This article is a compilation of binary alloy phase diagrams for which tin (Sn) is the first named element in the binary pair. The diagrams are presented with element compositions in weight percent. The atomic percent compositions are given in a secondary scale. For each binary system, a table of crystallographic data is provided that includes the composition, Pearson symbol, space group, and prototype for each phase.

This article begins with a schematic illustration of a eutectic system in which the two components of the system have the same crystal structure. Eutectic systems form when alloying additions cause a lowering of the liquidus lines from both melting points of the pure elements. The article describes the aluminum-silicon eutectic system and the lead-tin eutectic system. It discusses eutectic morphologies in terms of lamellar and fibrous eutectics, regular and irregular eutectics, and the interpretation of eutectic microstructures. The article examines the solidification of a binary alloy of exactly eutectic composition. It concludes with a discussion on terminal solid solutions.

This article contains a table that lists the density of metals and alloys. It presents information on aluminum, copper, iron, lead, magnesium, nickel, tin, titanium, and zinc, an their respective alloys. Information on wrought alloys, permanent magnet materials, precious metals, and rare earth metals is also listed.

This article presents a table that lists the linear thermal expansion of selected metals and alloys. These include aluminum, copper, iron, lead, magnesium, nickel, tin, titanium, and zinc and their alloys. Thermal expansion is presented for specific temperature ranges.

This article contains a table that lists the thermal conductivity of selected metals and alloys near room temperature. These include aluminum and aluminum alloys; copper and copper alloys; iron and iron alloys; lead and lead alloys; magnesium and magnesium alloys; nickel and nickel alloys; tin and tin alloys; titanium and titanium alloys; zinc and zinc alloys; and pure metals.

The properties of copper alloys occur in unique combinations found in no other alloy system. This article focuses on the major and minor alloying additions and their impact on the properties of copper. It describes major alloying additions, such as zinc, tin, lead, aluminum, silicon, nickel, beryllium, chromium, and iron. The article discusses minor alloying additions, including antimony, bismuth, selenium, manganese, and phosphorus. Copper alloys can be cast by many processes, including sand casting, permanent mold casting, precision casting, high-pressure die casting, and low-pressure die casting. The article provides information on the types of copper castings and tabulates the nominal chemical composition and mechanical properties of several cast alloys.

In a typical semiconductor integrated circuits (SICs) component, corrosion may be observed at the chip level and at the termination area of the lead frames that are plated with a solderable metal or alloy, such as tin and tin-lead alloys that are susceptible to corrosion. This article focuses on the key factors contributing to corrosion of electronic components, namely, chemicals (salts containing halides, sulfides, acids, and alkalis), temperature, air (polluted air), moisture, contact between dissimilar metals in a wet condition, applied potential differences, and stress. It discusses the chip corrosion and oxidation of tin and tin-lead alloys (solders) in SIC. The article also addresses the corrosion of the device terminations resulting in lead (termination) tarnishing that are caused by various factors, including galvanic corrosion, chemical residues, base metal migration and plating additives.

The corrosion processes of metals during burial are affected by environmental pollutants, other archaeological material, geography, microorganisms in the soil, vegetation, land use, soil chemistry, soil physical properties, and the presence or absence of water and air. This article discusses the key environmental variables that affect the corrosion of buried metal artifacts. These include water (including dissolved salts and gases), sulfate-reducing bacteria, pH (acidity), and potential (oxidizing or reducing capacity). The article contains tables that list some corrosion products identified on archaeological tin and pewter, lead, iron alloys, silver alloys, and copper alloys. It also discusses the corrosion problems after excavation and the techniques followed by archaeological department for conserving metal artifacts.

This article provides information on various forms of corrosion that occur in electronic packaging. Portable consumer electronic hardware which is subjected to humidity exposures is prone to condensed moisture and liquid damage. The article discusses two other corrosion-related phenomena that are found only in electronics, namely, electrochemical migration (ECM) and conductive anodic filament formation (CAF). It describes the corrosion that takes place in metals such as copper, tin, and tin-lead alloys, which are commonly used in electronic packaging. The article also discusses the corrosion of the components used in electronic assemblies.

