Crystallographic texture measurement and analysis is an important tool for correlating material properties with microstructural features. This article describes the general approach to quantifying crystallographic texture, namely, the collection of statistical data from grain measurements and subsequent analysis based on Euler plots (i.e., pole figures), orientation distribution functions, and stereographic projections. Using detailed illustrations and examples, it explains the significance of preferred crystallographic orientations and their influence on properties and material behavior. The article also discusses sample selection and preparation as well as the challenges and limitations of various methods.

Grain boundaries are interfaces between crystallites of the same phase but different crystallographic orientation. They can be characterized as being low angle or high angle. This article discusses the measurements of grain-boundary energy with a brief summary of different schemes for measuring grain-boundary surface tension. The atomistic simulations of grain-boundary energy, measurement of grain-boundary migration and the techniques used to monitor grain-boundary migration are reviewed. Several considerations and effects influencing the computation of grain-boundary mobility are also discussed.

This article outlines several polycrystal formulations commonly applied for the simulation of plastic deformation and the prediction of deformation texture. It discusses the crystals of cubic and hexagonal symmetry that constitute the majority of the metallic aggregates used in technological applications. The article defines the basic kinematic tensors, reports their relations, and presents expressions for calculating the change in crystallographic orientation associated with plastic deformation. It surveys some of the polycrystal models in terms of the relative strength of the homogeneous effective medium (HEM). The article analyzes the anisotropy predictions of rolled face-centered-cubic and body centered-cubic sheets and presents simulations of the axial deformation of hexagonal-close-packed zirconium. The applications of polycrystal constitutive models to the simulation of complex forming operations, through the use of the finite element method, are also presented.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

This article discusses the central aspect of anisotropy modeling, namely, texture measurement and analysis. It provides an overview of the methods available for characterizing crystallographic preferred orientation, or texture, in polycrystalline materials. These methods include pole figure measurement and electron backscatter diffraction (EBSD). The article describes the process considerations for pole figure measurement, including X-ray diffraction, neutron diffraction, stereographic projection, equal area projection, graphing pole figures, typical textures, and orientation distribution. It also deals with the limitations and challenges associated with the EBSD, and applications of the diffraction.