Search Results for bonding

Adhesive bonding is a proven technology in the manufacture of automotive assemblies, helping carmakers achieve weight reduction goals without compromising body stiffness, crash performance, and noise-vibration-handling characteristics. This article discusses the advantages and limitations of adhesive-bonded aluminum joints and the procedures used to produce them. It addresses surface preparation, the addition of interfacial coatings and primers, and the application of thermoplastic and thermosetting resins. The article examines the nature and role of the various layers that constitute the joint and explains how each contributes to performance. It also discusses adhesive selection factors, joint design, and testing procedures.

This article discusses three distinct mechanisms of bonding for solid-state (forge) welding processes, namely, contaminant displacement/interatomic bonding, dissociation of retained oxides, and decomposition of the interfacial structure. It explains the processes that can be characterized as having two stages: heating and forging. The article also includes a table that illustrates weld strengths as a function of annealing temperature for a range of materials.

This article describes the solid-phase and liquid-phase processes involved in diffusion bonding of metals. It provides a detailed discussion on the diffusion bonding of steels and their alloys, nonferrous alloys, and dissimilar metals. Ceramic-ceramic diffusion welding and a variation on this process in which ceramic powder compacts are simultaneously sintered and bonded are also discussed.

This article provides a qualitative summary of the theory of diffusion bonding, as distinguished from the mechanisms of other solid-state welding processes. Diffusion bonding can be achieved for materials with adherent surface oxides, but the resultant interface strengths of these materials are considerably less than that measured for the parent material. The article describes three stages of diffusion bonding: microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with information on diffusion bonding with interface aids.

The goals of modeling diffusion bonding can be regarded as twofold: to optimize the selection of the process variables for a given material and to provide an understanding of the mechanisms by which bonding is achieved. This article describes the existing models of diffusion bonding with an assumption that the surfaces to be joined are free of contaminants and oxide, that bonding occurs between similar materials, and that the materials are single-phase metals. It discusses the mechanisms considered for diffusion bonding and limitations of existing models.

Adhesive bonding is used to assemble composite components into larger structures. Finished components that are damaged during assembly or service are often repaired with adhesive-bonding techniques. This article summarizes criteria for adhesive selection and illustrates typical secondary adhesively bonded joint configurations. It discusses the highly loaded joint considerations of adhesives. The article describes the epoxy adhesives commonly used for the bonding or repair of composite structures. It discusses the surface preparation of composites and metals, and honeycomb processing, including perimeter trimming, mechanical forming, heat forming, core splicing, contouring, and cleaning. The article presents basic steps involved in the adhesive-bonding process and concludes with a discussion on adhesive applications and tooling.

Diffusion bonding is only one of many solid-state joining processes wherein joining is accomplished without the need for a liquid interface (brazing) or the creation of a cast product via melting and resolidification. This article offers a qualitative summary of the theory of diffusion bonding. It discusses factors that affect the relative difficulty of diffusion bonding oxide-bearing surfaces. These include surface roughness prior to welding, mechanical properties of the oxide, relative hardness of the metal and its oxide film, and prestraining or work hardening of the material. The article describes the mechanism of diffusion bonding in terms of microasperity deformation, diffusion-controlled mass transport, and interface migration. It concludes with a discussion on diffusion bonding with interface aids.