This article presents a basic overview of technology-driven advances in the imaging of primarily metallic fracture surfaces. It describes various types of microscopes, including scanning electron, dual-beam, ion source, and transmission electron microscopes, and their capabilities. It also covers other useful hardware, such as computer-aided tomography (CAT) and micro-computer-aided tomography (micro-CAT) instruments. The article introduces some of the fracture image postprocessing methods and software, including image registration or alignment, focus stacking, Z-stacking, focal plane merging, and image stitching.

The development of quantitative fractography (QF) parameters basically requires topological data of a fracture surface that can be derived from the stereological analysis of multiple projected scanning electron microscope (SEM) images; the profilometry-based techniques that measure the fracture surface profile along x-y sections of a fracture surface from metallographic sections or nondestructive techniques; and the three-dimensional reconstruction of the fracture surface topology using imaging methods such as stereo SEM imaging and confocal scanning laser microscopy. These three general methods of assessing fracture surface topology are reviewed in this article.

X-ray spectroscopy is generally accepted as the most useful ancillary technique that can be added to any scanning electron microscope (SEM), even to the point of being considered a necessity by most operators. While “stand-alone” x-ray detection systems are used less frequently in failure analysis than the more exact instrumentation employed in SEMs, the technology is advancing and is worthy of note due to its capability for nondestructive analysis and application in the field. This article begins with information on the basis of the x-ray signal. This is followed by information on the operating principles and applications of detectors for x-ray spectroscopy, namely energy-dispersive spectrometers, wavelength-dispersive spectrometers, and handheld x-ray fluorescence systems. The processes involved in x-ray analysis in the SEM and handheld x-ray fluorescence analysis are then covered. The article ends with a discussion on the applications of x-ray spectroscopy in failure analysis.

The scanning electron microscope (SEM) is one of the most versatile instruments for investigating the microscopic features of most solid materials. The SEM provides the user with an unparalleled ability to observe and quantify the surface of a sample. This article discusses the development of SEM technology and operating principles of basic systems of SEM. The basic systems covered include the electron optical column, signal detection and display equipment, and the vacuum system. The processes involved in the preparation of samples for observation using an SEM are described, and the application of SEM in fractography is discussed. The article covers the failure mechanisms of ductile failure, brittle failure, mixed-mode failure, and fatigue failure. Lastly, image dependence on microscope type and operating parameters is also discussed.

The electron backscatter diffraction (EBSD) technique has proven to be very useful in the measurement of crystallographic textures, orientation relationships between phases, and both plastic and elastic strains. This article focuses on backscatter diffraction in a scanning electron microscope and describes transmission Kikuchi diffraction. It begins with a discussion on the origins of EBSD and the collection of EBSD patterns. This is followed by sections providing information on EBSD spatial resolution and system operation of EBSD. Various factors pertinent to perform an EBSD experiment are then covered. The article further describes the processes involved in sample preparation that are critical to the success or usefulness of an EBSD experiment. It also discusses the applications of EBSD to bulk samples and the development of EBSD indexing methods.

Acrylic coatings are one of the major generic classes of organic coatings and are prevalent in both architectural and industrial applications. This article provides information on the chemistry of acrylic polymers, the methods used in their manufacture, the relationship between structure and properties when they are formulated into coatings, and how they are being used in coatings. The main discussion points are the differences between solventborne and waterborne technologies and some of the challenges in formulating and applying waterborne acrylic coatings. The article describes the mechanism of film formation of acrylic latex polymers and its effect on final coating properties. It discusses the types of waterborne acrylic latex coatings based on chemical properties and based on applications such as primers, intermediate coats, topcoats, stains, and direct-to-substrate finishes. The article concludes with a description of the advances in the development of waterborne acrylic coatings for maintenance and protective applications.

This article provides an overview of the origin of metallography. It presents information on how to select a section from a specimen and prepare it for macroscopic analysis. The article describes the macroscopic analysis of steel fracture surfaces with emphasis on ductile, brittle, and fatigue fracture with illustrations. It discusses microanalysis with a focus on the method of light microscopy and includes information of scanning electron microscope in fractography. The article also explains the characteristics of solidification, transformation, deformation structures, and discontinuities that are present in a microstructure. It concludes with information on image analysis.

The quantitative characterization of fracture surface geometry, that is, quantitative fractography, can provide useful information regarding the microstructural features and failure mechanisms that govern material fracture. This article is devoted to the fractographic techniques that are based on fracture profilometry. This is followed by a section describing the methods based on scanning electron microscope fractography. The article also addresses procedures for three-dimensional fracture surface reconstruction. In each case, sufficient methodological details, governing equations, and practical examples are provided.

The scanning electron microscopy (SEM) is one of the most versatile instruments for investigating the microstructure of metallic materials. This article highlights the development of SEM technology and describes the operation of basic systems in an SEM, including the electron optical column, signal detection and display equipment, and vacuum system. It discusses the preparation of samples for observation using an SEM and describes the application of SEM in fractography. If the surface remains unaffected and undamaged by events subsequent to the actual failure, it is often a simple matter to determine the failure mode by the use of an SEM. In cases where the surface is altered after the initial failure, the case may not be so straightforward. The article presents typical examples that illustrate these points. Image dependence on the microscope type and operating parameters is also discussed.

The purpose of fractography is to analyze fracture features and attempt to relate the topography of the fracture surface to the causes and/or basic mechanisms of fracture. This article reviews the historical development of fractography, from the early studies of fracture appearance dating back to the sixteenth century to the state-of-the-art work in electron fractography and quantitative fractography. It also describes the applications and limitations of scanning electron microscope and transmission electron microscope.

The principal objective of quantitative fractography is to express the characteristics of features in the fracture surface in quantitative terms, such as the true area, length, size, spacing, orientation, and location. This article provides a detailed account of the development of more quantitative geometrical methods for characterizing nonplanar fracture surfaces. Prominent techniques for studying fracture surfaces are based on the projected images, stereoscopic viewing, and sectioning. The article provides information on various roughness and materials-related parameters for profiles and surfaces. The applications of quantitative fractography for striation spacings, precision matching, and crack path tortuosity are also discussed.

Electron probe microanalysis (EPMA) makes it possible to combine structural and compositional analysis in one operation. This article describes the basic concepts of microanalysis and the processing of EPMA that involves the measurement of the characteristic X-rays emitted from a microscopic part of a solid specimen bombarded by a beam of accelerated electrons. It provides information on the various aspects of energy-dispersive spectrometry (EDS) and wavelength-dispersive spectrometry (WDS), and elucidates the qualitative analysis of the major constituents of EDS and WDS. The article includes information on the analog and digital compositional mapping of elemental distribution, and describes the strengths and weaknesses of WDS and EDS spectrometers in X-ray mapping. It also outlines the application of EPMA for solving various problems in materials science.

Scanning electron microscopy (SEM) has shown various significant improvements since it first became available in 1965. These improvements include enhanced resolution, dependability, ease of operation, and reduction in size and cost. This article provides a detailed account of the instrumentation and principles of SEM, broadly explaining its capabilities in resolution and depth of field imaging. It describes three additional functions of SEM, including the use of channeling patterns to evaluate the crystallographic orientation of micron-sized regions; use of backscattered detectors to reveal grain boundaries on unetched samples and domain boundaries in ferromagnetic alloys; and the use of voltage contrast, electron beam-induced currents, and cathodoluminescence for the characterization and failure analysis of semiconductor devices. The article compares the features of SEM with that of scanning Auger microscopes, and lists the applications and limitations of SEM.