This article is a detailed account of the advantages, disadvantages, and applications of microdispensing processes used in electronics manufacturing industries. The discussion covers various approaches to control material flow, namely time pressure, auger, positive displacement, and progressive cavity pump dispensing. The concept of valving to control starting and stopping is also discussed. The applications include printing solders in microelectronic packaging, printing to pads, printing conductive patterns for antennas, printing active circuits, printing on flexible surfaces, and structural printing.

Compression molding is the single largest primary manufacturing process used for automotive composite applications. This article provides an overview of the compression molding process. It describes the basic design, materials, and processing equipment of three main groups of composite materials, namely, glass-fiber-mat-reinforced thermoplastics, long-fiber-reinforced thermoplastics, and sheet molding compounds. The article also presents information on the application examples and market volume of compression molding.