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Series: ASM Handbook
Volume: 2B
Publisher: ASM International
Published: 15 June 2019
DOI: 10.31399/asm.hb.v02b.a0006695
EISBN: 978-1-62708-210-5
...Abstract Abstract This datasheet provides information on composition limits, mill product specifications, fabrication characteristics, processing effects on physical and mechanical properties, and applications of packaging and general-construction alloys 5052 and 5252. aluminum alloy 5052...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... management and electronic packaging. carbon-matrix composites ceramic-matrix composites electronic packaging metal-matrix composites polymer matrix composites thermal properties A VARIETY of new advanced composite materials that provide great advantages over conventional materials for thermal...
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Published: 01 January 2003
Fig. 9 Penetration of the aluminum foil vapor barrier on laminated packaging. The interior of the package is back illuminated, showing the loss of aluminum foil to filiform attack. Light microscopy. 10× More
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Published: 01 August 2018
Fig. 14 Typical seven-station package equipment unit for inspecting workpieces by the water-washable fluorescent penetrant system More
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Published: 01 August 2018
Fig. 27 Typical ceramic-packaged integrated circuit showing the silicon die, which is bonded to the metallized surface More
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Published: 01 January 1993
Fig. 17 Joint between two capillary tubes of an instrument package, made by electron-beam brazing using a low-power defocused beam in a high-vacuum atmosphere Electron-beam brazing Joint type Cylindrical sleeve Filler metal (a) BCu-1 Machine capacity, kW 3 Gun type Fixed More
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Published: 01 January 2006
Fig. 33 Borescopic view through bottle clip opening into strand package made of hollow strands that carry cooling water and solid strands that carry the majority of the current. This bundle of copper strands (both hollow and solid) is brazed together into a single, consolidated strand package More
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Published: 01 August 2018
Fig. 31 Schematic illustrating use of the C-mode scanning acoustic microscopy reflection technique to evaluate the die-attach bond between the silicon die and the ceramic package of a ceramic dual in-line package integrated circuit. With this technique, the ultrasound access to the bond layer More
Book Chapter

By Paul T. Vianco
Series: ASM Handbook
Volume: 6
Publisher: ASM International
Published: 01 January 1993
DOI: 10.31399/asm.hb.v06.a0001401
EISBN: 978-1-62708-173-3
... the surface of the solder; molten alloy does not flow on top of the board. As the printed circuit board passes