Fig. 9 Penetration of the aluminum foil vapor barrier on laminated packaging. The interior of the package is back illuminated, showing the loss of aluminum foil to filiform attack. Light microscopy. 10× More

Fig. 14 Typical seven-station package equipment unit for inspecting workpieces by the water-washable fluorescent penetrant system More

Fig. 27 Typical ceramic-packaged integrated circuit showing the silicon die, which is bonded to the metallized surface More

Fig. 17 Joint between two capillary tubes of an instrument package, made by electron-beam brazing using a low-power defocused beam in a high-vacuum atmosphere Electron-beam brazing Joint type Cylindrical sleeve Filler metal (a) BCu-1 Machine capacity, kW 3 Gun type Fixed More

Fig. 33 Borescopic view through bottle clip opening into strand package made of hollow strands that carry cooling water and solid strands that carry the majority of the current. This bundle of copper strands (both hollow and solid) is brazed together into a single, consolidated strand package More

Fig. 31 Schematic illustrating use of the C-mode scanning acoustic microscopy reflection technique to evaluate the die-attach bond between the silicon die and the ceramic package of a ceramic dual in-line package integrated circuit. With this technique, the ultrasound access to the bond layer More