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Published: 31 December 2017
Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems More
Image
Published: 15 December 2019
Fig. 4 Qualitative depth profiles of thin-film composite membranes. (a) Virgin membrane. (b) Sample oxidized with NaClO for 1 h. (c) Sample oxidized with NaClO for 3 h. All the isotopes were detected in positive mode except the one at m/z = 127, which was detected in negative mode. Reproduced f... More
Image
Published: 30 June 2023
Fig. 2 Thermocouple installed on a fused filament fabrication machine to monitor the extruder temperature. MEMS, microelectromechanical system. Reprinted from Ref 24 with permission of the American Society of Mechanical Engineers (ASME) More
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006379
EISBN: 978-1-62708-192-4
..., such as those in microelectromechanical systems (MEMS, or micromachines), may be statistically equivalent, but all are a little bit different in practice. This leads to the concept of an adhesion distribution for similar contacting devices instead of a single predicted value ( Ref 14 ). The time it takes...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006387
EISBN: 978-1-62708-192-4
... methods of resolving these problems. The premise is that the wear must be characterized qualitatively and quantitatively. Contact and wear occur at the nanoscale, even at the atomic level, for example, in the applications of microelectromechanical systems (MEMS) and controllable atomic removal...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003654
EISBN: 978-1-62708-182-5
.... Alternatively, a frequency domain analysis such as fast Fourier transform (FFT) or maximum entropy method (MEM) may be employed. The FFT analysis is better suited to long-term data where several transforms can be averaged, while MEM analysis is preferable for single data sets ( Ref 27 ). The power spectral...
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006658
EISBN: 978-1-62708-213-6
.... These include crystals, microelectromechanical systems (MEMS) self-actuating cantilevers, and the light lever. Because 99% of force sensors used in AFMs are light levers, this article discusses light lever AFMs. History The origin of the AFM can be found in surface profilers first developed by precision...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006435
EISBN: 978-1-62708-192-4
... K.-H. , Microstructure and Wear of Materials , Book 10, Tribology Series , Elsevier , 1987 27. Williams J.A. and Lee H.R. , Tribology of MEMS , J. Phys. D: Appl. Phys ., Vol 39 , 2006 , p 201 – 214 28. Urbakh M. and Meyer E. , The Renaissance...
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.9781627081832
EISBN: 978-1-62708-183-2
Series: ASM Handbook
Volume: 13B
Publisher: ASM International
Published: 01 January 2005
DOI: 10.31399/asm.hb.v13b.a0006540
EISBN: 978-1-62708-183-2
... resistance ? chemical reaction mdd milligrams per square decimeter Rn noise resistance $ reversible chemical reaction, does not Rp polarization resistance per day RE reference electrode; residual element; imply equal reaction rates in both directions MEM maximum entropy method = equals mg milligram rare...
Series: ASM Handbook
Volume: 13A
Publisher: ASM International
Published: 01 January 2003
DOI: 10.31399/asm.hb.v13a.a0003719
EISBN: 978-1-62708-182-5
... stress amplitude chemical activity; crack length; crystal lat- MCA multiple-crevice assembly Sc Schmidt number mdd milligrams per square decimeter per day Sm mean stress tice length along the axis MEM maximum entropy method Sr fatigue (endurance) limit; stress range b Tafel coef cient mg milligram...
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006403
EISBN: 978-1-62708-192-4
... be considered, as illustrated in a simplified manner in Fig. 3 , with tribological processes occurring on various scales. Fig. 3 Dimensions of tribological systems and triboprocesses. MEMS, microelectromechanical systems In the diagnosis of friction and wear test data, it also must be noted...
Series: ASM Handbook
Volume: 17
Publisher: ASM International
Published: 01 August 2018
DOI: 10.31399/asm.hb.v17.a0006451
EISBN: 978-1-62708-190-0
... radiation is required to increase its temperature and the more sensitive the microbolometer. These small-scale structures are often referred to as microelectromechanical systems (MEMS). Microbolometer performance can depend on many factors. The sensitivity of the microbolometer will depend on the change...
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001740
EISBN: 978-1-62708-178-8
Series: ASM Handbook
Volume: 18
Publisher: ASM International
Published: 31 December 2017
DOI: 10.31399/asm.hb.v18.a0006360
EISBN: 978-1-62708-192-4
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003480
EISBN: 978-1-62708-195-5
... packaging, composites are well suited for other packaging applications, such as optoelectronic components and microelectromechanical systems (MEMS). Both are important growth areas. Application Requirements Electronic packaging provides a number of primary functions: it provides power, transfers...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.a0004225
EISBN: 978-1-62708-184-9
... density MCA pressure burner rig FRA Food and Drug Administration IGSCC irradiation-assisted stress- mdd FRP mass; molal (solution) FSS (U.S.) IHS corrosion cracking MEM mass transport coef cient ft nite-element analysis in. integrated circuit MFL metal FTIR eld emission microscopy IP impressed current...
Series: ASM Handbook
Volume: 13C
Publisher: ASM International
Published: 01 January 2006
DOI: 10.31399/asm.hb.v13c.9781627081849
EISBN: 978-1-62708-184-9
Series: ASM Handbook
Volume: 6A
Publisher: ASM International
Published: 31 October 2011
DOI: 10.31399/asm.hb.v06a.a0005639
EISBN: 978-1-62708-174-0
... mirrors to provide beam scanning across an area, but because these are relatively high-momentum devices, they will no doubt give way to microelectromechanical systems (MEMS) or entirely solid-state methods in the future. Some examples of rapid-scan scenarios are given in a later section...
Series: ASM Handbook Archive
Volume: 11
Publisher: ASM International
Published: 01 January 2002
DOI: 10.31399/asm.hb.v11.a0003526
EISBN: 978-1-62708-180-1
...-purpose finite element applications are available in the areas of piping and pressure vessel analysis, impact analysis, and, most recently, microelectronic and microelectromechanical systems (MEMS) analysis. Pipe Stress and Pressure Vessel Analysis Piping and pressure vessel design is an area where...