Search Results for assembly

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

The structural efficiency of a composite structure is established by its joints and assembly. Adhesive bonding, mechanical fastening, and fusion bonding are three types of joining methods for polymer-matrix composites. This article provides information on surface treatment and the applications of adhesive bonding. It discusses the types of adhesives, namely, epoxy adhesives, epoxy-phenolic adhesives, condensation-reaction PI adhesives, addition-reaction PI adhesives, bismaleimide adhesives, and structural adhesives. The article provides information on fastener selection considerations, including corrosion compatibility, fastener materials and strength, head configurations, importance of clamp-up, interference fit fasteners, lightning strike protection, blind fastening, and sensitivity to hole quality. Types of fusion bonding are presented, namely, thermal welding, friction welding, electromagnetic welding, and polymer-coated material welding.

This article discusses the classification of the attachment and joining methods in plastics, including mechanical fastening, adhesive bonding, solvent bonding, and welding. It describes the mechanical fastening techniques used to join both similar and dissimilar materials with machine screws or bolts, nuts and washers, molded-in threads, self-threading screws, rivets, spring-steel fasteners, press fits, and snap fits. The article explains solvent bonding used for thermoplastic parts, and tabulates the solvent types used with various plastics. It also describes the surface preparation of plastics, chemical treatment for adhesion, and tabulates the adhesive types for bonding plastics to plastics and plastics to nonplastics. The article briefly describes the welding processes of thermoplastics, including fusion welding (hot-tool, hot gas, extrusion, and focused infrared), friction welding (vibration, spin, and ultrasonic), and electromagnetic welding (resistance, induction, dielectric, and microwave). It concludes with the evaluation of welds using destructive and nondestructive testing.

Product design for manufacture and assembly can be the key to high productivity in all manufacturing industries. This article discusses the use of design for manufacture and assembly (DFMA) software in the evaluation of proposed designs. It summarizes the steps taken when using DFMA software during design. The article describes the use of design for analysis tool in reducing the number of separate parts, estimating assembly time, and determining design efficiency. It reviews assembly analysis methods such as the assemblability evaluation method, the assembly-oriented product design method, the Lucas method, and the design-for-assembly cost effectiveness method. The article explains the design for manufacture in terms of cost estimation and principal cost drivers. It provides information on the applications of DFMA and roadblocks in the implementation of DFMA. The article concludes with a discussion on the design for automatic assembly.

Tooling and assembly methodologies for advanced composites have steadily improved as a result of advancements in materials, through the use of computer-aided design/computer-aided manufacturing technology, and through application of sophisticated design for manufacturing and assembly concepts. This article reviews techniques and technologies that are used to control the quality of tooling and assembly methods for composite components.

This article provides a summary of the concepts discussed in the articles under the Section “Post-Processing and Assembly” ASM Handbook, Volume 21: Composites.

Post-processing includes various processes that might be required to produce finished components from the ceramic-matrix composites (CMC) materials. The processes consist of machining or finishing operations, coating, joining, assembly operations, and nondestructive evaluation of CMCs and its components. This article discusses the specific needs for science and technology in these areas relative to the goal of employing CMCs in a variety of applications.

This article focuses on two streams of the research on part consolidation (PC): PC in the conventional manufacturing context, and PC in the additive manufacturing (AM) context. It reviews the challenges of applying AM-PC potentials. The article includes research literature on the selection of part candidates for consolidation and summarizes the conversion of assembly design to consolidated design. Then, a holistic approach for supporting PC design is introduced with integrated modules of part filtering and fusion of parts. Details of the key techniques of the two modules are later introduced with a gas pedal example. Finally, emerging trends in PC research are discussed.

A concise and quantified specification is essential to developing suitable product concepts. This article describes an integrated set of structured methods for identifying the customer population for the product and developing a representation of feature demands. The structured methods include design task probing, customer needs analysis, functional decomposition, and competitive benchmarking for directly mapping customer statements to functional requirements.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.