Search Results for atomic oxygen

This article is an atlas of fractographs that helps in understanding the causes and mechanisms of fracture of electronic materials, including L-shaped electronic flat pack, transistor base lead, ohmic contact window, and brush/slip ring assembly. The fractographs illustrate the atomic oxygen environment exposure effect, solar cell interconnect, integrated circuit defects, and fatigue failure of these materials.

Polymer composite materials are subject to degradation if not appropriately protected from the environment. This article describes the effects of heat and atomic oxygen and ultraviolet-light on composite material surfaces, with illustrations.

This article focuses on different thin-film deposition techniques used to make superconducting films and discusses the properties and advantages of high-critical-temperature and low-critical-temperature materials in a number of applications, including signal processing and analog electronic devices. The article gives a brief introduction on superconducting materials, substrates and buffer layers and discusses the major deposition techniques such as, electron-beam co-evaporation, sputtering from either a composite target or multiple sources and laser ablation. The article also describes the in-situ film growth techniques for producing atomic oxygen by radio frequency excitation or microwave discharge or with ozone.

This article describes the Schottky defect and the Frenkel defect in oxides. It provides information on the p-type metal-deficit oxides and n-type semiconductor oxides. The article discusses diffusion mechanisms and laws of diffusion proposed by Fick. It explains the oxide texture of amorphous and epitaxy oxide layers and presents equations for various oxidation reaction rates. The article reviews different theories to describe the oxidation mechanism. These include the Cabrera-Mott, Hauffe-IIschner, Grimley-Trapnell, Uhlig, and Wagner theories.

This article is a compilation of binary alloy phase diagrams for which oxygen (O) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

The primary market for metal powder is the production of powder metallurgy (PM) parts, which are dominated primarily by iron and copper powders. This article reviews the chemical and pyrotechnics applications of ferrous and nonferrous powders. It describes the characteristics of iron powder used in oxygen scavengers and chemical reactive warmers and heaters. Metal powders used as fuels in solid propellants, pyrotechnic devices, explosives, and similar applications are reviewed. Atomized aluminum, magnesium, tungsten, and zirconium powders are also discussed.

This article provides information on the process details that differ from general water atomization of metals as they relate to basic and engineering properties that are specific to stainless steel powders. The discussion focuses on the compacting-grade stainless steel powders. The process details include raw materials, melting method, and control of physical and chemical powder characteristics. The article describes the gas atomization of stainless steel powders and processes that are done after water atomization: drying, screening, annealing, and lubricating. It also discusses the two types of quality assurance testing measures for powder metallurgy stainless steels: tests for powder contamination and tests of chemical and physical properties.

This article provides an overview of chemistry and chemical interactions necessary to understand protective coatings. It includes information on elements, atoms, molecules, types of bonding, valence electrons, functional groups, polymer formation, and chemical bonding structures.

This article discusses the production of aluminum and aluminum alloy powders with emphasis on the gas atomization method and the atomizing nozzle. It illustrates the particle formation mechanism and details the requisites for particle size distribution, control, and morphology. The article presents information on the mean oxide thickness formed on atomized powders. It also describes the mechanical and physical properties of aluminum and aluminum alloy powders, as well as their applications.

This article describes eight stages of the atomistic film growth: vaporization of the material, transport of the material to the substrate, condensation and nucleation of the atoms, nuclei growth, interface formation, film growth, changes in structure during the deposition, and postdeposition changes. It also discusses the effects and causes of growth-related properties of films deposited by physical vapor deposition processes, including residual film stress, density, and adhesion.

Paints and protective coatings are the most common means of protecting materials from deterioration. This article focuses on coating degradation that results from the environmental interaction with the coatings. The major environmental influences of the degradation include energy (solar radiation, heat and temperature variation, and nuclear radiation), permeation (moisture, solvent retention, chemical, and oxygen), stress (drying and curing, vibration, and impact and abrasion), and biological influences (microbiological and macrobiological).

Atomization is the dominant method for producing metal and prealloyed powders from aluminum, brass, iron, low-alloy steels, stainless steels, tool steels, superalloys, titanium alloys, and other alloys. The general types of atomization processes encompass a number of industrial and research methods. This article describes the key process variables and production factors for the industrial methods: two-fluid, centrifugal, vacuum or soluble-gas, and ultrasonic atomization. It also reviews the effect of atomization methods and process variables on key powder characteristics such as the average particle size, particle size distribution or screen analysis, particle shape, chemical composition, and microstructure.