxes, including rosin-base fluxes, organic fluxes, inorganic fluxes, and synthetically activated fluxes, are reviewed. The article describes the joint design and precleaning and surface preparation for soldering. It addresses some general considerations in the soldering of electronic devices. Soldering process parameters, affecting wetting and spreading phenomena, such as temperature, time, vapor pressure, metallurgical and chemical nature of the surfaces, and surface geometry, are discussed. The article also describes the applications of furnace soldering, resistance soldering, infrared soldering, and ultrasonic soldering. It contains a table that lists tests commonly used to evaluate the solderability properties of selected soldered components.