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chip-scale packaging

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Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004172
EISBN: 978-1-62708-184-9
...-small-outline package (TSOP) is shown along with the various areas where corrosion can occur. For chip scale package (CSP) type of packages with solder balls as interconnects between the package and a printed circuit board, similar corrosion sites may occur, except that the entry path may be different...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... excellent fatigue and creep properties. The alloys 95Pb-5Sn and 90Pb-10Sn are used in the controlled collapse chip component (C 4 ) attachment of silicon chips to package frames ( Ref 2 ). Their elevated melting temperatures prevent reflow of the C 4 joints during subsequent joining of the unit to the PWB...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004175
EISBN: 978-1-62708-184-9
... is a hierarchical structure that allows a central processing unit to communicate with memory and input/output units such as display, keyboard, and data storage devices. The packaging integrates: Chips into single chip modules (SCM) or multichip modules (MCM), which are sometimes known as first-level package...
Series: ASM Handbook
Volume: 20
Publisher: ASM International
Published: 01 January 1997
DOI: 10.31399/asm.hb.v20.a0002475
EISBN: 978-1-62708-194-8
... unit volume. Figure 4 shows dramatic reductions in the volume required for 1 MB (megabyte) of electronic memory storage from 1950 to 2010, a sixty-year interval during which the technology changed from small magnetic (ferrite) cores to IC chips ( Ref 13 ). Packaging had evolved as well...
Series: ASM Handbook
Volume: 22B
Publisher: ASM International
Published: 01 November 2010
DOI: 10.31399/asm.hb.v22b.a0005519
EISBN: 978-1-62708-197-9
... Abstract This article begins with information on the fundamentals of chip formation process and general considerations for the modeling and simulation of machining processes. It focuses on smaller-scale models that seek to characterize the workpiece/tool/chip interface and behaviors closely...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.9781627081849
EISBN: 978-1-62708-184-9
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004225
EISBN: 978-1-62708-184-9
... EDTA cracking BCE American Welding Society chlorinated polyvinyl chloride engineered barrier systems American Water Works corrosion rate electrochemical machining Association copper sulfate reference electrode electrochemical noise (method) chip-scale package ethylene-chlorotri uoroethylene Tafel coef...
Book Chapter

Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004221
EISBN: 978-1-62708-184-9
... short circuit. In a flip-chip resistor ( Fig. 3 ), silver has migrated through a ceramic substrate, creating the familiar dendritic pattern. In Fig. 4(a) , the metallized capacitor film appears with few faults, while in Fig. 4(b) , a visually interesting pattern from a failed capacitor appears...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003213
EISBN: 978-1-62708-199-3
... Abstract Metal surfaces must often be cleaned before subsequent operations to remove unwanted substances such as pigmented drawing compounds, unpigmented oil and grease, chips and cutting fluids, polishing and buffing compounds, rust and scale, and miscellaneous contaminants. The article...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
...-side-switched circuit Fig. 2 Electrical-leakage paths in a typical relay structure (not to scale; proportions distorted for clarity) Necessary conditions for halide-induced corrosion of the copper magnet wire in a coil include (a) a pinhole or crack in the thin polymeric insulation...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
..., and thermosonic bonding techniques. The mounted silicon chip is enclosed in the package by making a hermetic seal, which may take the form of a glass sealed lid, a welded metal lid, or a brazed or soldered metal lid, depending on package type. GaAs chips for large-scale integrated circuits have also been...
Series: ASM Handbook
Volume: 2A
Publisher: ASM International
Published: 30 November 2018
DOI: 10.31399/asm.hb.v02a.a0006528
EISBN: 978-1-62708-207-5
... be drilled, sawed, or sheared with little or no loss of coating, and the porcelain is resistant to chipping by impact. Chemical destruction of the enamel-to-aluminum bond by attack in corrosive environments is a function of the interface characteristics imparted by alloy composition and surface pretreatment...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004170
EISBN: 978-1-62708-184-9
... of sodium ions required is calculated to be 1.15×10 −5 μg for a hermetically sealed package with an internal volume of 0.1 cm 3 containing 5000 ppm v of water vapor, of which 1% condenses on the chip ( Ref 23 ). Electrochemical series for reactions important in corrosion Table 4 Electrochemical...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006363
EISBN: 978-1-62708-192-4
... a positive rake angle at the macroscopic scale for thicker chips, as the commanded feed per tooth approaches the same order of magnitude as the cutting edge radius, the effective rake angle becomes negative ( Fig. 8 ) for a measurement of the edge radius (approximately 15 μm, or 591 μin.) for the end mill...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006773
EISBN: 978-1-62708-295-2
... makes analysis of microelectronic components complex is that there are considerable thermal transient and cyclic effects that must be analyzed, and many of the critical materials have nonlinear properties. There are micro-heat-generation sources inside chip packages and global printed circuit board...
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
... of a material as a fraction of its melting-point temperature using the Kelvin scale). Thus, solder joint materials undergo creep deformation even at room temperature. As a result, the cyclic behavior of solder during a thermal cycle is a complex interaction between creep and low-cycle fatigue. The complexity...
Series: ASM Handbook
Volume: 5B
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v05b.a0006026
EISBN: 978-1-62708-172-6
... evaluation of coating system performance prior to full-scale field installation can be employed to determine which of the candidate systems will perform the best. This article describes methods for qualifying coating systems, discusses the pros and cons of using manufacturer-generated data versus...
Series: ASM Handbook
Volume: 11
Publisher: ASM International
Published: 15 January 2021
DOI: 10.31399/asm.hb.v11.a0006764
EISBN: 978-1-62708-295-2
... to visible surfaces Intuitive; can be applied over wide scale from micrometers to kilometers Any solid structures including concrete, aircraft, nuclear components, etc. Vibration analysis Accelerometers, velocimeters, and/or displacement sensors measure local displacements. Analysis includes amplitude...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
... that must be analyzed, and many of the critical materials have nonlinear properties. There are micro-heat-generation sources inside chip packages and global printed circuit board cooling considerations that interact. These temperature conditions cause macrothermal distortions of the entire printed circuit...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... exceeds an operator-selected threshold, the output of the C-mode scanning acoustic microscope is displayed in full gray scale, in which the gray level is proportional to the amplitude of the interface signal. The gray scale can be converted into false color, and, as shown in Fig. 5 , the images also can...