Search Results for Conductors (devices)

Thermal spray processes involve complete or partial melting of a feedstock material in a high-temperature flame, and propelling and depositing the material as a coating on a substrate. This article describes the properties of sprayed electronic materials, including dielectrics, conductors, and resistors, and discusses their implications and associated limitations for device applications and potential remedial measures. The article presents specific examples of electrical/electronic device applications, including electromagnetic interference/radio-frequency interference shielding, planar microwave devices, waveguide devices, sensing devices, solid oxide fuel cells, heating elements, electrodes for capacitors and other electrochemical devices.

This article provides a detailed discussion on the various devices by which cathodic protection (CP) can be applied to pipe-type power transmission cables. These devices include the resistor rectifier, isolator-surge protector, polarization cells, and field rectifiers. The article describes the interference created by stray currents on CP and associated remedial actions.

This article focuses on the design considerations and process parameters critical to the successful implantation of wave soldering on printed circuit boards. The design considerations include the through-hole technology and the surface-mount technology. The article presents information on process parameters, which can be divided into three groups: the fluxing operation, solder wave properties, and process schedule. It provides information on various solder defects.

This article presents an overview of the electric and magnetic parameters and discusses the significance of these parameters for electronic applications. It describes the components of analog and digital electronic circuits. The article reviews the augmenting technologies: magnetic and special technologies such as electrooptical.

Ceramic materials serve important insulative, capacitive, conductive, resistive, sensor, electrooptic, and magnetic functions in a wide variety of electrical and electronic circuitry. This article focuses on various applications of advanced ceramics in both electric power and electronics industry, namely, dielectric, piezoelectric, ferroelectric, sensing, magnetic and superconducting devices.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

High-frequency resistance welding (HFRW) is a process that uses high-frequency currents to concentrate the welding heat at the desired location. This article focuses on the fundamentals, advantages, limitations, and applications of HFRW. It discusses the personnel and equipment requirements as well as safety considerations necessary for the process. The article concludes with a discussion on the techniques for inspection and quality control of HFRW.

Soldering represents the primary method of attaching electronic components, such as resistors, capacitors, or packaged integrated circuits, to either printed wiring board whose defects is minimized by consideration of proper PWB design, device packages, and board assembly. This article discusses the categories that are most important to successful electronic soldering, namely, solders and fluxes selection, nature of base materials and finishes, solder joint design, and solderability testing.

High-frequency (HF) welding is a welding process in which the heat source used to melt the joining surfaces is obtained from HF alternating current (ac) resistance heating. This article discusses the advantages and disadvantages and applications of HF welding. It describes the equipment used for HF welding and the safety aspects to be considered during welding. The article concludes with a discussion on inspection and quality control.

The discovery of the high-critical-temperature oxide superconductors has accelerated the interest for superconducting applications due to its higher-temperature operation at liquid nitrogen or above and thus reduces the refrigeration and liquid helium requirement. It also permits usage of the high-critical-temperature oxides in magnets or power applications in high-current-carrying wire or tape with acceptable mechanical capability. This article discusses the powder techniques mainly based on the production of an oxide powder precursor, which is then subjected to various processing, including powder-in-tube processing, vapor deposition processing, and melt processing. It further discusses the microstructural, anisotropy and weak link influences on these processes.

Resistance soldering (RS) can be applied to electrically conductive materials that allow the passage of electric current. The process can be used for selective spot soldering of small components, for the soldering of closely placed parts on an assembly, or for heat restriction when necessary. This article explains that the RS process can be used in all soldering operations and with all solderable metals. It provides information on the applications, preassembly practices, the equipment used and the training required for soldering personnel.

This article reviews the phase diagrams, alloy with third element additions, layer growth, critical current density, and matrix materials of A15 superconductors. It describes the production methods of tape conductors (chloride deposition, and surface diffusion) and multifilamentary wires (rod process, modified jelly roll process, niobium tube process, in-situ process, powder metallurgy process, and jelly roll method). The article focuses on reaction heat treatment, which is required at the end of wire processing to convert the ductile components to the desired, but brittle, superconductor. Finally, it discusses the applications of A15 superconductors in commercial magnets, power generation, power transmission, high-energy physics, and fusion.

This article provides an overview of the classification system of coppers for conductors and for wires and cables, as well as wire rod fabrication techniques such as rolling and continuous casting. Wiredrawing and wire stranding operations, including the preparation of rod surface, drawing, production of flat rectangular wire, annealing, and coating, are discussed. The article also provides information on electrical insulation and jacketing techniques, including polymeric insulation, enamel insulation, and paper-and-oil insulation.

This article discusses the influence of the materials, design, package type, and environment on corrosion in microelectronics. It describes the common sources and mechanisms of corrosion in microelectronics, including anodic, cathodic, and electrolytic reactions resulting in uniform corrosion, galvanic corrosion, pitting corrosion, creep corrosion, dendrite growth, fretting, stress-corrosion cracking, and whisker growth. The article presents effective measures for minimizing the moisture retention in hermetic packages and/or moisture ingress in plastic packages. It concludes with information corrosion tests.

Eddy-current inspection is a nondestructive evaluation method based on the principles of electromagnetic induction. Eddy-current methods are used to identify or differentiate a wide variety of physical, structural, and metallurgical conditions in electrically conductive ferromagnetic and nonferromagnetic metals and metal parts. Giving a brief introduction on the uses of eddy-current inspection, this article discusses the operating principles and the principal operating variables encountered in eddy-current inspection, including coil impedance, electrical conductivity, magnetic permeability, lift-off and fill factors, edge effect, and skin effect. It further describes different aspects of eddy current testing such as the selection of inspection frequencies and the types and configurations of inspection coils. The article also deals with the eddy current instrumentation and the discontinuities that are detectable by eddy-current methods.

Induction heating is a combination of several interrelated physical phenomena, including heat transfer, electromagnetics, and metallurgy. This article presents a brief review of different heat transfer modes, namely, heat conduction, thermal radiation, and convection. It focuses on the specifics of induction heating and heat treating applications. The article discusses the nonlinear and interrelated nature of a particular heat transfer phenomenon, physical property, and skin effect. It also presents simple case studies and general physical laws governing different heat transfer modes. The article also discusses the basic concepts of direct current and alternating current circuits, and reviews the theory of electromagnetic fields.

Design and analysis of electrical/electronic systems and components tends to be different from the corresponding process for most mechanical and hydraulic systems. This article provides an overview of three overlapping phases followed in electrical design: functional, electrical, and physical. It also presents information on the simulation and testing carried out to evaluate the design behavior.