Search Results for contrast enhancement

Metallographic contrasting methods include various electrochemical, optical, and physical etching techniques, which in turn are enhanced by the formation of a thin transparent film on the specimen surface. This article primarily discusses etching in conjunction with light microscopy and describes several methods for film formation, namely, heat tinting, color etching, anodizing, potentiostatic etching, vapor deposition, and film deposition by sputtering. It provides information on the general procedures and precautions for etchants and reagents used in metallographic microetching, macroetching, electropolishing, chemical polishing, and other similar operations.

This article describes the various aspects relating to the selection and preparation of ultrathin-section specimens of fiber-reinforced polymeric composites for examination by transmitted light microscopy. It provides information on the contrast-enhancement methods used by transmitted-light microscopy and optimization of microscope conditions. Examples of composite ultrathin sections analyzed using transmitted-light microscopy contrast methods are also presented.

This article outlines the beam/sample interactions and the basic instrumental design of a scanning electron microscopy (SEM), which include the electron gun, probeforming column (consisting of magnetic electron lenses, apertures, and scanning coils), electron detectors, and vacuum system. It discusses the contrasts mechanisms used for imaging and analyzing materials in the SEM. These include the topographic contrast, compositional contrast, and electron channeling pattern and orientation contrast. Special instrumentation and accessory equipment used at elevated pressures and during the X-ray microanalysis are reviewed. The article also provides information on the sample preparation procedure and the materials applications of the SEM.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.

The analysis of composite materials using optical microscopy is a process that can be made easy and efficient with only a few contrast methods and preparation techniques. This article is intended to provide information that will help an investigator select the appropriate microscopy technique for the specific analysis objectives with a given composite material. The article opens with a discussion of macrophotography and microscope alignment, and then goes on to describe various illumination techniques that are useful for specific analysis requirements. These techniques include bright-field illumination, dark-field illumination, polarized-light microscopy, interference and contrast microscopy, and fluorescence microscopy. The article also provides a discussion of sample preparation materials such as dyes, etchants, and stains for the analysis of composite materials using optical microscopy.

This article reviews the main theoretical and practical aspects of sequence normally followed in digital image-acquisition, processing, analysis, and output for material characterization. It discusses the main methods of digital imaging, image processing, and analysis, as applied to microscopy of materials. The article describes the basic concepts of sampling and resolution and quantization of light microscopy, scanning electron microscopy, and transmission electron microscopy. It discusses the acquisition of a digital image that accurately represents the sample under observation and output of the image to a printer. The methods used to enhance the digital image and to extract quantitative information are also described. Different types of image segmentation, namely, adaptive segmentation and contour-based segmentation, are reviewed. The article also presents case studies on the application of image processing and analysis to materials characterization.

This article provides information on the basic components of a light microscope, including the illumination system, collector lens, and optical and mechanical components. It describes optical performance in terms of image aberrations, resolution, and depth of field. The article discusses the examination of specimen surfaces using polarized light, phase contrast, oblique illumination, dark-field illumination, bright-field illumination, interference-contrast illumination, and phase contrast illumination. Special techniques and devices that may be used with the optical microscope, to obtain additional information, are also described. The article concludes with information on photomicroscopy and macrophotography.

This article describes the dispersed-phase toughening of thermoset matrices by the development of multiphase-structure thermosetting matrices using rubber and/or thermoplastic materials. It discusses two main methods for manufacturing prepregs, namely, single-pass impregnation and double-pass impregnation. The article illustrates reflected-light optical microscopy techniques to evaluate the morphology of thermoplastic materials for determining the material quality and correlating key microstructural features with material performance.

This article provides detailed information on the instrumentation and principles of the scanning electron microscope (SEM). It begins with a description of the primary components of a conventional SEM instrument. This is followed by a discussion on the advantages and disadvantages of the SEM compared with other common microscopy and microanalysis techniques. The following sections cover the critical issues regarding sample preparation, the physical principles regarding electron beam-sample interaction, and the mechanisms for many types of image contrast. The article also presents the details of SEM-based techniques and specialized SEM instruments. It ends with example applications of various SEM modes.

This article focuses on the modes of operation, physical basis, sample requirements, properties characterized, advantages, and limitations of the characterization methods used to evaluate the physical morphology and chemical properties of component surfaces for medical devices. These methods include light microscopy, scanning electron microscopy, atomic force microscopy, energy-dispersive X-ray spectroscopy, Auger electron spectroscopy, secondary ion mass spectrometry, X-ray photoelectron spectroscopy, Fourier transform infrared spectroscopy, and Raman spectroscopy.

Honeycomb-cored sandwich panels increase part stiffness at a lower weight than monolithic composite materials. This article illustrates an area of a honeycomb-cored sandwich structure composite cross section that is viewed using transmitted polarized light. This area shows the differences in the constituents and resin intermingling. The article discusses the factors that govern the honeycomb core movement and honeycomb core crush, with illustrations. Some common tests performed on honeycomb composites to characterize the skin-to-core bond strength are the climbing drum peel and flatwise tensile tests. The article concludes with a description on the reasons for core failure, which are analyzed after these tests.

Zirconium, hafnium, and their alloys are reactive metals used in a variety of nuclear and chemical processing applications. This article describes various specimen preparation procedures for these materials, including sectioning, mounting, grinding, polishing, and etching. It reviews some examples of the microstructure and examination for zircaloy alloys, hafnium, zirconium, and bimetallic forms.

This article provides an overview of how fractographs in this Atlas are organized and presented. It contains a table that lists the distribution content of illustrations for various materials discussed in the Atlas. The causes of fractures for various ferrous and nonferrous alloys and engineered materials are also illustrated.