This article endeavors to familiarize the reader with a selection of different ionization designs and instrument components to provide knowledge for sorting the various analytical strategies in the field of solid analysis by mass spectrometry (MS). It begins with a description of the general principles of MS. This is followed by sections providing a basic understanding of instrumentation and discussing the operating requirements as well as practical considerations related to solid sample analysis by MS. Instrumentation discussed include the triple quadrupole mass spectrometer and the time-of-flight mass spectrometer. Inductively coupled plasma and thermal ionization MS provide atomic information, and direct analysis in real-time and matrix-assisted laser-desorption ionization MS are used to analyze molecular compositions. The article describes various factors pertinent to ionization methods, namely glow discharge mass spectrometry and secondary ion mass spectrometry. It concludes with a section on various examples of applications and interpretation of MS for various materials.

This article is a detailed account of optical emission spectroscopy (OES) for elemental analysis. It begins with a discussion on the historical background of OES and development trends in OES methods. This is followed by a description of the general principles and optical systems of OES, along with various types of emission sources commonly used for OES. Some of the processes involved in calibration and quantification of OES for direct solids analysis by the ratio method are then described. The article ends with a discussion on the applications of each type of emission sources.

Field ion microscopy (FIM) can be used to study the three-dimensional structure of materials, such as metals and semiconductors, because successive atom layers can be ionized and removed from the surface by field evaporation. The ions removed from the surface by field evaporation can be analyzed chemically by coupling to the microscope a time-of-flight mass spectrometer of single-particle sensitivity, known as the atom probe (AP). This article describes the principles, sample preparation, and quantitative analysis of FIM. It also provides information on the principles, instrument design and operation, mass spectra and their interpretation, and applications of AP microanalysis.

Atomic absorption spectrometry (AAS) is generally used for measuring relatively low concentrations of approximately 70 metallic or semimetallic elements in solution samples. This article describes several features that are common to three techniques, namely, AAS, atomic emission spectrometry (AES), and atomic fluorescence spectrometry (AFS). It discusses the reasons for the extreme differences in AAS sensitivities that affect AFS and AES. The article provides information on the advantages and disadvantages of the Smith/Hieftje system and two types of background correction systems, namely, the continuum-source background correction and Zeeman background correction. It also provides a list of applications of conventional AAS equipment, which includes most of the types of samples brought to laboratories for elemental analyses.

Accelerated life testing and aging methodologies are increasingly being used to generate engineering data for determining material property degradation and service life (or fitness for purpose) of plastic materials for hostile service conditions. This article presents an overview of accelerated life testing and aging of unreinforced and fiber-reinforced plastic materials for assessing long-term material properties and life expectancy in hostile service environments. It considers various environmental factors, such as temperature, humidity, pressure, weathering, liquid chemicals (i.e., alkalis and acids), ionizing radiation, and biological degradation, along with the combined effects of mechanical stress, temperature, and moisture (including environmental stress corrosion). The article also includes information on the use of accelerated testing for predicting material property degradation and long-term performance.

This article provides an overview of plasma surface treatments for plastics. It covers the equipment and methods used in plasma processing, providing detailed explanations of the plasma discharge reactions and how they affect surface state and topography. It also provides information on contamination removal, plasma surface modification, plasma-induced grafting, and plasma film deposition.

This article provides a brief account of glow discharge mass spectrometry (GDMS) for direct determination of trace elements in solid samples and for fast depth profiling in a great variety of innovative materials. It begins by describing the general principles of GDMS. This is followed by a discussion on the various components of a GDMS system as well as commercial GDMS instruments. A description of processes involved in specimen preparation and cleaning in GDMS is then presented. Various problems pertinent to multielemental calibrations in GDMS are discussed along with measures to overcome them. The article further provides information on the processes involved in the analytical setup of parameters in GDMS, covering the steps involved in the analysis of GDMS data. It ends with a section on the application and interpretation of GDMS in the metals industry.

The plasma carburizing process is basically a low-pressure carburizing process making use of a high-voltage electrical field applied between the load to be treated and the furnace wall producing activated and ionized gas species responsible for carbon transfer to the workpieces. This article begins with an overview of the theoretical background and the range and limitations of glow-discharge plasma. It describes the plasma carburizing process, which is carried out with methane or propane. Plasma carburizing processes of sinter metals and stainless steels, and the influence of current pulse length on carbon input of low-pressure carburizing process are also described. The article presents the basic requirements and process parameters to be considered in plasma carburizing equipment. It also exemplifies a still-working plasma process in industrial measure.

This article discusses the fundamentals of thermal vaporization and condensation and provides information on the various vaporization sources and methods of vacuum deposition. It offers an overview of reactive evaporation and its deposition techniques. The article also explains the advantages, limitations, and applications of vacuum deposition processes. Finally, it provides information on the gas evaporation process, its processing chamber, and related systems.

This article is a compilation of abbreviations of terms, techniques, standards, compounds, and properties of materials that are relevant to the characterization and failure analysis of plastics.

Vapor-deposition processes fall into two major categories, namely, physical vapor deposition (PVD) and chemical vapor deposition (CVD). This article describes major deposition processes such as sputtering, evaporation, ion plating, and CVD. The list of materials that can be vapor deposited is extensive and covers almost any coating requirement. The article provides a table of some corrosion-resistant vapor deposited materials. It concludes with an overview of the applications of CVD and PVD coatings and a discussion on coatings for graphite, the aluminum coating of steel, and alloy coatings for aircraft turbines, marine turbines, and industrial turbines.

