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Published: 30 August 2021
Fig. 24 Simplified daisy chain circuit. PCB, printed circuit board; NSMD, nonsolder mask defined; ENIG, electroless nickel and immersion gold More
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Published: 01 January 2006
Fig. 24 Copper migration and corrosion on surface of failed printed circuit board More
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Published: 30 August 2021
Fig. 10 Schematic demonstration of typical cold soldering. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 11 Formation of a cold-soldered joint caused by warpage. PCB, printed circuit board; BGA, ball grid array More
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Published: 01 December 2004
Fig. 12 Scanning electron micrograph of Sn-40Pb alloy wave-soldered printed circuit board joint that was thermally cycled. Micrograph shows a typical thermal fatigue crack in the joint. The crack is at a 45° angle to the circuit lead and totally encircles it. 50× More
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Published: 01 December 2004
Fig. 13 Sn-40Pb alloy, section of a wave-soldered printed circuit board joint that was thermally cycled. Structure shows a thermal fatigue crack propagating through the tin-lead fillet. The tin-lead structure has coarsened in the highly stressed region near the crack. Etchant 7, Table 1 . 80× More
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Published: 01 August 2018
Fig. 6 Different gray-scale images of an integrated circuit (IC) module on a printed circuit board. (a) Binary. (b) 8-level gray scale. (c) 64-level gray scale. Courtesy of Cognex Cooperation More
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... Abstract This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004129
EISBN: 978-1-62708-184-9
... corrosion control aspects, such as the position of printed circuit boards (PCBs) and proper location of connectors for insertion of the PCBs. It discusses various materials and alloys considered for connectors, PCB contacts, and circuits. The article concludes with a discussion on the effects...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004173
EISBN: 978-1-62708-184-9
... whiskers. The passive electrical components include resistors, capacitors, wound components, sensors, transducers, relays, switches, connectors, printed circuit boards, and hardware. capacitors corrosion passive electrical components electrochemical metal migration fretting halide-induced...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003367
EISBN: 978-1-62708-195-5
.... It describes the processing procedures for the cyanate ester resins and provides information on properties for selected applications, such as space applications, radomes, and printed circuit boards. cyanate ester resins radomes high-temperature polyimides space applications printed circuit board...
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Published: 15 January 2021
Fig. 13 Energy-dispersive spectrometer (EDS) line scan on a polished cross at the bond interface of a solder joint for a component on a printed circuit board. A high concentration of phosphorus indicates degradation of the electroless nickel plating during subsequent gold plating More
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Published: 30 August 2021
Fig. 18 Intermetallic compound brittle failure of a solder joint. PCB, printed circuit board More
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Published: 01 January 2006
Fig. 23 Tin dendrites growing between two adjacent solder joints on failed printed circuit board More
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Published: 30 August 2021
Fig. 5 Schematic diagram and failure modes of a solder joint. IMC, intermetallic compound; PCB, printed circuit board More
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Published: 30 August 2021
Fig. 15 Solder mask defined and nonsolder mask defined pad opening configurations. PCB, printed circuit board More
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Published: 30 August 2021
Fig. 20 Schematic representation of development of thermal-cycling-induced strains in a ceramic ball grid array package. PCB, printed circuit board More
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Published: 01 January 2006
Fig. 1 Copper migration and copper corrosion by-products on surface of failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume. More
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Published: 01 January 2006
Fig. 2 Tin dendrites growing between two adjacent solder joints on failed printed circuit board. See the article “Corrosion in Passive Electrical Components” in this Volume. More
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Published: 30 August 2021
Fig. 25 Pad cratering is not associated with the trace being broken at the beginning. PCB, printed circuit board. Source: Ref 37 . © 2016 IEEE. Reprinted, with permission, from IEEE Proceedings More