Search Results for aluminum alloy 6156

Alloy 6156 is an Al-Si-Mg-Cu-Mn weldable alloy, developed for the lower portion of the fuselage, which required a T6 temper strength level and high damage tolerance properties. This datasheet provides information on key alloy metallurgy of this 6xxx series alloy. Fatigue crack growth and material toughness for various thicknesses of alloy 6156 clad T62 are illustrated.

Alloy 2198 is an Al-Cu-Li alloy that is used in combination with 2196-T8 stringers for the fuselage skins of the Bombardier C-Series. This datasheet provides information on composition limits of the alloy 2198 and provides a performance comparison of 2198-T8 and 2024-T351 alloys.

The development of aluminum alloys has progressed along two tracks: heat treatable and non-heat treatable. The Aluminum Association alloy composition limits and product temper are defined for major alloying elements. This article summarizes the historical evolution of the different series of wrought aluminum alloys (1xxx to 8xxx) and discusses their applications based on the alloying system introduced by the Aluminum Association.

This article contains tables that list typical room-temperature physical properties of wrought aluminum alloys in engineering units and metric units.

This article contains a table that lists the values of nominal compositions and composition limits of wrought aluminum alloys.

This article summarizes the characteristics, material properties, and typical applications of aluminum alloy wrought products. It describes the most widely used worldwide alloy designation system and discusses five major categories, namely flat-rolled products; rod, bar, and wire; tubular products; shapes; and forgings. The article also discusses three widely used indexes to define the fracture resistance of aluminum alloys: notch toughness, tear resistance, and plane-strain fracture toughness. It also describes three types of corrosion attack of these alloys: general or atmospheric surface corrosion, stress-corrosion cracking, and exfoliation attack.

This article discusses the fundamental aspects of phase-field microstructure modeling. It describes the evolution of microstructure modeling, including nucleation, growth, and coarsening. The article reviews two approaches used in the modeling nucleation of microstructure: the Langevin force approach and explicit nucleation algorithm. Calculation of activation energy and critical nucleus configuration is discussed. The article presents the deterministic phase-field kinetic equations for modeling growth and coarsening of microstructure. It also describes the material-specific model inputs, chemical free energy and kinetic coefficients, for phase-field microstructure modeling. The article provides four examples that illustrate some aspects of phase-field modeling.

This article introduces various techniques commonly used in the characterization of semiconductors, namely single-crystal, polycrystalline, amorphous, oxide, organic, and low-dimensional semiconductors and semiconductor devices. The discussion covers material classification, fabrication methods, sample preparation, bulk/elemental characterization methods, microstructural characterization methods, surface characterization methods, and electronic characterization methods.

This article discusses the three basic elements of an epoxy resin formulation that must be understood when selecting a thermoset system. These include base resins, epoxy resin curatives, and modifiers. The article provides examples of epoxy resin formulations that illustrate how raw materials are combined to tailor a formulation to a specific application. It concludes with a discussion on general guidelines for the safe handling of epoxy resins and their associated products.