This article describes the allotropic modification and atmospheric corrosion of pure tin. Corrosion of pure tin due to oxidation reaction, and reaction with the other gases, water, acids, bases, and other liquid media, is discussed. The article provides information on corrosion behavior on soft solders, pewter, bearing alloys, tin-copper alloys, and tin-silver alloys. It reviews the influence of corrosion on immersion tin coating, tin-cadmium alloy coatings, tin-cobalt coatings, tin-copper coatings, tin-lead coatings, tin-nickel coatings, and tin-zinc coatings. The general properties and corrosion resistance of tinplate are summarized. The article also describes the methods of corrosion testing of coatings; these include an analysis of coating thickness measurements, porosity and rust resistance testing, solderability test, and specific special tests.

This article provides a description of the classification, industrial applications, microstructures, physical, chemical, corrosion, and mechanical properties of zirconium and its alloys. It discusses the formation of oxide films and the effects of water, temperature, and pH on zirconium. The delayed hydride cracking of zirconium is also described. The article provides information on the resistance of zirconium to various types of corrosion, including pitting corrosion, crevice corrosion, intergranular corrosion, galvanic corrosion, microbiologically induced corrosion, erosion-corrosion, and fretting corrosion. The article explains the effects of tin content in zirconium and effects of fabrication on corrosion. Corrosion control measures for all types of corrosion are also highlighted. The article concludes with information on the safety precautions associated with handling of zirconium.

This article discusses the specimen preparation techniques for zinc and its alloys and zinc-coated specimens, namely, sectioning, mounting, grinding and polishing, and etching. It describes the characteristics of lead, cadmium, iron, copper, titanium, aluminum, magnesium, and tin, which are present in the microstructure of zinc alloys. The article also provides information on microexamination that helps to determine the dendrite arm spacing, as well as the grain size, grain boundaries, and grain counts.

This article describes the specimen preparation steps for tin and tin alloys, and for harder base metals which are coated with these materials with illustrations. The steps discussed include sectioning, mounting, grinding, polishing, and etching. The article provides information on etchants for tin and tin alloys in tabular form. It presents the procedure recommended for electron microscopy to determine the nature of the intermetallic compound formed by the reaction between tin or tin-lead coatings on various substrates. The article concludes with an illustration of the microstructures of tin-copper, tin-lead, tin-lead-cadmium, tin-antimony, tin-antimony-copper, tin-antimony-copper-lead, tin-silver, tin-indium, tin-zinc, and tin-zinc-copper systems.

Tin is a soft, brilliant white, low-melting metal that is most widely known and characterized in the form of coating. This article discusses the primary and secondary production of tin and explains the uses of tin in coating, namely tinplating, electroplating, and hot dip coatings. It presents a short note on pure (unalloyed) tin and uses of tin in chemicals. The article also covers the compositions and uses of tin alloys which include solders, pewter, bearing alloys, alloys for organ pipes, and fusible alloys. It goes on to discuss the other alloys containing tin including battery grid alloys, type metals, copper alloys, dental alloys, cast irons, titanium alloys, and zirconium alloys. Finally, it presents a short note on the applications of tin powder and corrosion resistance of tin.

Tin is produced from both primary and secondary sources. This article discusses the chemical compositions, production, properties, microstructure and applications of tin and tin alloys. The major tin alloys discussed here are tin-antimony-copper alloy (pewter), bearing alloy, solder alloy and other alloys containing traces of tin. Data on tin consumption in the United States is presented graphically.

Many nonferrous metals, including aluminum, nickel, copper, and others, are among the few materials that do not degrade or lose their chemical or physical properties in the recycling process. As a result, these metals can be recycled an infinite number of times. This article focuses on the recycling of nonferrous alloys, namely, aluminum, copper, magnesium, tin, lead, zinc, and titanium, providing details on the sources, consumption and classification of scrap, and the technological trends and developments in recycling.