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2.5D packaging

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Series: ASM Handbook
Volume: 24
Publisher: ASM International
Published: 15 June 2020
DOI: 10.31399/asm.hb.v24.a0006554
EISBN: 978-1-62708-290-7
..., but they are becoming smaller as well. Going forward, the ability to work without masks and stencils will be important for several reasons, including the need to move to the third dimension. This is currently achieved through a layer-by-layer application and vias for 2.5D circuit board stacks. Future demands will move...
Series: ASM Handbook
Volume: 21
Publisher: ASM International
Published: 01 January 2001
DOI: 10.31399/asm.hb.v21.a0003415
EISBN: 978-1-62708-195-5
.... This is in the form of a 2.5D FEM mesh of the final product. Within this mesh, the positions of the molding material (known as blanks) are defined. Blanks can be multiple, overlapping, and can be applied with predefined fiber orientation. Also a very important issue for the simulation is the properties...