Ion implantation involves the bombardment of a solid material with medium-to-high-energy ionized atoms and offers the ability to alloy virtually any elemental species into the near-surface region of any substrate. This article describes the fundamentals of the ion implantation process and discusses the advantages, limitations, and applications of ion implantation. It also reviews a typical medium current semiconductor implanter adapted for implantation of metals with the aid of illustrations.

Spark source mass spectrometry (SSMS) is an analytical technique used for determining the concentration of elements in a wide range of solid samples, including metals, semiconductors, ceramics, geological and biological materials, and air and water pollution samples. This article discusses the basic principles of spark source technique; SSMS instrumentation such as ion source, electric sector, and magnetic sector; sample preparation; and test procedures of SSMS. Some of the related techniques to SSMS are laser ionization mass spectrometry and laser-induced resonance ionization mass spectrometry. The ions produced in SSMS are detected by either the photometric method or electrical detection method and quantitatively measured by techniques such as internal standardization techniques, isotope dilution, multi element isotope dilution, and dry spike isotope dilution. The detected spark source spectrum contains all the elemental data of the tested sample. Finally, the article exemplifies the applications of SSMS.

Plasma (ion) nitriding is a method of surface hardening using glow-discharge technology to introduce nascent (elemental) nitrogen to the surface of a metal part for subsequent diffusion into the material. This article describes the procedures and applications of plasma nitriding methods of steel. These methods include direct-current plasma nitriding, pulsed-current plasma nitriding, and active-screen plasma nitriding. The article reviews cold-walled and hot-walled furnaces used for plasma nitriding. It provides information on the importance of controlling three process parameters: atmosphere, pressure, and part temperature. The article includes a discussion on the influence of nitrogen concentration on case structure formation on nitrided steel, and explains the significance of microstructure, hardness, and fatigue strength on nitrided case. It also discusses processing, laboratory studies, and applications of nitrocarburizing of steel.

Inductively coupled plasma atomic emission spectroscopy (ICP-AES) is an analytical technique for elemental determinations in the concentration range of major to trace based on the principles of atomic spectroscopy. This article provides a description of the basic atomic theory, and explains the analytical procedures and various interference effects of ICP, namely, spectral, vaporization-atomization, and ionization. It provides a detailed discussion on the principal components of an analytical ICP system, namely, the sample introduction system; ICP torch and argon gas supplies; radio-frequency generator and associated electronics; spectrometers, such as polychromators and monochromators; detection electronics and interface; and the system computer with appropriate hardware and software. The article also describes the uses of direct-current plasma, and provides examples of the applications of ICP-AES.

Coatings and other surface modifications are used for a variety of functional, economic, and aesthetic purposes. Two major applications of thermal spray coatings are for wear resistance and corrosion resistance. This article discusses thermal (surface hardening) and thermochemical (carburizing, nitriding, and boriding) surface modifications, electrochemical treatments (electroplating, and anodizing), chemical treatments (electroless plating, phosphating, and hot dip coating), hardfacing, and thermal spray processes. It provides information on chemical and physical vapor deposition techniques such as conventional CVD, laser-assisted CVD, cathodic arc deposition, molecular beam epitaxy, ion plating, and sputtering.

Sputtering is a nonthermal vaporization process in which the surface atoms are physically ejected from a surface by momentum transfer from an energetic bombarding species of atomic/molecular size. It uses a glow discharge or an ion beam to generate a flux of ions incident on the target surface. This article provides an overview of the advantages and limitations of sputter deposition. It focuses on the most common sputtering techniques, namely, diode sputtering, radio-frequency sputtering, triode sputtering, magnetron sputtering, and unbalanced magnetron sputtering. The article discusses the fundamentals of plasma formation and the interactions on the target surface. A comparison of reactive and nonreactive sputtering is also provided. The article concludes with a discussion on the several methods of process control and the applications of sputtered films.

This article provides an overview of surface contaminants that may affect the heat treatment processes and end-product quality. It presents information on the chemicals used to clean different surface contaminants of steels. The article discusses three types of cleaning methods, namely, mechanical, chemical, and electrochemical and their effectiveness and applicability. The mechanical cleaning methods include grinding, brushing, steam or flame jet cleaning, abrasive blasting, and tumbling. Solvent cleaning, emulsion cleaning, alkaline cleaning, acid cleaning, pickling, and descaling are chemical cleaning methods. The electrochemical cleaning methods include electropolishing, electrolytic alkaline cleaning, and electrolytic pickling. The article provides information on cleanliness measurement methods such as qualitative tests and quantitative tests to ensure product quality. Health hazards that may be associated with each cleaning method and the general control measures to be used for each hazard are tabulated.

Computed tomography (CT) is an imaging technique that generates a three-dimensional (3-D) volumetric image of a test piece. This article illustrates the basic principles of CT and provides information on the types, applications, and capabilities of CT systems. A comparison of performance characteristics for film radiography, real-time radiography, and X-ray computed tomography is presented in a table. A functional block diagram of a typical computed tomography system is provided. The article discusses CT scanning geometry that is used to acquire the necessary transmission data. It also provides information on digital radiography, image processing and analysis, dual-energy imaging, and partial angle imaging, of a CT system.

This article is a compilation of terms and definitions related to materials characterization.