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Soldered joints

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Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001479
EISBN: 978-1-62708-173-3
...Abstract Abstract Before the quality of a soldered joint can be evaluated, the components that are required for the formation of a good soldered joint should be reviewed. These components are solder, applied heat, and solderable surface. This article discusses each of these as well as the end...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0003831
EISBN: 978-1-62708-183-2
...Abstract Abstract Corrosion is often thought of as rusting, the process of deterioration undergone by a metal when it is exposed to air or water. This article provides the fundamentals of joints corrosion and primarily addresses the various forms of corrosion observed in brazed and soldered...
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Published: 01 January 1996
Fig. 25 Multiple-sample log normal probability plots of solder joints in MDS test of ceramic quad flat package. (a) Pad I; solder volumes 1 and 2. (b) Pad II; solder volumes 2 and 3. (c) Pad III, solder volumes 3 and 4. Source: Ref 1 More
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Published: 01 June 2012
Fig. 48 SEM image of broken coil wire at catheter solder joint More
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Published: 01 January 1993
Fig. 6 Shear strength of copper/56Sn-44Pb/copper solder joints as a function of joint thickness. Source: Ref 12 More
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Published: 01 January 1993
Fig. 15 Common structural solder joints More
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Published: 01 January 1993
Fig. 8 Methods that can be used to make solder joints self-jigging. Source: Ref 5 More
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Published: 30 August 2021
Fig. 5 Schematic diagram and failure modes of a solder joint. IMC, intermetallic compound; PCB, printed circuit board More
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Published: 30 August 2021
Fig. 6 Simplified one-dimensional expression of a solder joint series stiffness system More
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Published: 30 August 2021
Fig. 9 Typical head-in-pillow defect of solder joint. Source: Ref 23 . Courtesy of Springer Nature More
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Published: 30 August 2021
Fig. 11 Formation of a cold-soldered joint caused by warpage. PCB, printed circuit board; BGA, ball grid array More
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Published: 30 August 2021
Fig. 12 Void in a solder joint More
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Published: 30 August 2021
Fig. 18 Intermetallic compound brittle failure of a solder joint. PCB, printed circuit board More
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Published: 01 January 2006
Fig. 2 Tin dendrites growing between two adjacent solder joints on failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume. More
Series: ASM Handbook
Volume: 11A
Publisher: ASM International
Published: 30 August 2021
DOI: 10.31399/asm.hb.v11A.a0006827
EISBN: 978-1-62708-329-4
...Abstract Abstract Due to the recent requirement of higher integration density, solder joints are getting smaller in electronic product assemblies, which makes the joints more vulnerable to failure. Thus, the root-cause failure analysis for the solder joints becomes important to prevent failure...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001460
EISBN: 978-1-62708-173-3
.... This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing. capacitors electronic applications packaged integrated circuits resistors...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001459
EISBN: 978-1-62708-173-3
... parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters...
Series: ASM Handbook
Volume: 19
Publisher: ASM International
Published: 01 January 1996
DOI: 10.31399/asm.hb.v19.a0002413
EISBN: 978-1-62708-193-1
... to assess solder joint reliability. These include the accelerated thermal cycling test and isothermal mechanical deflection system test. accelerated thermal cycling test isothermal fatigue isothermal fatigue life isothermal fatigue testing isothermal mechanical deflection system test solder joint...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001492
EISBN: 978-1-62708-173-3
...Abstract Abstract This article describes the factors considered in the analysis of brazeability and solderability of engineering materials. These are the wetting and spreading behavior, joint mechanical properties, corrosion resistance, metallurgical considerations, and residual stress levels...
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001398
EISBN: 978-1-62708-173-3
... (Nd:YAG) laser continues to gain acceptance as a process for a number of operations requiring high-temperature injection with speed and precision. For example, in the electronics field, component soldering can be carried out one joint at a time with highly reliable results. Laser soldering uses the well...