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David M. Christie
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Theodore M. Clarke
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Optical microscopes
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Book Chapter
Photography of Fractured Parts and Fracture Surfaces
Available to PurchaseBook: Fractography
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 June 2024
DOI: 10.31399/asm.hb.v12.a0006846
EISBN: 978-1-62708-387-4
Abstract
This article provides a discussion on the following photographic equipment: point-and-shoot cameras, digital single-reflex cameras, stand-mounted digital zoom cameras, and digital microscope cameras. It presents two principal types of optical microscopes that are appropriate for visual examination of fractured parts: the stereomicroscope and the single-light-path digital microscope. The common features present on fracture surfaces are each considered separately, both in their significance and as photographic challenges. The article also presents a short note on low-magnification scanning electron microscopy and postcapture image processing.
Book: Fractography
Series: ASM Handbook
Volume: 12
Publisher: ASM International
Published: 01 June 2024
DOI: 10.31399/asm.hb.v12.a0006947
EISBN: 978-1-62708-387-4
Abstract
This article provides an overview of polymer fractography, with examples of various fracture surfaces created under diverse loading conditions. The focus is on the interpretation of polymer fracture-surface features in light of the unique viscoelastic nature of polymers. The article presents fractographic examples of three time-dependent cracking mechanisms: fatigue fracture, creep rupture, and environmental stress cracking. It details characteristic fractographic features that can be observed in optical microscopy (OM) and scanning electron microscopy (SEM).
Series: ASM Handbook
Volume: 10
Publisher: ASM International
Published: 15 December 2019
DOI: 10.31399/asm.hb.v10.a0006684
EISBN: 978-1-62708-213-6
Abstract
The reflected light microscope is the most commonly used tool to study the microstructure of metals, composites, ceramics, minerals, and polymers. For the study of the microstructure of metals and alloys, light microscopy is employed in the reflected-light mode using either bright-field illumination, dark-field illumination, polarized light illumination, or differential interference contract, generally by the Nomarski technique. This article concentrates on how to reveal microstructure properly to enable the proper identification of the phases and constituents and, if needed, measuring the amount, size, and spacing of constituents, using the light optical microscope. The discussion covers the examination of microstructures using different illumination methods and includes a comparison between light optical images and scanning electron microscopy images of microstructure.
Book: Powder Metallurgy
Series: ASM Handbook
Volume: 7
Publisher: ASM International
Published: 30 September 2015
DOI: 10.31399/asm.hb.v07.a0006102
EISBN: 978-1-62708-175-7
Abstract
Particle image analysis of metal powders can be easily performed with optical macroscopes and microscopes. This article provides examples of the particle image analysis on powders used in the powder metallurgy industry.
Book Chapter
Photography of Fractured Parts and Fracture Surfaces
Available to PurchaseBook: Fractography
Series: ASM Handbook Archive
Volume: 12
Publisher: ASM International
Published: 01 January 1987
DOI: 10.31399/asm.hb.v12.a0001833
EISBN: 978-1-62708-181-8
Abstract
This article discusses the preparation of photomacrographs of fracture surfaces. It provides useful information on the equipment used, such as view cameras, 35-mm single-lens-reflex cameras, and stereomicroscopes. The article describes the role of lenses, focusing, camera magnification, and selection of lens aperture in a microscopic system. It illustrates the lighting techniques employed in photography and highlights the use of different films. The article concludes with a list of auxiliary equipment used in fracture surface photography.
Series: ASM Handbook Archive
Volume: 10
Publisher: ASM International
Published: 01 January 1986
DOI: 10.31399/asm.hb.v10.a0001767
EISBN: 978-1-62708-178-8
Abstract
Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.