The chemical process being catalyzed should have a high productivity within a specified reactor volume with high reaction rates for the desired reactions and low rates for undesired reaction pathways. This article reviews the general catalyst preparation procedures, namely, impregnation, ion exchange, and precipitation. Catalyst carriers are usually high-surface-area inorganic materials with complex pore structures, into which catalytic materials such as palladium, platinum, cobalt, chromium oxide, and vanadium pentoxide are deposited using these procedures. The article also provides information on catalyst powder processing.

No-bake sand molds are based on the curing of inorganic or organic binders with either gaseous catalysts or liquid catalysts. This article reviews the major aspects of no-bake sand bonding in terms of coremaking, molding methods, and sand processing. It discusses the points to be noted in handling sand-resin mixtures for no-bake molds or cones and lists some advantages of no-bake air-set cores and molds. The article describes the process procedures, advantages, and disadvantages of gas curing and air-setting hardening of sodium silicates. It examines the members of the air-setting organic binders, namely, furan no-bake resins, phenolic no-bake resins, and urethanes. The article provides an overview of gas-cured organic binders. It also illustrates the three commercial systems for sand reclamation: wet reclamation systems, dry reclamation systems, and thermal reclamation.

This article contains tables that list standard reduction potentials for electrochemical reactions. The first table lists reactions alphabetically by element of interest. The second table is ranked by potential value. Potential is measured versus the Standard Hydrogen Electrode which has a value of 0.0000 V. Reactions with more than one voltage indicate that results have not been reconciled. Parenthetical materials not needed to balance reactions are catalysts.

Sheet molding compounds (SMCs) refers to both material and process for producing glass-fiber-reinforced polyester resin items. This article discusses the material components incorporated into the resin paste for desirable processing and molding characteristics and optimum physical and mechanical properties, including catalyst, fillers, thickeners, pigments, thermoplastic polymers, flame retardants, and ultraviolet absorbers. It talks about the mixing techniques available for SMC resin pastes, including batch, batch/continuous, and continuous mixing. The article also outlines the design features and the operations of continuous-belt and beltless machine type SMCs.

This article focuses on epoxy because this resin category has widespread use and because it is tested using quality control measures typical of most resin systems. It explains that a typical resin system will consist of one or more epoxy resins, a curing agent, and a catalyst to control the rate of reaction. The article describes the component material tests, mixed resin system tests, and prepreg tests for the resin system. These tests include high-performance liquid chromatography, infrared spectroscopy, and gel permeation chromatography. The article contains a table that lists typical resin and prepreg property tests.

Electroless, or autocatalytic, metal plating is a nonelectrolytic method of deposition from solution that can be plated uniformly over all surfaces, regardless of size and shape. The plating's ability to plate onto nonconductors is an advantage that contributes to the choice of electroless copper in various applications. This article provides information on the bath chemistry and deposit properties of electroless copper and discusses the applications of electroless copper plating, such as printed wiring boards, decorative plating-on-plastic, electromagnetic interference shielding, and hybrid and other advanced applications. It describes two commercial processes, pretreatment and post-treatment. The article reviews the solutions used, controls and control equipment, and performance criteria of electroless copper plating. It concludes with information on the environmental and safety issues associated with electroless copper plating.

This article describes the chemistry of phenolic resins and reviews their characteristics and properties for various composites fabrication processes. The fabrication processes include solution/hot-melt process, pultrusion, vacuum infusion, filament winding, sheet molding, and hand lay-up. The article illustrates the manufacturing process of phenolic honeycomb and provides information on the applications of phenolic composites.