This article discusses the solidification of a matrix alloy in cast metal matrix composites (MMCs). It begins with a discussion on the mixing techniques in reinforcement incorporation and wettability of reinforcement. It describes the solidification processes, such as stir mixing and melt infiltration, used in the synthesis of MMCs. The article also considers the fundamentals of the process and presents a computational modeling of particle/solidification front interactions in metal-ceramic systems. The article concludes with information on nanocomposites.

Soldering technology has been used in applications ranging from the packaging of integrated circuit chips to the fabrication of industrial heat exchangers and consequently in structural or electronic applications. This article provides information on various soldering parameters, including types of solder alloy in terms of selection process; selection of substrate base material; flux selection based on adequate wettability by the solder; solder joint assembly; combined substrate, solder, and flux properties; and manufacturing procedures. Each of these parameters is explored using examples of both structural and electronic applications. The article concludes with a discussion on the environmental, safety, and health issues to be considered during soldering.