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Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006105
EISBN: 978-1-62708-175-7
... Abstract Development of the properties of copper powder metallurgy parts is affected by pressing and sintering processes used in the production of components, such as contacts, carbon brushes, and friction materials. This article briefly describes the powder properties of copper and discusses...
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Published: 01 January 1990
Fig. 3 Scanning electron micrographs of gas- and water-atomized copper powders. (a) Nitrogen atomized. (b) Water atomized, apparent density of 3.04 g/cm 3 . (c) Water atomized, apparent density of 4.60 g/cm 3 More
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Published: 01 December 1998
Fig. 1 Scanning electron micrographs of gas- and water-atomized copper powders. (a) Nitrogen atomized. (b) Water atomized, apparent density of 3.04 g/cm 3 . (c) Water atomized, apparent density of 4.60 g/cm 3 More
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Published: 01 November 2010
Fig. 6 Increase in density due to shrinkage during sintering of copper powders. Increasing temperature and time increases the effects of sintering More
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Published: 15 June 2020
Fig. 48 Oxygen and hydrogen content of copper powders with varying initial oxygen contents. The 2:1 stoichiometry confirms the presence of water vapor. (Ref 123) More
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006139
EISBN: 978-1-62708-175-7
... Abstract This article describes the fundamentals of various techniques used for the production of copper and copper alloy powders. These include atomization (water, air, and gas), oxide reduction, and electrolysis. The article discusses the effects of electrolyte composition and operating...
Book Chapter

By Erhard Klar, David F. Berry
Series: ASM Handbook
Volume: 2
Publisher: ASM International
Published: 01 January 1990
DOI: 10.31399/asm.hb.v02.a0001070
EISBN: 978-1-62708-162-7
... Abstract This article briefly reviews the subject of copper-base powder-metallurgy (P/M) products in terms of powder production methods (atomization, oxide reduction, electrolysis, and hydrometallurgy) and the product properties/consolidation practices of the major applications. Of the four...
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Published: 15 June 2020
Fig. 44 Sections of copper powder particles. (a, b) Relatively clean copper powder for which surface oxides are the dominant contributor to overall oxygen content. No grain-boundary oxides are visible within the resolution of the instrument. (c, d) After multiple reuse events, there is visible More
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Published: 30 September 2015
Fig. 13 Scanning electron micrograph of copper-oxide-reduced copper powder More
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Published: 15 June 2020
Fig. 43 Oxygen content of copper powder atomized from oxygen-free electronic copper bar, screened in air and argon to a 15 to 53 μm distribution. The data show the pickup of oxygen from the powder manufacturer to the first and tenth runs using electron beam powder-bed fusion. The oxygen More
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Published: 01 August 2013
Fig. 1 Micrometer-sized copper powder used in cold spray experiments/applications. Source: Ref 1 More
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Published: 01 January 1990
Fig. 5 Oxide-reduced copper powder. 500× More
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Published: 01 January 1990
Fig. 6 Electrolytic copper powder showing dendritic structure. 85× More
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Published: 01 January 1990
Fig. 7 Scanning electron micrograph of hydrometallurgically produced copper powder (cement copper) More
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Published: 30 September 2015
Fig. 4 Electrolytic copper powder showing dendritic structure. Original magnification: 85× More
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Published: 30 September 2015
Fig. 22 Particles (+8 mesh) of copper powder hammer milled from oxide-reduced sinter cake. Courtesy of SCM Metal Products More
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Published: 30 September 2015
Fig. 12 Relative density versus time during the sintering of copper powder compact (particle size = 11 μm; green density = 70%) at 980 °C in hydrogen. Source: Ref 100 More
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Published: 30 September 2015
Fig. 14 Flowchart for production of electrolytic copper powder More
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Published: 30 September 2015
Fig. 21 Electrolytic copper powder showing dendritic structure. Original magnification: 85×. Source: Ref 14 More
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Published: 01 December 2004
Fig. 19 Progress of sintering in a loose stack of copper powder spheres, secondary electron images. (a) Light bonding at 600 °C (1110 °F) during heating to sintering temperature. (b) After sintering for 1 h at 1050 °C (1920 °F). Clearly visible is the formation of necks between touching More