1-20 of 780 Search Results for

Gold

Follow your search
Access your saved searches in your account

Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006146
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of binary alloy phase diagrams for which gold (Au) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system...
Series: ASM Handbook
Volume: 3
Publisher: ASM International
Published: 27 April 2016
DOI: 10.31399/asm.hb.v03.a0006234
EISBN: 978-1-62708-163-4
... Abstract This article is a compilation of ternary alloy phase diagrams for which gold (Au) is the first-named element in the ternary system. The diagrams are presented with element compositions in weight percent. The article includes five phase diagrams: Au-Cu-Ni boundaries of solid-state...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001253
EISBN: 978-1-62708-170-2
... Abstract Gold electroplating was invented in 1840. During the first 100 years electrodeposited gold was used primarily for its aesthetic appeal as a decorative finish. This article provides a description of the gold plating process and the electrolytes used. It discusses the decorative...
Series: ASM Handbook
Volume: 5
Publisher: ASM International
Published: 01 January 1994
DOI: 10.31399/asm.hb.v05.a0001266
EISBN: 978-1-62708-170-2
... Abstract This article focuses on the electroless gold plating technique, describing the advantages and limitations, applications, and properties of plated deposits. It also reviews process variables of the technique, including gold concentration, reducing agent, agitation, and contaminants...
Image
Published: 01 January 2003
Fig. 7 Fretting of cobalt-gold-plated copper flats in contact with solid gold in an electrical contact. (a) After 1000 cycles. (b) After 10 4 cycles. (c) After 10 5 cycles. (d) After 10 6 cycles. Source: Ref 8 More
Image
Published: 01 January 1994
Fig. 2 Thickness of gold as a function of time for an immersion electroless gold plating bath More
Image
Published: 01 January 2006
Fig. 4 Pictorial illustration of an imprint of device terminations on the gold lid of a ceramic package. The imprints are formed when the units are soaked in a sodium-hydroxide solution at an elevated temperature. More
Image
Published: 01 January 2006
Fig. 2 Corrosion of gold-plated connector along with energy-dispersive x-ray analysis elemental maps of Au, Cu, O, Ni, and Cl More
Image
Published: 01 January 2006
Fig. 14 Current-time responses between gold alloy and amalgam of the same cross-sectional areas. Short circuiting occurred for 15 s, followed by a 2 min delay before recontacting. Source: Ref 69 More
Image
Published: 01 January 2006
Fig. 30 Color change vector ΔE * for three low-gold alloys (I, Miracast; II, Sunrise; III, Tiffany) in both the as-cast (left bar for each alloy) and solutionized at 750 °C (1380 °F) (right bar for each alloy) conditions after exposure for 3 days to artificial saliva (A) or 0.5% Na 2 S More
Image
Published: 01 January 2006
Fig. 38 Anodic polarization at 0.03 V/min of silver and gold (450 fine) solders in 1% NaCl solution. Source: Ref 194 More
Image
Published: 01 January 2006
Fig. 39 SEM micrograph of a corroded (polarized to +0.5 V vs. SCE) gold solder (450 solder) in 1% NaCl. The light areas contain chlorine. Source: Ref 194 More
Image
Published: 01 December 1998
Fig. 13 Heap-leaching charcoal-adsorption process for gold ores low in silver More
Image
Published: 01 January 1986
Fig. 11 Line scan across gold particles on resolution sample often used with SEM. More
Image
Published: 01 January 1986
Fig. 12 Influence of the sample material on resolution. (a) A gold on carbon resolution sample demonstrating 3-nm (30-Å) resolution. (b) A niobium filament sample examined in the same instrument under the same conditions, but having a resolution of only 7 nm (70 Å) More
Image
Published: 01 January 1986
Fig. 8 AES peak-to-peak amplitudes as a function of primary beam energy for gold 2024 eV and 69 eV peaks. More
Image
Published: 01 January 1986
Fig. 21 Auger spectrum from a large surface area of a gold-nickel-copper metallization sample that was heated 4 h in air at 300 °C (570 °F). More
Image
Published: 01 January 1986
Fig. 22 Depth-composition profile obtained from a nickel-rich area of a gold-nickel-copper metallization surface. More
Image
Published: 01 January 1986
Fig. 23 Results of a scanning Auger microprobe study performed on a gold-plated stainless steel lead frame. (a) Secondary electron image. (b) Iron Auger image. (c) Oxygen Auger image. (d) Gold Auger image. (e) Nickel Auger image More
Image
Published: 01 January 1986
Fig. 8 Plot of the copper-gold ratio as determined using LEISS as a function of the bulk copper-gold ratio. Note the linearity of the plot. More