Etching aluminum can be a pretreatment step for anodizing, chemical conversion coating, metal-to-rubber bonding, and a host of other processes. Chemical etching, using either alkaline or acid solutions, produces a matte finish on aluminum products. This article describes the alkaline etching and acid etching of aluminum. Alkaline etching reduces or eliminates surface scratches, nicks, extrusion die lines, and other imperfections. Acid etching can be done without heavy smut problems, particularly on aluminum die castings. Hydrochloric, hydrofluoric, nitric, phosphoric, chromic, and sulfuric acids are used in acid etching. The article presents a flow chart of the operations used in acid etching.

Metallographic analysis is primarily a collection of visual and imaging techniques that provide an insight into the background of a material or part and its behavior. Metallic specimens, both porous and pore-free, are opaque, and as a result, an optical examination must be performed on carefully prepared planar (two-dimensional) surfaces. This article discusses the preparation sequence of ferrous powders, which is normally separated into several well-defined steps: sample selection, sectioning, mounting, grinding, polishing, drying, and chemical etching and/or coating. It provides several suggestions to promote and encourage the safety of those performing metallographic preparation and analysis.

This article is a compilation of color etchants that have been developed for a limited number of metals and alloys. It describes the optical methods for producing color, such as polarized light and differential interference contrast, with illustrations. The article discusses film formation and interference techniques such as anodizing, chemical etching, and tint etching. It provides a description of reagents that deposit sulfide films and molybdate films. The article concludes with a discussion on the thermal and vapor deposition methods to produce color.

Chemical-mechanical planarization (CMP) of metals is described as mechanically accelerated corrosion, erosion corrosion, or metallic corrosion enhanced by wear. This article reviews the history, process, chemistry, electrochemistry, and defect issues for CMP. It provides an overview of CMP through a schematic illustration of CMP process equipment. The applications of CMP to tungsten and copper alloys are of prime interest in the semiconductor industry. The article discusses copper CMP and tungsten CMP in detail and analyzes polishing mechanism during CMP by application of direct current potentiodynamic polarization and alternating current impedance measurements. It concludes with information on chemically induced defects such as pitting corrosion, galvanic corrosion, and chemical etching.

Aluminum or aluminum alloy products have various types of finishes applied to their surfaces to enhance appearance or improve functional properties. This article discusses the procedures, considerations, and applications of various methods employed in the cleaning, finishing, and coating of aluminum. These include abrasive blast cleaning, barrel finishing, polishing, buffing, satin finishing, chemical cleaning, chemical brightening, electrolytic brightening, chemical etching, alkaline etching, acid etching, chemical conversion coating, electroplating, immersion plating, electroless plating, porcelain enameling, and shot peening.