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ceramic substrates

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Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001316
EISBN: 978-1-62708-170-2
... on the ceramic coatings for ceramic and glass substrates. It describes the role of oxides in glazes and discusses the optical and appearance properties of various types of glazes, such as leadless glazes, lead-containing glazes, opaque glazes, and satin and matte glazes. The article provides information...
Series: ASM Handbook
Volume: 5A
Publisher: ASM International
Published: 01 August 2013
DOI: 10.31399/asm.hb.v05a.a0005736
EISBN: 978-1-62708-171-9
..., propelling and depositing this material as a coating on a substrate. The processes together cover a wide window of particle temperatures and velocities. High-temperature processes such as air plasma spraying are suitable for processing ceramic (insulators/dielectrics) materials, whereas wire arc, vacuum...
Book Chapter

Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005560
EISBN: 978-1-62708-174-0
... of high-specification materials, with an ideal metallurgical bond, onto a range of metal substrates. Friction surfacing has been used to apply a metal coating onto a metal substrate, but the process is being explored for the deposition of metal coatings onto ceramic substrates ( Fig. 1 ). This unique way...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
... solder joint design solderability testing soldering solders and fluxes selection SOLDERING represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring boards (PWBs) or the ceramic substrates used...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003218
EISBN: 978-1-62708-199-3
...Abstract Abstract Chemical vapor deposition (CVD) involves the formation of a coating by the reaction of the coating substance with the substrate. Serving as an introduction to CVD, the article provides information on metals, ceramics, and diamond films formed by the CVD process. It further...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003235
EISBN: 978-1-62708-199-3
..., inclusions, and other flaws in plastic or ceramic materials. It also discusses the advantages and disadvantages and the general approaches that have been used in the development of microwave nondestructive inspection. ceramic materials delamination testing dielectric substrates inclusion testing...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003218
EISBN: 978-1-62708-199-3
... Abstract Chemical vapor deposition (CVD) involves the formation of a coating by the reaction of the coating substance with the substrate. Serving as an introduction to CVD, the article provides information on metals, ceramics, and diamond films formed by the CVD process. It further discusses...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 December 1998
DOI: 10.31399/asm.hb.mhde2.a0003235
EISBN: 978-1-62708-199-3
..., inclusions, and other flaws in plastic or ceramic materials. It also discusses the advantages and disadvantages and the general approaches that have been used in the development of microwave nondestructive inspection. ceramic materials delamination testing dielectric substrates inclusion testing...
Book Chapter

Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003056
EISBN: 978-1-62708-200-6
...Major ceramic metallization techniques Table 1 Major ceramic metallization techniques Mechanism Processes Limitations Condensation of atoms onto ceramic substrate Plating, evaporation, plasma sputtering, chemical vapor deposition Annealing may be required to remove residual...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
... substrates. For example, degradation of polyimide substrates will occur in very alkaline baths. Alumina-ceramic substrates are also incompatible with highly alkaline systems, and they should be treated in electroless gold baths operating at neutral pH (such as sulfite gold baths, which have a pH of 8.0...
Book Chapter

Series: ASM Handbook
Volume: 8
Publisher: ASM International
Published: 01 January 2000
DOI: 10.31399/asm.hb.v08.a0003280
EISBN: 978-1-62708-176-4
.... , Vol 10 , 1976 , p 445 – 453 10.1002/jbm.820100312 55. Ferber M.K. and Brown S.D. , Delayed Failure of Plasma-Sprayed Al 2 O 3 Applied to Metallic Substrates , J. Am. Ceram. Soc. , Vol 64 , 1981 , p 737 – 741 10.1111/j.1151-2916.1981.tb15898.x 56. Avigdor D...
Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006550
EISBN: 978-1-62708-290-7
...-material-ceramic-and-metal-3d-prints . Used with permission from Fabbaloo Fig. 7 Interferometric microscope images of dried single 10 vol% zirconia ink droplets. Each image represents a different temperature of the glass substrate: (a) 25 °C, (b) 35 °C, (c) 50 °C, (d) 75 °C, (e) 100 °C, (f) 200...
Series: ASM Desk Editions
Publisher: ASM International
Published: 01 November 1995
DOI: 10.31399/asm.hb.emde.a0003062
EISBN: 978-1-62708-200-6
... and various active devices. Glass insulators, ceramic heater substrates for microelectronics packaging, are all primarily used in this mode. Often, however, the ceramic material must exhibit other important characteristics, including temperature, corrosion and environmental stability, high mechanical strength...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... areas of electronic packaging exist. For example, there are great needs for new materials with improved dielectric properties and high thermal conductivities for use in PCBs and electrically insulating substrates. Materials of interest here include ceramic fibers and particles in ceramic and polymeric...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001320
EISBN: 978-1-62708-170-2
... Inserts Future Potential Crater Wear Flank Wear Builtup Edge Depth-of-Cut Notching Nose Wear Thermal Cracks Cemented Carbides Cermets Ceramic Superhard Materials CVD-Coated Tools CVD-Coated Tools with Cobalt-Enriched Substrates Medium-Temperature CVD and Plasma...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... metal widely used in the electronics industry. Figure 21 is a scanning electron micrograph of the area between two adjacent solder joints on the ceramic substrate of a thick-film-hybrid resistor network. The dendrites pointed out in this micrograph are lead (Pb) that was leached from the adjacent...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006436
EISBN: 978-1-62708-192-4
... Properties of “High-Rate” Sputtered MoS 2 Applied to Metal and Ceramic Substrates , Mater. Res. Soc. Symp. Proc ., Vol 140 , 1989 , p 251 26. Kustas F.M. and Misra M.S. , Improved Tribological Performance of MoS 2 on Ti-6Al-4V by Surface Pretreatment , J. Vac. Sci. Technol ., 1991...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001770
EISBN: 978-1-62708-178-8
... occurring between thin film layers and substrate. A gold-nickel-copper metallization system is widely used in electronics for such applications as connectors, external leads for hybrid microcircuits, and thin films on ceramic substrates. A thin nickel layer typically serves as the diffusion barrier...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006466
EISBN: 978-1-62708-190-0
... are used in a variety of applications. Some are used in the electronics industry as substrates for delicate hybrid circuits. In structural applications, ceramics are used where high temperature and light weight are important. Silicon nitride, silicon carbide, and zirconia are receiving much attention...
Book Chapter

Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004221
EISBN: 978-1-62708-184-9
... a soldered terminal formed metal dendrites in the area of highest electrical potential to an adjacent terminal and caused an electrical short circuit. In a flip-chip resistor ( Fig. 3 ), silver has migrated through a ceramic substrate, creating the familiar dendritic pattern. In Fig. 4(a) , the metallized...