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2.5D packaging

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Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
..., but they are becoming smaller as well. Going forward, the ability to work without masks and stencils will be important for several reasons, including the need to move to the third dimension. This is currently achieved through a layer-by-layer application and vias for 2.5D circuit board stacks. Future demands will move...
Series: ASM Handbook
Volume: 11B
Publisher: ASM International
Published: 15 May 2022
DOI: 10.31399/asm.hb.v11B.a0006939
EISBN: 978-1-62708-395-9
... Abstract Polymer materials are key building blocks of the modern world, commonly used in packaging, automobiles, building materials, electronics, telecommunications, and many other industries. These commercial applications of polymeric materials would not be possible without the use...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003415
EISBN: 978-1-62708-195-5
.... This is in the form of a 2.5D FEM mesh of the final product. Within this mesh, the positions of the molding material (known as blanks) are defined. Blanks can be multiple, overlapping, and can be applied with predefined fiber orientation. Also a very important issue for the simulation is the properties...
Series: ASM Handbook
Volume: 24A
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.hb.v24A.a0006981
EISBN: 978-1-62708-439-0
...-dimensional array of heights (e.g., [ x , z ] datapoints) for so-called profile data or a 2D array of heights (e.g., [ x , y , z ] datapoints) for so-called areal data, with uniform spacing in the x - or x - and y -directions. Often, areal measurements are referred to as two-and-a-half dimensional (2.5D...
Series: ASM Handbook
Volume: 24A
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.hb.v24A.a0007020
EISBN: 978-1-62708-439-0
.... Unlike STL, AMF offers native support for color, materials, lattices, and entities (constellations) in a comprehensive, structured package. AMF includes the features of DXF, OBJ, PLY, VRML/X3D, and STL in their integrality. It optionally introduces the management of curved triangular patches ( Fig. 7...
Series: ASM Handbook
Volume: 24A
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.hb.v24A.a0006980
EISBN: 978-1-62708-439-0
... materials, possibly with inkless technologies; sintering in real-time without any postprocessing steps; printing multimaterial, nanocomposites, and hybrid structures by design, on demand, and in real-time; and printing 2D, 2.5D, and 3D device architectures. There is a need to develop comprehensive technical...
Series: ASM Handbook
Volume: 24A
Publisher: ASM International
Published: 30 June 2023
DOI: 10.31399/asm.hb.v24A.9781627084390
EISBN: 978-1-62708-439-0